UNITED MONOLITHIC SEMICONDUCTORS GMBH
UNITED MONOLITHIC SEMICONDUCTORS GMBH Patent applications | ||
Patent application number | Title | Published |
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20120248612 | METHOD FOR THE PRODUCTION OF AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PRODUCED ACCORDING TO THIS METHOD - The invention relates to an electronic component having a GaAs semiconductor substrate (HS), semiconductor components (BE) being implemented on the front side thereof, and the back side thereof having a multilayer backside metallization (RM), wherein an advantageous construction of the layer sequence of the backside metallization is proposed, the backside metallization in particular comprising an Au layer as a bonding layer. | 10-04-2012 |
20120175764 | METHOD FOR THE PRODUCTION OF AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PRODUCED ACCORDING TO THIS METHOD - The invention relates to an electronic component having a circuit integrated on a semiconductor substrate, and a heat-conducting connection of the substrate by soldering using a carrier serving as a heat sink, wherein the invention proposes depositing a first, thicker Au layer ( | 07-12-2012 |