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UNITED TEST AND ASSEMBLY CENTER
| UNITED TEST AND ASSEMBLY CENTER Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080290509 | Chip Scale Package and Method of Assembling the Same - A method of producing a chip scale package is disclosed. The method includes dicing a wafer into a plurality of chip arrays, each array including two or more integrated circuit chips. The method further includes mounting each array on a substrate and dicing each array, attached to the substrate, into individual chip scale packages, each individual chip scale package including only one integrated circuit chip. | 11-27-2008 |