| VISTEC SEMICONDUCTOR SYSTEMS GMBH Patent applications |
| Patent application number | Title | Published |
|---|
| 20120033691 | Device for Determining the Position of at Least One Structure on an Object, Use of an Illumination Apparatus with the Device and Use of Protective Gas with the Device - A device for determining the position of a structure ( | 02-09-2012 |
| 20120033230 | Device for Determining the Position of at Least One Structure on an Object, Use of an Illumination Apparatus with the Device and Use of Protective Gas with the Device - A device for determining the position of a structure ( | 02-09-2012 |
| 20100220339 | Method for Determining Positions of Structures on a Mask - A method for determining the positions of structures ( | 09-02-2010 |
| 20100205815 | Method for Calibration of a Measuring Table of a Coordinate Measuring Machine - A method is disclosed which is suitable for the calibration of a measuring table ( | 08-19-2010 |
| 20100110449 | Device for Determining the Position of at Least One Structure on an Object, Use of an Illumination Apparatus with the Device and Use of Protective Gas with the Device - A device for determining the position of a structure ( | 05-06-2010 |
| 20100060883 | Apparatus and method for determining the focus position - An apparatus and a method for determining the focus of an optical system on a substrate are disclosed. A light source emits an auxiliary light beam into an auxiliary beam path, wherein the auxiliary light beam, after splitting, is offset in relation to an optical axis of a measuring objective. At least one optical switch is provided in the auxiliary beam path for switching the path of the auxiliary beam path from one side offset from the optical axis to the other side offset from the optical axis of the measuring objective. | 03-11-2010 |
| 20100020332 | Interferometric device for position measurement and coordinate measuring machine - An interferometric device for position measurement of an element moveable in a plane is disclosed. A laser light source measures the position of the moveable element and emits the required measuring light. A beam splitter splits the measuring light into a first partial beam path and a second partial beam path, which each impinge on a reflecting surface of the moveable element via an interferometer. Herein, at least the beam splitter, which splits the measuring light into a first partial beam path and a second partial beam path, and the beam splitter, which directs the third partial beam path onto an etalon via an interferometer, have a respective beam trap associated with them, which traps the light returning from the respective interferometers. | 01-28-2010 |
| 20090316981 | Method and device for inspecting a disk-shaped object - In order to improve the detectability of defects in structures incorporated beneath the surface of a wafer, it is suggested to acquire an IR subimage of the illuminated wafer with an IR image acquisition device and a VIS subimage with a VIS image acquisition device. The acquisition is performed simultaneously and is controlled such that the same area of the wafer is imaged sharply by both image acquisition devices. An image processor is used to determine whether a detected defect is attributable to a defect on the surface or to a defect of the structures located beneath the surface. | 12-24-2009 |
| 20090279080 | DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER - A method, a device and the application for the inspection of defects on the edge region of a wafer ( | 11-12-2009 |
| 20090237653 | DEVICE FOR RECORDING A NUMBER OF IMAGES OF DISK-SHAPED OBJECTS - A device for recording a number of images of disk-shaped objects ( | 09-24-2009 |
| 20090189157 | Device for measuring or inspecting substrates of the semiconductor industry - A device for measuring or inspecting substrates of the semiconductor industry, including a base frame and a module detachably mounted thereon via a module frame, wherein the module frame is detachably connected to the base frame via at least two self-aligning coupling elements and at least one alignment element, wherein the base frame and the module frame are in exactly defined spatial alignment with each other, when the module frame is detachably connected to the base frame. | 07-30-2009 |
| 20090161942 | Method for inspecting a surface of a wafer with regions of different detection sensitivity - The invention relates to a method for inspecting a surface of a wafer with regions of different detection sensitivity. For this purpose, an image of the selected surface of the wafer is acquired using a detector. At least one region handled with a different detection sensitivity than the rest of the wafer may be defined on the surface of the wafer by means of an input unit. The detection sensitivity set for the regions is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity. | 06-25-2009 |
| 20090161097 | Method for optical inspection, detection and visualization of defects on disk-shaped Objects - A method for optical inspection, detection and visualization of defects ( | 06-25-2009 |
| 20090153875 | COORDINATE MEASURING MACHINE WITH TEMPERATURE ADAPTING STATION - The invention relates to a coordinate measuring machine ( | 06-18-2009 |
| 20090153657 | Method and apparatus for processing the image of the surface of a wafer recorded by at least one camera - A method for processing the image data of the surface of a wafer ( | 06-18-2009 |
| 20090130784 | Method for determining the position of the edge bead removal line of a disk-like object - A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensity profile I of the imaged edge area including the edge bead removal line is obtained with a camera on a line-by-line basis, and the edge area and the alignment mark are detected, wherein the local intensity maxima I′ | 05-21-2009 |
| 20090128828 | Device for measuring the position of at least one structure on a substrate - A device for measuring the position of at least one structure on a substrate is disclosed. The substrate to be measured is positioned in a mirror body. A flat insert is provided in the mirror body and is formed such that the substrate and the insert together always have the same optical thickness, irrespective of the mechanical thickness of the substrate. | 05-21-2009 |
| 20090126525 | Apparatus and method for supporting a substrate at a position with high precision - An apparatus and a method are disclosed for supporting a substrate at a position with high precision. The substrate is placed on a stage which is configured to be traversable in a plane in two spatial directions oriented perpendicular to each other. The substrate is supported on three point-like support elements. At least one of the support elements is configured to be moveable in the plane. | 05-21-2009 |
| 20090109443 | Method for determining positions of structures on a substrate - A system for determining positions of structures on a substrate is disclosed. The system includes a plurality of stations enclosed by a housing. At least one of the stations inside the housing is designed to be movable. The housing is provided with a filter fan unit generating an air flow in the housing. Air-directing elements are provided in the housing so that an invariable flow may be achieved irrespective of the at least one movable station. | 04-30-2009 |
| 20090097041 | Method for determining the centrality of masks - A method for determining the centrality of masks is disclosed. The mask is positioned in a coordinate measuring device on a measurement table displaceable in a direction perpendicular to the optical axis of an imaging measurement system in an interferometrically measurable way. The position of a mask coordinate system with respect to the measuring device coordinate system is determined based on at lest two structures on the mask. The relative distance from one of the at least first and second outer edges to the at least two structures is determined. The coordinate measuring machine determines the actual coordinates of the at least two structures with respect to the respective outer edges, which must not exceed a predetermined deviation from a desired value. | 04-16-2009 |
| 20090073458 | MEANS AND METHOD FOR DETERMINING THE SPATIAL POSITION OF MOVING ELEMENTS OF A COORDINATE MEASURING MACHINE - A means and a method for determining the spatial position of at least one moving element ( | 03-19-2009 |
| 20090070059 | Method for correcting measuring errors caused by the lens distortion of an objective - A method for correcting the measuring errors caused by the lens distortion of an objective in a coordinate measuring machine is disclosed. For a plurality of different types of structures, the lens distortion caused by an objective is determined in an image field of the objective. The position of a type of structure is determined in the image field of the objective by a measuring window. The correction of the lens distortion required for the type of structure to be measured is retrieved from the database as a function of the type of structure to be measured. | 03-12-2009 |
| 20090066970 | Arrangement and method for improving the measurement accuracy in the nm range for optical systems - A method and a device for improving the measurement accuracy in the nm range for optical systems are disclosed. The object is provided with a plurality of structures oriented in the X and Y-coordinate direction. The light beam coming from at least one light source defines an optical illumination path. | 03-12-2009 |
| 20090066955 | Device and method for determining an optical property of a mask - A coordinate measuring machine ( | 03-12-2009 |
| 20090052766 | Method for the optical inspection and visualization of optical measuring values obtained from disk-like objects - The present invention relates to a method for optically inspecting and visualizing optical measuring values from at least one image of a disk-like object, including the steps of recording said at least one image of said at least one disk-like object, wherein a plurality of optical measuring values are produced from said at least one recorded image; generating a resulting image, wherein an area of the surface of said disk-like object having optical measuring values within a predetermined interval, is associated with a colour or brightness value selected from a predetermined range; and varying at least one imaging parameter as a function of the detected and evaluated optical measuring values and/or as a function of a visual inspection of the resulting image by an operator. | 02-26-2009 |
| 20090051936 | Method for measuring positions of structures on a substrate with a coordinate measuring machine - A method for measuring structures ( | 02-26-2009 |
| 20090051932 | METHOD FOR DETERMINING THE POSITION OF A MEASUREMENT OBJECTIVE IN THE Z-COORDINATE DIRECTION OF AN OPTICAL MEASURING MACHINE HAVING MAXIMUM REPRODUCIBILITY OF MEASURED STRUCTURE WIDTHS - A method for determining the ideal focus position on different substrates is disclosed. A focus criterion is determined with which the best reproducibility may be achieved. An offset permits the user to set the optimal operating point of the coordinate measuring machine for a reproducible measurement of dimensions of structures on a substrate. | 02-26-2009 |
| 20090045318 | Method for reproducibly determining object characteristics - A method for reproducibly determining object characteristics is disclosed. Herein an object is imaged onto a detector by means of an imaging optics and detected thereon. A correction function k is applied to a brightness measuring result N originally detected by a detector in such a way, that a corrected brightness measuring result N′ is proportional to a brightness I impinging on the detector. | 02-19-2009 |
| 20090040530 | COORDINATE MEASURING MACHINE AND A METHOD FOR CORRECTING NON-LINEARITIES OF THE INTERFEROMETERS OF A COORDINATE MEASURING MACHINE - A method and a coordinate measuring machine ( | 02-12-2009 |
| 20090034832 | Device and method for scanning the whole surface of a wafer - A device and a method for scanning the whole surface of a wafer are disclosed. The wafer is deposited on a table movable in the X-coordinate direction and in the Y-coordinate direction. A camera and at least one illumination source are arranged opposite the wafer. The camera is a line camera with a detector row, wherein the length of the detector row is less than the diameter of the wafer. | 02-05-2009 |
| 20090033894 | Method for determining the systematic error in the measurement of positions of edges of structures on a substrate resulting from the substrate topology - A method for determining the lateral correction as a function of the substrate topology and/or the geometry of the substrate holder is disclosed. The substrate is placed on a measuring stage traversable in the X coordinate direction and Y coordinate direction, which carries the substrate to be measured. The substrate is supported on at least three support points which define a plane. An apparatus is provided for determining the position of a plurality of positions on the surface of the substrate in the in the X, Y and Z coordinate directions. The substrate is tiltable about an axis parallel to the X/Y plane, to enable the substrate to be measured in a tilted position. | 02-05-2009 |
| 20090033508 | System and method for determining positions of structures on a substrate - A system and a method for determining positions of structures on a substrate are disclosed. The system includes at least one measurement table ( | 02-05-2009 |
| 20090031572 | Coordinate measuring machine for measuring structures on a substrate - A coordinate measuring machine ( | 02-05-2009 |
| 20090030639 | Method for Correcting Measured Values Resulting from the Bending of a Substrate - A method for correcting the measured values of positions of structures ( | 01-29-2009 |
| 20090024351 | Method for Determining Correction Values for the Measured Values of Positions of Structures on a Substrate - A method for allocating correction values of the degree of bending of a substrate ( | 01-22-2009 |
| 20090024344 | Method for correcting an error of the imaging system of a coordinate measuring machine - A method for correcting an error of the imaging system of a coordinate measuring machine is disclosed. The position of at least two different edges of at least one structure on a substrate is measured. The substrate may be automatically rotated into another orientation. Then the position of the at least two different edges of the at least one structure is measured on the rotated substrate. Based on the measurement data, a systematic error of the imaging system is eliminated. | 01-22-2009 |
| 20090015833 | DEVICE AND METHOD FOR IMPROVING THE MEASUREMENT ACCURACY IN AN OPTICAL CD MEASUREMENT SYSTEM - A method and a device are disclosed, with which an improvement of the measurement accuracy for the determination of structure data is possible. There is provided a device having a support table ( | 01-15-2009 |
| 20090013808 | Advancing means for a multi-coordinate measurement table of a coordinate measuring device and method for controlling such an advancing means - An advancing means for a multi-coordinate measurement table including a drive unit having a friction rod and a motor for each coordinate axis (x, y). The motor contacts one side of the friction rod with its motor shaft and at least one press roller contacts the other side of the friction rod. At least one pressing means is provided biasing the press roller, the friction rod and the motor shaft against each other with a pressing force, whereby the motor shaft frictionally engages the friction rod and converts the rotational movement of the motor into a linear movement of the friction rod. A method for controlling such an advancing means is disclosed as well. | 01-15-2009 |
| 20090002720 | Device for measuring positions of structures on a substrate - A device for measuring positions of structures ( | 01-01-2009 |
| 20090002715 | Coordinate measuring machine with vibration decoupling and method for vibration decoupling of a coordinate measuring machine - A coordinate measuring machine ( | 01-01-2009 |
| 20090002486 | Coordinate measuring machine and method for calibrating the coordinate measuring machine - A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate. | 01-01-2009 |
| 20080304152 | Element for homogenizing the illumination with simultaneous setting of the polarization degree - Element for homogenizing the illumination with simultaneous setting of the polarization degree, wherein the element consists of at least two components. The first component is a microlens array, and the second component is a filter for setting the desired polarization. | 12-11-2008 |
| 20080304058 | Coordinate measuring machine and method for structured illumination of substrates - A coordinate measuring machine ( | 12-11-2008 |
| 20080295348 | Method for improving the reproducibility of a coordinate measuring apparatus and its accuracy - A method for improving the reproducibility of a coordinate measuring machine and its accuracy is disclosed. Using at least one measuring field of a camera, a plurality of images of at least one structure on the substrate are recorded. The substrate is placed on a measuring stage traversable in the X coordinate direction and the Y coordinate direction, the position of which is determined during imaging using a displacement measuring system. The measuring field is displaced by the amount of the deviation determined. | 12-04-2008 |
| 20080278790 | APPARATUS WITH ENHANCED RESOLUTION FOR MEASURING STRUCTURES ON A SUBSTRATE FOR SEMICONDUCTOR MANUFACTURE AND USE OF APERTURES IN A MEASURING APPARATUS - A measuring system is disclosed with enhanced resolution for periodic structures on a substrate for semiconductor manufacture. Aperture structures of varying geometries are provided in the illumination beam path. The aperture structures differ regarding the transmission characteristics of light, and which adjust the intensity distribution of the diffraction orders in the imaging pupil of the optical system. | 11-13-2008 |
| 20080259327 | Device for Inspecting a Microscopic Component | 10-23-2008 |
| 20080252903 | METHOD FOR DETERMINING THE FOCAL POSITION OF AT LEAST TWO EDGES OF STRUCTURES ON A SUBSTRATE - A method for determining the focal position of at least two edges of structures ( | 10-16-2008 |
| 20080249728 | METHOD FOR DETECTING DEFECTS ON THE BACK SIDE OF A SEMICONDUCTOR WAFER - The invention relates to a method for detecting defects on the back side of a semiconductor wafer. The brightness distribution of the color values is essentially a normal distribution. An average value and surroundings can be defined using the determined normal distribution, which are criteria for the occurrence of a defect. | 10-09-2008 |
| 20080232672 | DEVICE AND METHOD FOR EVALUATING DEFECTS IN THE EDGE AREA OF A WAFER AND USE OF THE DEVICE IN INSPECTION SYSTEM FOR WAFERS - A device for evaluating defects in the edge area of a wafer ( | 09-25-2008 |
| 20080208523 | Method of determining geometric parameters of a wafer - A method of determining geometric parameters of a wafer ( | 08-28-2008 |
| 20080204738 | Method for acquiring high-resolution images of defects on the upper surface of the wafer edge - A method for acquiring high-resolution images of defects on the upper surface of the wafer edge is disclosed. For this purpose, first the position of at least one defect on the upper surface of the wafer edge is determined. The thus determined position of the defect is stored. Then the wafer is transferred into device for micro-inspection, in which the defect is examined more closely and imaged. The images acquired in the device for micro-inspection are deposited in a directory. | 08-28-2008 |
| 20080204735 | APPARATUS AND METHOD FOR MEASURING STRUCTURES ON A MASK AND OR FOR CALCULATING STRUCTURES IN A PHOTORESIST RESULTING FROM THE STRUCTURES - An apparatus ( | 08-28-2008 |
| 20080201971 | METHOD FOR ELIMINATING SOURCES OF ERROR IN THE SYSTEM CORRECTION OF A COORDINATE MEASURING MACHINE - A method is disclosed for eliminating sources of error in the system correction of a coordinate measuring machine. Herein, a number j of reference structures | 08-28-2008 |
