Wisenstech Inc. Patent applications |
Patent application number | Title | Published |
20140318960 | MICROMACHINED OXYGEN SENSOR AND METHOD OF MAKING THE SAME - The design and manufacture method of an oxygen concentration sensor made with silicon micromachining (a.k.a. MEMS, Micro Electro Mechanical Systems) process for applications of oxygen measurement with fast response time and low power consumption is disclosed in the present invention. The said silicon oxygen concentration sensor operates with an yttrium stabilized zirconia oxide amperometric cell supported on a membrane made of silicon nitride with a heat isolation cavity underneath or a silicon nitride membrane with silicon plug for mechanical strength enforcement. | 10-30-2014 |
20140283595 | MICROMACHINED MASS FLOW SENSOR WITH CONDENSATION PREVENTION AND METHOD OF MAKING THE SAME - The design and manufacture method of a silicon mass flow sensor made with silicon Micromachining MEMS, Micro Electro Mechanical Systems) process for applications of gas flow measurement with highly humidified or liquid vapors is disclosed in the present invention. The said silicon mass flow sensor operates with an embedded heater and an adjacent control temperature sensor beneath the integrated calorimetric and thermal dissipative sensing thermistors. When the condensation takes place at the surface of the said silicon mass flow sensor, the embedded heater shall be turned on to elevate the temperature of the supporting membrane or substrate for the sensing thermistors. The elevated temperature shall be adjusted to above the vaporization temperature with the feedback data of the adjacent temperature sensor such that the surface condensation due to the presence of the liquid vapors in a gas flow can be effectively eliminated. | 09-25-2014 |
20140268440 | Micromachined High Breakdown Voltage ESD Protection Device for Light Emitting Diode and Method of Making the Same - This invention relates to a micromachined ESD protection device and its microfabrication method for light emitting diode (LEDs) chips. The LEDs is coupled to the ESD protection device in a shunt connection to absorb and eliminate the electrostatic charges induced by human contact or other voltage spike sources. The ESD protection circuit can prevent the LED from burning down and extend its lifespan. By using a thick polyimide layer as the dielectric film for capacitors in the micromachined ESD protection device at the current invention has the advantages with high breakdown voltage compared to other ESD protection circuits. And furthermore, the device in the current invention is easy for mass production with low manufacturing cost. Another embodiment of the present invention is that the multiple-array arrangement in current micromachined ESD protection device could greatly enhance the liability due to multiple-protection and thus to provide the possibility of multiple-times usage. | 09-18-2014 |