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Verigy Corporation
| Verigy Corporation Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080252330 | METHOD AND APPARATUS FOR SINGULATED DIE TESTING - In accordance with one embodiment of the invention, a method of singulated die testing can be implemented. This can be implemented by obtaining a wafer and singulating the dies into individual die pieces. The singulated dies can be arranged in a separated testing arrangement and can even combine dies from multiple wafers as part of the combined arrangement. Then, testing can be implemented on the combined test arrangement. | 10-16-2008 |