| 20100240201 | IMPLANTATION OF MULTIPLE SPECIES TO ADDRESS COPPER RELIABILITY - A first species and a second species are implanted into a conductor of a substrate, which may be copper. The first species and second species may be implanted sequentially or at least partly simultaneously. Diffusion of the first species within the conductor of the substrate is prevented by the presence of the second species. In one particular example, the first species is silicon and the second species is nitrogen, although other combinations are possible. | 09-23-2010 |
