WATLOW ELECTRIC MANUFACTURING COMPANY Patent applications |
Patent application number | Title | Published |
20160118277 | HIGH DEFINITION HEATER AND METHOD OF OPERATION - A heater system is provided that includes a base functional layer having at least one functional zone. A substrate is secured to the functional member, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer provides lower power than the base functional layer. A component is secured to the tuning layer opposite the substrate, and the substrate defines a thermal conductivity to absorb and dissipate a requisite amount of power from the base functional layer. A control system is also provided that has a plurality of addressable control elements in electrical communication with power lines and with the tuning layer, the control elements providing selective control of the tuning layer zones. | 04-28-2016 |
20160118276 | HIGH DEFINITION HEATER AND METHOD OF OPERATION - An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer. | 04-28-2016 |
20160116347 | RAPID RESPONSE SENSOR HOUSING - A sensor assembly is provided that includes a housing having a unitary body with a proximal end portion and a distal end portion. The distal end portion is open and defines an internal cavity exposed to an outside environment, and the proximal end portion defines a plurality of internal passageways that extend and open into the internal cavity. A thin film resistive temperature device (RTD), or other micro-sensor, is disposed within the internal cavity, the thin film RTD having a plurality of lead wires that extend through the plurality of internal passageways, and the thin film RTD being in contact with at least one wall of the internal cavity. The thin film RTD and the lead wires are secured within the housing by a thermal adhesive having a matched coefficient of thermal expansion with that of the housing and the thin film RTD substrate. | 04-28-2016 |
20160035602 | METHOD OF FORMING A COMPOSITE SUBSTRATE FOR LAYERED HEATERS - A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater having at least one functional layer to the heater substrate after the heater substrate is secured to the application substrate. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer. The material of the functional layer is not capable of withstanding the elevated temperature of the thermal securing step. | 02-04-2016 |
20150153293 | THERMOGRAPHIC INSPECTION SYSTEM - A thermographic inspection system includes a heat source configured to be removably attached to an exterior surface of an object. A thermal imaging device obtains a thermal image of the object, and an analyzing device determines a location of a defect in the object based on the thermal image. | 06-04-2015 |
20150055940 | THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS - A heater system includes a heater assembly, an imaging device and a control system. The heater assembly includes a plurality of heating zones. The imaging device acquires an image of the heater assembly. The control system determines variations in the plurality of heating zones based on the thermal image. | 02-26-2015 |
20140341563 | PROCESS CONTROLLER WITH INTEGRATED OPTICAL SENSING - The present disclosure relates generally to a process controller and more specifically to a process controller with integrated optical sensing. | 11-20-2014 |
20140190151 | EXHUAST GAS HEATING APPARATUS - A heating apparatus and method for use in an exhaust gas system is provided that includes a container body defining an exhaust gas pathway, a heater flange component attached to an exterior of the container body, and a heater assembly disposed in the exhaust gas pathway and secured to the heater flange component. The heater assembly includes at least one heater element, a bracket assembly that secures the at least one heater element in the container body, and a conformal bracket for securing the at least one heater element to the bracket assembly. | 07-10-2014 |
20140014265 | REDUCED CYCLE TIME MANUFACTURING PROCESSES FOR THICK FILM RESISTIVE DEVICES - A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time. A resistive layer is formed on the dielectric layer after the dielectric tape is laminated to the substrate. A protective layer is formed over the resistive layer. | 01-16-2014 |
20140007416 | COMPOSITE SUBSTRATE FOR LAYERED HEATERS - A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater to the heater substrate after the heater substrate is secured to the application substrate. The application of the layered heater includes applying a first dielectric layer onto the heater substrate, applying a resistive heating layer onto the first dielectric layer, and applying a second dielectric layer onto the resistive heating layer. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of at least one of the first dielectric layer and a coefficient of thermal expansion of the resistive heating layer. | 01-09-2014 |
20130329767 | CARGO MONITORING SENSOR WITH HANDLE - A temperature sensor assembly is provided that includes a handle defining an internal cavity, and a probe secured to the handle and extending distally therefrom. The probe includes a sheath, a thermistor disposed within the sheath and defining a pair of wires and a bead formed at a distal end portion of the pair of wires. An electrical noise suppression device is disposed within the internal cavity of the handle and is electrically connected to the pair of thermistor wires. A set of lead wires is secured to a proximal end portion of the handle and are electrically connected to the electrical noise suppression device. An adhesive lined heat shrink tubing extends from around the bead of the thermistor, around the pair of thermistor wires, around the electrical noise suppression device, and to around at least a portion of the lead wires. | 12-12-2013 |
20130327762 | ADAPTABLE LAYERED HEATER SYSTEM - A layered heater is provided that comprises at least one resistive layer defining a circuit configuration, the circuit configuration comprising at least one resistive trace oriented relative to a heating target and comprising a material having temperature coefficient characteristics such that the resistive trace provides power commensurate with demands of the heating target In one form, resistive traces of the resistive layer are an NTC material having a relatively high BETA coefficient and are oriented approximately parallel to a primary heating direction. | 12-12-2013 |
20130319494 | SPECIALITY JUNCTION THERMOCOUPLE FOR USE IN HIGH TEMPERATURE AND CORROSIVE ENVIRONMENT - A thermocouple includes a first thermocouple wire defining a distal end portion, and a second thermocouple wire defining a distal end portion. A hot junction is formed between the distal end portions of the first and second thermocouple wires. The hot junction defines a splice such that the first thermocouple wire and the second thermocouple wire are in direct contact at their distal end portions. A refractory coating is applied over the hot junction. | 12-05-2013 |
20130313246 | VARIABLE PITCH RESISTANCE COIL HEATER - A heater is provided that includes a resistance coil assembly defining a first end portion having a first conducting pin and a second end portion having a second conducting pin, and a resistance coil disposed between the first end portion and the second end portion, the resistance coil defining a plurality of different pitches between the first end portion and the second end portion. An insulating material surrounds the resistance coil assembly, and a sheath surrounds the insulating material. The plurality of different pitches provide a variable watt density such that a predetermined temperature profile is provided along the sheath. | 11-28-2013 |
20130260048 | METHOD FOR THE PRODUCTION OF AN ELECTRICALLY CONDUCTIVE RESISTIVE LAYER AND HEATING AND/OR COOLING DEVICE - An electrically conductive resistive layer is produced by thermally spraying an electrically conductive material onto the surface of a non-conductive substrate. Initially, the material layer arising therefrom has no desired shape. The material layer is then removed in certain areas so that an electrically conductive resistive layer having said desired shape is produced. | 10-03-2013 |
20130248511 | TEMPERATURE DETECTION AND CONTROL SYSTEM FOR LAYERED HEATERS - A system for detecting and controlling temperature of a layered heater is provided that includes a layered heater having in one form a substrate, a first dielectric layer disposed on the substrate, a sensor layer disposed on the first dielectric layer, a second dielectric layer disposed on the sensor layer, a resistive heating layer disposed on the second dielectric layer, and a third dielectric layer disposed on the resistive heating layer. An overtemperature detection circuit is provided in one form that is operatively connected to the resistive heating layer. The circuit includes a resistor, the sensor layer, and an electromechanical relay in parallel with the sensor layer. The sensor layer defines a material having a relatively high TCR and the resistive heating layer defines a material having a relatively low TCR such that a response time of the control system is relatively fast. | 09-26-2013 |
20130228548 | METHOD OF MANUFACTURING A HIGH DEFINITION HEATER SYSTEM - Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed. | 09-05-2013 |
20130213010 | Electric Heating Assisted Passive and Active Regeneration for Efficient Emission Controls of Diesel Engines - A method of heating an exhaust gas in an exhaust aftertreatment system including a Diesel Oxidation Catalyst (DOC) and a diesel particulate filter (DPF) is provided. The method includes heating the exhaust gas to a predetermined temperature to increase NO | 08-22-2013 |
20130161305 | HIGH DEFINITION HEATER AND METHOD OF OPERATION - An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer. | 06-27-2013 |
20130154143 | HIGH DYNAMIC TEMPERATURE CONTROL SYSTEM - A heating/cooling module for a molding system includes a mold surface forming a part of a mold cavity. A cooling unit is disposed adjacent to the mold surface for cooling the mold surface. A layered heater is disposed adjacent to the mold surface for heating the mold surface. | 06-20-2013 |
20130152383 | MOISTURE RESISTANT LAYERED SLEEVE HEATER AND METHOD OF MANUFACTURE THEREOF - A method of forming a layered heater assembly includes: forming a plurality of layers onto a substrate, the plurality of layers including a resistive element layer; forming electrical terminations in contact with the resistive element layer; securing a protective cover over the layers using a laser welding process, wherein edges of the protective cover are welded circumferentially around raised end portions of the substrate and welded longitudinally along a slotted portion of the substrate; securing a pair of lead wires to the electrical terminations; and securing a lead cap assembly around the pair of lead wires and to the protective cover using a laser welding process. | 06-20-2013 |
20130146584 | MOISTURE RESISTANT LAYERED SLEEVE HEATER AND METHOD OF MANUFACTURE THEREOF - A heater assembly is provided that includes a substrate having opposed end portions defining raised flanges, a slot extending between the opposed end portions, and opposed chamfered surfaces extending along the slot and across the raised flanges. A plurality of layers are disposed onto the substrate, along with a pair of terminal pads. A protective cover defining at least one aperture is disposed over the layers and is secured to the raised flanges and the opposed chamfered surfaces of the substrate, and the aperture is disposed proximate the terminal pads. A pair of lead wires is secured to the pair of terminal pads, and a lead cap assembly is disposed around the pair of lead wires and is secured to the protective cover. | 06-13-2013 |
20130105465 | SYSTEM AND METHOD FOR CONTROLLING A THERMAL ARRAY | 05-02-2013 |
20130105463 | SYSTEM AND METHOD FOR CONTROLLING A THERMAL ARRAY | 05-02-2013 |
20130105462 | THERMAL ARRAY SYSTEM | 05-02-2013 |
20130105457 | THERMAL ARRAY SYSTEM | 05-02-2013 |
20130098895 | THERMAL ARRAY SYSTEM - A thermal array system is provided. The thermal array system having each thermal element connected between a first power node and a second power node of the plurality of power nodes and each thermal element being connected in electrical series with an addressable switch configured to activate and deactivate the thermal element. | 04-25-2013 |
20130068754 | VARIABLE WATT DENSITY LAYERED HEATER - A layered heater is provided that includes at least one resistive layer having a resistive circuit pattern, the resistive circuit pattern defining a length, a width, and a thickness, wherein the thickness varies along the length of the resistive circuit pattern and/or the width of the resistive circuit pattern for a variable watt density. The present disclosure also provides layered heaters having a resistive circuit pattern with a variable thickness along with a variable width and/or spacing of the resistive circuit pattern in order to produce a variable watt density. | 03-21-2013 |
20130020312 | SMART LAYERED HEATER SURFACES - A heater system and related methods of heating a surface are provided by the present disclosure that includes, in one form, a substrate defining a heating surface and a layered heater formed on the heating surface. A plurality of nodes are disposed along the heating surface and are in electrical contact with a resistive heating layer of the layered heater, along with a plurality of lead wires connected to the plurality of nodes. In one form, a multiplexer is in communication with the plurality of nodes through the plurality of lead wires, and a controller is in communication with the multiplexer, wherein the multiplexer sequences and transmits resistances from the plurality of nodes to the controller, and the controller controls an amount of power provided to each of the plurality of nodes based on the differences in resistances between the nodes. | 01-24-2013 |
20120292308 | TWO-WIRE LAYERED HEATER SYSTEM - A heater is provided that includes a resistive layer formed by a layered process (e.g., thick film, thin film, thermal spray, and sol-gel) and two electrical lead wires connected to the resistive layer. The resistive layer has sufficient temperature coefficient of resistance characteristics such that the resistive layer is a heater element and a sensor, and the resistive layer is in communication with a two-wire controller through the two electrical lead wires. Preferably, the sensor is a temperature sensor, and the heater includes additional layers formed by layered processes. | 11-22-2012 |
20120235655 | VOLTAGE CONTROLLING CIRCUIT - A voltage controlling circuit with power sharing components is provided. The circuit includes a voltage regulator for controlling an output voltage for a load and a device in communication with the voltage regulator for power sharing. | 09-20-2012 |
20120186334 | COMBINATION FLUID SENSOR SYSTEM - An apparatus for determining and controlling characteristics of a fluid is provided that includes a substrate, a heating circuit, and a sensing circuit applied on the substrate by a layered process. A control module is in communication with the heating circuit and the sensing circuit for determining, for example, type, concentration, liquid level, and temperature of the fluid, which in one form is a urea solution. | 07-26-2012 |
20120103958 | FLOW THROUGH HEATER - An electrical heating device for medical equipment is provided. The heating device includes a body, which may be an insulating body forming a channel therethrough for fluid travel, an insulating material surrounding the body, and a heater surrounding the body and the insulating material. In other forms, the electrical heating device for medical equipment has a conducting body, instead of an insulating body, forming a channel therethrough for fluid travel. A base dielectric layer is disposed on the conducting body, and a heater surrounds the base dielectric layer and the conducting body. A top dielectric layer is disposed on the heater, and a protection housing surrounds the top dielectric layer. | 05-03-2012 |
20110297668 | INDUCTIVE HEATER HUMIDIFIER - An inductive heater humidifier for heating fluids is provided by the present disclosure. The humidifier includes a reservoir having a ferromagnetic bottom plate. The reservoir is disposed on top of a non-metallic cover plate, which rests on a topless ferrite base. The ferrite base includes induction coil for generating heat. The induction coil is energized to produce eddy currents that generate heat, which is convectively transferred to the reservoir via the bottom plate to heat fluid in the reservoir. | 12-08-2011 |
20110265315 | LAYERED HEATER SYSTEM HAVING CONDUCTIVE OVERLAYS - A method of forming a layered heater includes forming a continuous resistive layer over a substrate, forming conductive overlays in predetermined areas of the resistive layer, and removing portions of the continuous resistive layer between the conductive overlays to form a plurality of single cuts extending between the conductive overlays. The single cuts extend through the continuous resistive layer between the conductive overlays and longitudinally into a portion of the corresponding conductive overlays. Preferably, the single cuts are formed using a laser. | 11-03-2011 |
20110205682 | HYBRID POWER RELAY USING COMMUNICATIONS LINK - A control circuit for controlling an arc suppression circuit includes a serial communication link communicating a serial signal therethrough. The control circuit includes a microprocessor having a serial input communicating with the serial communication link. The microprocessor generates a control output signal in response to the serial signal. The control circuit further includes the arc suppression circuit having an electrical contact and operating in response to the control output signal to reduce an arc at the electrical contact. | 08-25-2011 |
20100319186 | METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM - A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform. | 12-23-2010 |
20100154203 | METHODS OF MAKING CERAMIC HEATERS WITH POWER TERMINALS - A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer. | 06-24-2010 |
20090272732 | MODULAR LAYERED HEATER SYSTEM - A heater system is provided that comprises a plurality of layered heater modules, each module comprising a plurality of resistive zones. The layered heater modules are disposed adjacent one another to form the heater system, which can be adapted for a multitude of different sizes of heating targets. Preferably, the resistive zones comprise a plurality of resistive traces arranged in a parallel circuit and oriented approximately perpendicular to a primary heating direction, wherein the resistive traces comprise a positive temperature coefficient material having a relatively high TCR. The resistive traces are responsive to the heating target power gradient such that the resistive traces output additional power proximate a higher heat sink and less power proximate a lower heat sink along the primary heating direction. | 11-05-2009 |
20090250173 | METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM - An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate. | 10-08-2009 |
20090236327 | LAYERED HEATER SYSTEM WITH HONEYCOMB CORE STRUCTURE - A layered heater system is provided that includes an engineered substrate having an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet. A dielectric layer is formed on at least one of the upper face sheet and the lower face sheet, a resistive element layer is formed on the dielectric layer, a protective layer is formed on the resistive element layer, and terminal pads are formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer. In one form, the core defines a honeycomb structure, and in another, the core defines a frame structure having a plurality of support ribs. | 09-24-2009 |
20090127244 | MOISTURE RESISTANT LAYERED SLEEVE HEATER AND METHOD OF MANUFACTURING THEREOF - A heater assembly is provided that includes a substrate having opposed end portions defining raised flanges, a slot extending between the opposed end portions, and opposed chamfered surfaces extending along the slot and across the raised flanges. In one form, a plurality of layers are disposed onto the substrate, along with a pair of terminal pads. A protective cover defining at least one aperture is disposed over the layers and is secured to the raised flanges and the opposed chamfered surfaces of the substrate, and the aperture is disposed proximate the terminal pads. A pair of lead wires is secured to the pair of terminal pads, and a lead cap assembly is disposed around the pair of lead wires and is secured to the protective cover. Methods of manufacturing the heater assembly are also provided in accordance with the present disclosure. | 05-21-2009 |
20090024348 | SYSTEM AND METHOD OF COMPENSATING FOR DEVICE MOUNTING AND THERMAL TRANSFER ERRORS - A method of compensating a temperature measurement of a thermal device in a user environment as a function of a thermal transfer of the thermal device in a temperature measurement system. The method includes inputting thermal transfer parameters associated with heat transfer characteristics of the thermal device stored by a thermal transfer indicia. The method further includes measuring a signal of the thermal device during the temperature measurement and compensating the measured thermal device signal as a function of the thermal transfer function based on one of a plurality of predetermined specific thermal environments and one of a plurality of predetermined specific thermal errors associated with the thermal device. | 01-22-2009 |
20090021342 | Thick Film Layered Resistive Device Employing a Dielectric Tape - A resistive device for use in providing a resistive load to a target under the application of power from a power source is provided, the resistive device being adapted for electrical connection to the power source through a pair of terminal wires. The resistive device includes a thick film material, and the thick film material defines at least one layer of tape. The resistive device can be, by way of example, a heater or a load resistor, and can also include a substrate onto which a layer of dielectric tape is disposed, a resistive layer disposed on the layer of dielectric tape, and a protective layer disposed on the resistive layer. | 01-22-2009 |
20090020905 | Reduced Cycle Time Manufacturing Processes for Thick Film Resistive Devices - A process of forming a resistive device such as s load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer. | 01-22-2009 |
20090016707 | MODULAR HEATER SYSTEM - A heater system is provided that includes a plurality of carrier members, each carrier member defining an inner periphery surface, an outer receiving portion, and connecting portions. A plurality of resistive heating elements are disposed within the outer receiving portions of the carrier members, and end fittings are disposed proximate the carrier members and the resistive heating elements. A cover is disposed around the carrier members and the resistive heating elements, and the inner periphery surfaces of the carrier members are adapted to transfer heat to a target and the connecting portions are adapted to be secured to at least one of an adjacent carrier member and a heating target. In one form, at least one set of a carrier member and a resistive heating element are resiliency movable such that the heater system provides tactile feedback to an installer that the heater system is properly installed around a target. | 01-15-2009 |
20080266810 | Heat management system for a power switching device - A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion. | 10-30-2008 |
20080266742 | Apparatus and method for increasing switching life of electromechanical contacts in a hybrid power switching device - A circuit and related methods for use in a hybrid power switching device are provided that include at least one electromechanical relay having a coil and a contact, the electromechanical relay defining a release time and a sticking time during an on-to-off transition. At least one solid state switch is electrically connected to the contact, and a timing circuit is electrically connected to the electromechanical relay and the solid state switch. The timing circuit includes a capacitor electrically connected to a control signal input and at least one resistor electrically connected to the capacitor and to the solid state switch, wherein the capacitor and the resistor are sized such that the capacitor discharges through the resistor to activate the solid state switch for a period of time that is longer than the electromechanical relay release time and sticking time. | 10-30-2008 |