| WATLOW ELECTRIC MANUFACTURING COMPANY Patent applications |
| Patent application number | Title | Published |
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| 20120103958 | FLOW THROUGH HEATER - An electrical heating device for medical equipment is provided. The heating device includes a body, which may be an insulating body forming a channel therethrough for fluid travel, an insulating material surrounding the body, and a heater surrounding the body and the insulating material. In other forms, the electrical heating device for medical equipment has a conducting body, instead of an insulating body, forming a channel therethrough for fluid travel. A base dielectric layer is disposed on the conducting body, and a heater surrounds the base dielectric layer and the conducting body. A top dielectric layer is disposed on the heater, and a protection housing surrounds the top dielectric layer. | 05-03-2012 |
| 20110297668 | INDUCTIVE HEATER HUMIDIFIER - An inductive heater humidifier for heating fluids is provided by the present disclosure. The humidifier includes a reservoir having a ferromagnetic bottom plate. The reservoir is disposed on top of a non-metallic cover plate, which rests on a topless ferrite base. The ferrite base includes induction coil for generating heat. The induction coil is energized to produce eddy currents that generate heat, which is convectively transferred to the reservoir via the bottom plate to heat fluid in the reservoir. | 12-08-2011 |
| 20110265315 | LAYERED HEATER SYSTEM HAVING CONDUCTIVE OVERLAYS - A method of forming a layered heater includes forming a continuous resistive layer over a substrate, forming conductive overlays in predetermined areas of the resistive layer, and removing portions of the continuous resistive layer between the conductive overlays to form a plurality of single cuts extending between the conductive overlays. The single cuts extend through the continuous resistive layer between the conductive overlays and longitudinally into a portion of the corresponding conductive overlays. Preferably, the single cuts are formed using a laser. | 11-03-2011 |
| 20110205682 | HYBRID POWER RELAY USING COMMUNICATIONS LINK - A control circuit for controlling an arc suppression circuit includes a serial communication link communicating a serial signal therethrough. The control circuit includes a microprocessor having a serial input communicating with the serial communication link. The microprocessor generates a control output signal in response to the serial signal. The control circuit further includes the arc suppression circuit having an electrical contact and operating in response to the control output signal to reduce an arc at the electrical contact. | 08-25-2011 |
| 20100319186 | METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM - A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform. | 12-23-2010 |
| 20100154203 | METHODS OF MAKING CERAMIC HEATERS WITH POWER TERMINALS - A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer. | 06-24-2010 |
| 20090272732 | MODULAR LAYERED HEATER SYSTEM - A heater system is provided that comprises a plurality of layered heater modules, each module comprising a plurality of resistive zones. The layered heater modules are disposed adjacent one another to form the heater system, which can be adapted for a multitude of different sizes of heating targets. Preferably, the resistive zones comprise a plurality of resistive traces arranged in a parallel circuit and oriented approximately perpendicular to a primary heating direction, wherein the resistive traces comprise a positive temperature coefficient material having a relatively high TCR. The resistive traces are responsive to the heating target power gradient such that the resistive traces output additional power proximate a higher heat sink and less power proximate a lower heat sink along the primary heating direction. | 11-05-2009 |
| 20090250173 | METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM - An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate. | 10-08-2009 |
| 20090236327 | LAYERED HEATER SYSTEM WITH HONEYCOMB CORE STRUCTURE - A layered heater system is provided that includes an engineered substrate having an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet. A dielectric layer is formed on at least one of the upper face sheet and the lower face sheet, a resistive element layer is formed on the dielectric layer, a protective layer is formed on the resistive element layer, and terminal pads are formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer. In one form, the core defines a honeycomb structure, and in another, the core defines a frame structure having a plurality of support ribs. | 09-24-2009 |
| 20090127244 | MOISTURE RESISTANT LAYERED SLEEVE HEATER AND METHOD OF MANUFACTURING THEREOF - A heater assembly is provided that includes a substrate having opposed end portions defining raised flanges, a slot extending between the opposed end portions, and opposed chamfered surfaces extending along the slot and across the raised flanges. In one form, a plurality of layers are disposed onto the substrate, along with a pair of terminal pads. A protective cover defining at least one aperture is disposed over the layers and is secured to the raised flanges and the opposed chamfered surfaces of the substrate, and the aperture is disposed proximate the terminal pads. A pair of lead wires is secured to the pair of terminal pads, and a lead cap assembly is disposed around the pair of lead wires and is secured to the protective cover. Methods of manufacturing the heater assembly are also provided in accordance with the present disclosure. | 05-21-2009 |
| 20090024348 | SYSTEM AND METHOD OF COMPENSATING FOR DEVICE MOUNTING AND THERMAL TRANSFER ERRORS - A method of compensating a temperature measurement of a thermal device in a user environment as a function of a thermal transfer of the thermal device in a temperature measurement system. The method includes inputting thermal transfer parameters associated with heat transfer characteristics of the thermal device stored by a thermal transfer indicia. The method further includes measuring a signal of the thermal device during the temperature measurement and compensating the measured thermal device signal as a function of the thermal transfer function based on one of a plurality of predetermined specific thermal environments and one of a plurality of predetermined specific thermal errors associated with the thermal device. | 01-22-2009 |
| 20090021342 | Thick Film Layered Resistive Device Employing a Dielectric Tape - A resistive device for use in providing a resistive load to a target under the application of power from a power source is provided, the resistive device being adapted for electrical connection to the power source through a pair of terminal wires. The resistive device includes a thick film material, and the thick film material defines at least one layer of tape. The resistive device can be, by way of example, a heater or a load resistor, and can also include a substrate onto which a layer of dielectric tape is disposed, a resistive layer disposed on the layer of dielectric tape, and a protective layer disposed on the resistive layer. | 01-22-2009 |
| 20090020905 | Reduced Cycle Time Manufacturing Processes for Thick Film Resistive Devices - A process of forming a resistive device such as s load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer. | 01-22-2009 |
| 20090016707 | MODULAR HEATER SYSTEM - A heater system is provided that includes a plurality of carrier members, each carrier member defining an inner periphery surface, an outer receiving portion, and connecting portions. A plurality of resistive heating elements are disposed within the outer receiving portions of the carrier members, and end fittings are disposed proximate the carrier members and the resistive heating elements. A cover is disposed around the carrier members and the resistive heating elements, and the inner periphery surfaces of the carrier members are adapted to transfer heat to a target and the connecting portions are adapted to be secured to at least one of an adjacent carrier member and a heating target. In one form, at least one set of a carrier member and a resistive heating element are resiliency movable such that the heater system provides tactile feedback to an installer that the heater system is properly installed around a target. | 01-15-2009 |
| 20080266810 | Heat management system for a power switching device - A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion. | 10-30-2008 |
| 20080266742 | Apparatus and method for increasing switching life of electromechanical contacts in a hybrid power switching device - A circuit and related methods for use in a hybrid power switching device are provided that include at least one electromechanical relay having a coil and a contact, the electromechanical relay defining a release time and a sticking time during an on-to-off transition. At least one solid state switch is electrically connected to the contact, and a timing circuit is electrically connected to the electromechanical relay and the solid state switch. The timing circuit includes a capacitor electrically connected to a control signal input and at least one resistor electrically connected to the capacitor and to the solid state switch, wherein the capacitor and the resistor are sized such that the capacitor discharges through the resistor to activate the solid state switch for a period of time that is longer than the electromechanical relay release time and sticking time. | 10-30-2008 |
