| 20100326566 | SYSTEM FOR FILLING HOLES IN A PRINTED CIRCUIT BOARD WITH A FLUID FILL MATERIAL - There is a system for filling holes in a printed circuit board with a fluid fill material. The system receives a printed circuit board vertically within a main body. There is a dispensing head for selectively dispensing a fill material onto the vertically placed circuit board, the dispensing head having a plurality of holes. A feeding reservoir contains the fill material, and the feeding reservoir has a first end and a second end. An outlet system comprises a flow line connected to the first end of the feeding reservoir, and the flow line provides a flow path for the fill material from the first end of the feeding reservoir to the dispensing head. The flow line is attached to a manifold connected to the dispensing head, the manifold including connectors between the branches and with the absence of 90° elbows in the flow path. There is a plunger located at the second end of the feeding reservoir; and an air cylinder pushes the plunger into the feeding reservoir, thereby forcing the fill material out of the first end of the feeding reservoir, through the outlet system, and into the dispensing head. | 12-30-2010 |
