TRONICS MICROSYSTEMS S.A.
|TRONICS MICROSYSTEMS S.A. Patent applications|
|Patent application number||Title||Published|
|20160130133||MEMS-SENSOR - A sensor for measuring physical parameters such as acceleration, rotation, magnetic field, comprises a substrate (||05-12-2016|
|20160107882||MEMS DEVICE WITH GETTER LAYER - A MEMS device comprises a first layer (||04-21-2016|
|20150316378||MICROMECHANICAL Z-AXIS GYROSCOPE - A micromechanical sensor device for measuring angular z-axis motion comprises two vibratory structures each having at least one proof mass. A suspension structure maintains the two vibratory structures in a mobile suspended position above the substrate for movement parallel to the substrate plane in drive-mode (x-axis) direction and in sense-mode direction (y-axis). A coupling support structure connects the coupling structure to an anchor structure and enables a rotational swinging movement of the coupling structure, the rotational swinging movement having an axis of rotation that is perpendicular to the substrate plane. Each of the vibratory structures comprises at least one shuttle mass coupled to the at least one proof mass by sense-mode springs, which are more flexible in sense-mode direction than in drive-mode direction (x), for activating a vibration movement of each vibratory structure. A sensing electrode structure for each proof mass is designed for detecting sense-mode movements that are parallel to the substrate plane, The coupling support structure is designed to also enable a translational movement of the coupling structure in drive-mode direction (x).||11-05-2015|
|20120267730||MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE - A micro-electromechanical system (MEMS) device for measuring accelerations, angular rates, or for actuation comprises at least two substrates and at least one movable structure arranged in a cavity between the substrates. An electrically conducting frame surrounding the movable structure is arranged at an interface of the two substrates. The frame is electrically separated from the movable structure and connected by at least first and second electrically conducting connections to the first and second substrates, respectively. The frame may have a width of not more than 150 preferably not more than 50 μm. The first connection is at an interface between the frame and the first substrate. The second connection is a layer applied at an outer periphery of the frame and a peripheral face of the second substrate. The structure keeps electrical fields and electromagnetic disturbances away from the sensor and may also be used for shielding micro-electronic circuits.||10-25-2012|
Patent applications by TRONICS MICROSYSTEMS S.A.