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ULTRASOURCE, INC.
| ULTRASOURCE, INC. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100270062 | Method and Apparatus for an Improved Filled Via - The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace. | 10-28-2010 |