| VIRTIUM TECHNOLOGY, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110126046 | SAVING INFORMATION TO FLASH MEMORY DURING POWER FAILURE - An embodiment is a method and apparatus to save data during power failure. A power supply generator generates operating voltages to a circuit from a generator supply source. A power monitor monitors a normal supply voltage and a backup supply voltage to provide a normal supply voltage to the generator supply source in a normal mode and to provide a backup supply voltage to the generator supply source in a power failure mode. A data transfer circuit transfers data from a volatile memory in the circuit to a non-volatile memory during the power failure mode. | 05-26-2011 |
| 20110074002 | STACKING DEVICES AT FINISHED PACKAGE LEVEL - An embodiment is a method and apparatus to stack devices. A first finished package level (FPL) device having a first grounded tested die (GTD) is reduced to nearly size of the first GTD. The first FPL has a first plurality of solder balls. The reduced first FPL device is attached to a first substrate to form a first device assembly. | 03-31-2011 |
| 20100291736 | STACKING MULTIPLE DEVICES USING SINGLE-PIECE INTERCONNECTING ELEMENT - An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads. | 11-18-2010 |
| 20100251543 | MULTI-FUNCTION MODULE - An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard. | 10-07-2010 |
| 20100167557 | MULTI-FUNCTION MODULE - An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard. | 07-01-2010 |
