| TRANSFORM SOLAR PTY LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120006409 | Thin Silicon Sheets for Solar Cells - A thin layer of single-crystal silicon is produced by forming first trenches in a silicon substrate having (111) orientation; forming narrower second trenches at the base of the trenches; anisotropically etching lateral channels ( | 01-12-2012 |
| 20100269899 | Solar Cell - The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other. | 10-28-2010 |
| 20100267218 | Semiconductor Wafer Processing to Increase the Usable Planar Surface Area - The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other. | 10-21-2010 |
| 20100258161 | Semiconductor Device - The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other. | 10-14-2010 |
| 20100173441 | METHOD FOR PROCESSING ELONGATE SUBSTRATES AND SUBSTRATE SECURING APPARATUS - A method for processing elongate substrates, including forming a plurality of parallel elongate openings ( | 07-08-2010 |
