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Winchester Electronics Corporation

Winchester Electronics Corporation Patent applications
Patent application numberTitlePublished
20110269327MODULAR CONNECTOR SYSTEM - The present invention provides a modular connector system for, in some embodiments, interconnecting circuit boards. In some embodiments, the modular connector system includes a header assembly for blind mating with an adapter assembly.11-03-2011
20110217871MODULAR INTERCONNECT APPARATUS - The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.09-08-2011
20100202730FIBER OPTIC JACK AND CONNECTOR - The present invention provides a fiber optic jack for routing optical signals. In another aspect, the present invention provides a fiber optic connector with accurate alignment that may be used with, among other things, the fiber optic jack08-12-2010
20100062638MODULAR INTERCONNECT APPARATUS - The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.03-11-2010
20090093138MODULAR INTERCONNECT APPARATUS - The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.04-09-2009

Patent applications by Winchester Electronics Corporation