W. C. HERAEUS GMBH Patent applications |
Patent application number | Title | Published |
20130153542 | METHOD OF JOINING DISSIMILAR MATERIALS - A method of forming a wire includes providing a first wire segment and a second wire segment. The first and second wire segments are inserted into opposite ends of a coupling segment. The coupling segment is laser welded such that the laser creates an indent in the coupling segment that penetrates into at least one of the first and second wire segments. | 06-20-2013 |
20120089213 | MEDICAL LEAD WITH FILLER LAYER - A medical lead includes a first wire coil having an outer diameter and a marker coil having an inner diameter. The marker coil is assembled over the first wire coil. The outer diameter first wire coil is smaller than the inner diameter of the marker coil thereby defining a gap. A second wire coil substantially fills the gap between the first wire coil and the marker coil. A ball weld is formed at an end of the medical lead adjacent each of the first and second wire coils and adjacent the marker coil. | 04-12-2012 |
20110308957 | STRUCTURING THREE-DIMENSIONAL COMPONENTS WITH NON-DIFFUSING NOBLE OR SPECIAL METALS AND THEIR ALLOYS, WITH USE BEING MADE OF SPUTTER TECHNOLOGY - One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold. | 12-22-2011 |
20110264161 | MELTING METHOD FOR PRODUCING AN INCLUSION-FREE TA-BASE ALLOY - One aspect relates to a method for producing an alloy, whereby the alloy consists of three metals and the three metals are selected from the group consisting of tantalum, tungsten, and niobium. | 10-27-2011 |
20110190885 | METHOD FOR SINTERING ELECTRICAL BUSHINGS - One aspect relates to a method for producing an electrical bushing for an implantable device, a corresponding electrical bushing, and a corresponding implantable device. The method according to one embodiment is characterized in that a green blank is produced and sintered from an electrically insulating base body green blank made of a ceramic slurry or powder and at least one electrically conductive bushing body green blank made of a cermet material. The at least one bushing body green blank is inserted into a bushing opening of the base body green blank to form a composite green blank, a shape of the at least one bushing body green blank and a shape of the at least one bushing opening are complementary to each other at least in sections thereof and prevent slippage of the bushing body green blank through the bushing opening. The composite green blank is sintered while applying a force that keeps the bodies together. | 08-04-2011 |
20110186349 | ELECTRICAL BUSHING WITH GRADIENT CERMET - One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal powder, metal slurry, cermet powder and/or cermet slurry into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor. | 08-04-2011 |
20110129386 | USE OF POWDER-METALLURGICAL PRE-MATERIAL FOR PRODUCING AN NB ALLOY THAT IS FREE OF INCLUSIONS - One aspect discloses a method for producing an alloy, whereby the alloy consists of a first metal, a second metal, a third metal, and a fourth metal, and the first metal, the second metal, the third metal, and the fourth metal are selected from the group consisting of the metals, niobium, zirconium, tantalum, and tungsten, and the method includes the steps of
| 06-02-2011 |
20110034966 | ELECTRICAL BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE - One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conducting wire extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conducting wire is arranged in the through-opening. One aspect provides for a cermet-containing bearing element to be arranged between the insulation element and the conducting wire. | 02-10-2011 |
20110034965 | CERMET-CONTAINING BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE - One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conduction element extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conduction element is arranged in the through-opening. One aspect provides for the at least one conduction element to include a cermet. | 02-10-2011 |
20110033335 | PRODUCING AN ALLOY WITH A POWDER METALLURGICAL PRE-MATERIAL - One aspect is a method for producing an alloy, whereby the alloy includes at least a first metal and a second metal, whereby firstly a powder metallurgical route and subsequently a melt metallurgical route is used sequentially in order to generate the alloy from the, at least, first metal and the second metal. The method includes grinding the first metal into a first metal powder, grinding the second metal into a second metal powder, mixing the first metal powder and the second metal powder to produce a blended powder, generating a blended body from the blended powder by the powder metallurgical route, and generating the alloy by melting the blended body by the melt metallurgical route. | 02-10-2011 |
20110015711 | CONNECTION BETWEEN STIMULATION ELECTRODE AND CONDUCTION COIL - One aspect includes a stimulation electrode including a base body. The base body encompasses a top area and an end area, and the end area encompasses a screw thread at least area by area. | 01-20-2011 |
20110015710 | CRIMP CONNECTION BETWEEN STIMULATION ELECTRODE AND CONDUCTION COIL - One aspect is a stimulation electrode including a base body. The base body encompasses a top area and an end area. The end area encompasses a groove-like, radially revolving coupling element, into which a connection area of a conduction coil can be pressed by means of plastic deformation. | 01-20-2011 |
20110015709 | CONNECTION ELEMENT FOR CONDUCTION COIL - One aspect is a medical electrode system including a conduction coil and a stimulation electrode. The stimulation electrode encompasses a base body having a top area and an end area. The system is characterized in that the conduction coil encompasses a connection element. The connection element is thermally shrink-fitted onto the end area. | 01-20-2011 |
20100305671 | STIMULATION ELECTRODE - One aspect relates to a stimulation electrode including an electrically conducting base body. The base body encompasses tantalum and is at least partially covered with a porous tantalum oxide layer, which is anodically applied by means of high voltage pulses. Provision is made according to an embodiment for a metallic protective layer to cover the porous tantalum oxide layer so as to prevent a hydrogen embrittlement. | 12-02-2010 |
20100233507 | DEVICE WITH AT LEAST TWO INTERCONNECTED METAL PARTS - One aspect is a device including at least two interconnected metal parts. The two interconnected parts are formed from metals with different melting temperature from the group consisting of the elements Pt, Pd, Ag, Au, Nb, Ta, Ti, Zr, W, V, Hf, Mo, Co, Cr, Ni, Ir, Re, Ru as well as alloys on the basis of at least one of those elements. The metal part with the lower melting temperature is fused onto the metal part with the higher melting temperature and both parts are friction-locked and/or form-locked with each other. | 09-16-2010 |
20100211147 | ELECTRICALLY CONDUCTING MATERIALS, LEADS, AND CABLES FOR STIMULATION ELECTRODES - One aspect is a stranded wire containing numerous coils. The stranded wire is configured as an electrical connection between an electrical stimulation device that is connected to the proximal end of the stranded wire, and an electrode connected to the distal end of the stranded wire. At least one coil includes a tantalum or niobium-based metal. | 08-19-2010 |
20100206612 | COILED RIBBON AS CONDUCTOR FOR STIMULATION ELECTRODES - One aspect is a coil including a laminate having metal layers. The coil is configured for the electrical connection of stimulation electrodes. One of the metal layers exhibits good electrical conductivity and another metal layer great mechanical strength. | 08-19-2010 |
20100038240 | Powder-Fiber Adhesive - An adhesive is provided, in particular for the adhesion of conductive materials, having at least one binder component and fillers, wherein the fillers contain fibers or a fiber-powder mixture and the fibers and/or powder contain an electrically conductive material. Further, an assembly is provided made of a sputtering target material and a carrier material with an adhesive. | 02-18-2010 |
20090134206 | Process and Paste for Contacting Metal Surfaces - For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be decreased below 240° C. and the processing pressure can be reduced to normal pressure. A contacting paste for this purpose contains a metal compound, in particular a silver compound, which decomposes below 400° C. while forming elemental silver. As a result, a metal is generated in situ from a chemical compound for producing a contact, which is usable above the temperature necessary for its production. | 05-28-2009 |