| VIKING TECH CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20120001212 | Light-Emitting Diode Packaging Structure and Substrate Therefor - A light-emitting diode (LED) packaging structure and a substrate for the packaging structure are provided. The light-emitting diode packaging structure includes a metal substrate having a first surface and a second surface opposite to the first surface, and the first surface has a concave portion with a sidewall and a bottom, allowing an anode film to be formed on the metal substrate; a plurality of electrically conductive pads formed on the bottom of the concave portion; an optical treatment layer formed on the sidewall of the concave portion; and an LED die mounted on the bottom of the concave portion and electrically connected to the electrically conductive pads. Desired electrical insulating property between any two adjacent electrically conductive pads can be obtained by the anode film formed on the metal substrate, while a good thermal conductivity of the metal substrate is maintained. | 01-05-2012 |
| 20120000066 | Method for Manufacturing Alloy Resistor - An alloy resistor and a fabrication method thereof are provided. A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process. | 01-05-2012 |
