| ULT TECHNOLOGY CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090162956 | LED FABRICATION METHOD EMPLOYING A WATER WASHING PROCESS - An LED fabrication method for fabricating LEDs comprises: covering all the P-contacts and N-contacts on a wafer with a hydrophilic resin mask layer, packaging the wafer with an organic or inorganic polymer compound containing a yellow fluorescent powder (or a mixture of red and green fluorescent powders), employing a water washing process to remove the hydrophilic resin mask layer so that all the P-contacts and the N-contacts are exposed to the outside, and saw-cutting the wafer into individual dies and wire-bonding the P-contact and N-contact of each die with a respective gold wire. | 06-25-2009 |
| 20090148674 | IN MOLD FILM WITH A 2D/3D PATTERN - Both in mold film and in mold label with a 2D or 3D pattern include a base layer, which has a flat inner surface and an outer surface that can be a 2D visual surface or 3D grating surface, a pattern layer printed on the inner surface of the base layer to show a 2D or 3D pattern, a protective layer prepared from a polymer material having high temperature resistance, acid resistance and alkali resistance characteristics and printed on the pattern layer, and an adhesion layer covered on the protective layer. In an alternate form, an anti-EMI layer is sandwiched between the protective layer and the adhesion layer for electromagnetic interference protection. | 06-11-2009 |
| 20090133921 | FLEXIBLE PC BOARD MADE THROUGH A WATER CLEANING PROCESS - A flexible PC board made through a water cleaning process includes a substrate prepared from polymers or copolymers such as PET, PI, PP, PS, PMMA, PC, PU, PBT, ABS, nylon, etc. A release layer prepared from a hydrophilic material and printed on the substrate to leave a blank zone on the substrate according to a predetermined circuit pattern, and a conduction layer bonded to the blank zone to form a circuit pattern. An electroplating process may be employed to increase the thickness of the circuit pattern formed of the conduction layer. Through a water cleaning process, the release layer is removed from the substrate, and the desired flexible PC board is obtained for bonding to a member of an electronic product by means of injection or pressure casting molding. | 05-28-2009 |
