| WINTEC INDUSTRIES, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110241708 | APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM - An apparatus for placement of a component onto a target platform includes a multiple-sensor probe adapted to sense a relative position of one or more reference marks or one or more alignment marks with respect to the multiple-sensor probe. The component includes one or more alignment marks, the target platform includes one or more reference marks, and the multiple-sensor probe includes a multitude of sensors. A first multitude of latches is adapted to record a size of the reference mark, and a relative position of the reference mark with respect to the probe to facilitate alignment of the probe to the reference mark. A second multitude of latches is adapted to record an instantaneous positional relationship between the alignment mark and the aligned probe to facilitate alignment of the component to the aligned probe. The first and second multitude of latches is coupled to the multitude of sensors. | 10-06-2011 |
| 20110164951 | APPARATUS AND METHOD FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM - The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly. | 07-07-2011 |
| 20110085311 | Apparatus and Method for Vertically-Structured Passive Components - A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications. | 04-14-2011 |
| 20110069463 | Method of Using Conductive Elastomer for Electrical Contacts in an Assembly - A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device. | 03-24-2011 |
