| Trident Microsystems, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120027262 | Block Matching In Motion Estimation - A video processor comprises an instruction set of programmed operations for operating on video data. The instruction set has an instruction which corresponds to a programmed operation for performing a motion estimation calculation between pixel data in frames of video data. The programmed operation causes the processor to calculate a measure of motion estimation at each of a plurality of search locations within a search window. The processor comprises a plurality of calculation units ( | 02-02-2012 |
| 20110234894 | PROFILE FOR FRAME RATE CONVERSION - The present application relates to a method for frame rate conversion. The present application relates also to a system for frame rate conversion and a computer comprising said frame rate. In addition, the present application relates to a computer readable medium having a computer program for performing said method. The method comprises defining a first frame rate profile with a first frame rate, defining at least a second frame rate profile with a second frame rate, rendering video frames at the first frame rate profile, detecting the quality of the rendered video frames, and switching from the first frame rate profile to the second frame rate profile at least depending on the detected quality of the rendered video frames. | 09-29-2011 |
| 20100195277 | Dual Layer Printed Circuit Board - Memory systems are disclosed which are comprised of a two or dual layer printed circuit board. Attached to the top layer of the dual layer printed circuit board are a memory chip and a memory controller with aligned, optimistic pin outs that optimized signal integrity layouts between certain high speed pins in a single layer. A set of high speed lines, including the data lines, that do not include any vias connect certain of the pins of the memory controller to certain of the pins of the memory chip. The high speed lines are covered by a sub-PCB that includes a copper lay that extends a ground or electrical plane above the top layer of the dual layer printed circuit board. | 08-05-2010 |
