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Universal Laser Systems, Inc.

Universal Laser Systems, Inc. Patent applications
Patent application numberTitlePublished
20090223944Laser-Based Material Processing Exhaust Systems and Methods for Using Such Systems - Laser-based material processing systems, exhaust systems, and methods for using such systems are disclosed herein. One embodiment of a laser-based material processing system can include an exhaust assembly configured to remove contaminants from a material processing area. The exhaust assembly can include a vacuum source and an exhaust plenum carried by a moveable arm of a gantry-style laser beam positioning assembly. The moveable arm can extend along a first axis and can be moveable along a second axis generally normal to the first axis. The exhaust plenum can extend lengthwise in a direction generally parallel with the first axis. The exhaust assembly can also include an intake slot extending lengthwise along the exhaust plenum across at least a portion of the material processing area. The exhaust assembly can further include one or more flexible exhaust ducts in fluid communication with the vacuum source and the exhaust plenum.09-10-2009
20090050611LASER BEAM POSITIONING SYSTEMS FOR MATERIAL PROCESSING AND METHODS FOR USING SUCH SYSTEMS - Laser beam positioning systems for material processing and methods for using such systems are disclosed herein. One embodiment of a laser-based material processing system, for example, can include (a) a radiation source configured to produce a laser beam and direct the beam along a beam path toward a material processing area, and (b) a laser beam positioning assembly in the beam path. The laser beam positioning assembly can include a first focusing element, first and second reflective optical elements (e.g., movable mirrors), and a second focusing element. The first focusing element can focus the laser beam to a first focal point between the first and second reflective optical elements. The first and second reflective optical elements can direct the laser beam toward the material processing area while the laser beam has a decreasing or increasing cross-sectional dimension (e.g., diameter). The second focusing element can focus the laser beam and direct the beam toward a material processing area to modify a workpiece at least proximate to the material processing area.02-26-2009

Patent applications by Universal Laser Systems, Inc.