| TREADSTONE TECHNOLOGIES, INC. Patent applications |
| Patent application number | Title | Published |
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| 20110076587 | HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS AND METHODS TO PRODUCE SAME - A method to use a novel structured metal-ceramic composite powder to improve the surface electrical conductivity of corrosion resistant metal substrates by thermal spraying the structured powder onto a surface of a metallic substrate is disclosed. The structured powder has a metal core and is wholly or partially surrounded by an electrically conductive ceramic material such as a metal nitride material. The metal cores may have the ceramic material formed on them prior to a thermal spraying process performed in an inert atmosphere, or the thermal spraying may be performed in a reactive atmosphere such that the ceramic coating forms on the cores during the thermal spraying process and/or after deposition. The metal cores will bond conductive ceramic material onto the surface of the substrate through the thermal spray process. | 03-31-2011 |
| 20100285386 | HIGH POWER FUEL STACKS USING METAL SEPARATOR PLATES - A separator plate for use in a fuel cell stack in a fuel cell device includes a porous core with a metal layer on either side of the porous core. The metal layer has through holes formed therein such as by perforation. The metal layers are contoured to provide flow field channels, and the porous layer may have channels formed therein that are parallel to the metal layers that can be used for cooling water. A monopolar fuel stack includes twin cell units that include a center separator plate, a pair of membrane electrode assemblies, one on each side of the center separator plate, and a pair of outer plates which may have through holes formed therein, one on each side of the membrane electrode assemblies opposite the center separator plate. The outer plates cover substantially an entire electrode to which they are adjacent. | 11-11-2010 |
| 20090176120 | HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS - A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate. | 07-09-2009 |
