Towa Corporation Patent applications |
Patent application number | Title | Published |
20150017372 | METHOD OF MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND APPARATUS FOR MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT - The present invention is to provide a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component that enable the manufacture of a resin-encapsulated electronic component including a plate-like member in a simple manner at low cost. The method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member | 01-15-2015 |
20110233821 | COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFOR - A compression resin sealing apparatus includes cooling means ( | 09-29-2011 |
20110193261 | COMPRESSION MOLDING METHOD AND COMPRESSION MOLDING APPARATUS - The present invention aims at effectively decreasing the installation space of an entire semiconductor chip compression molding apparatus and effectively decreasing the clamping force in dies which are provided in the apparatus. It further aims at performing a clamping, in the case where substrates having a different thickness are used, with an efficient adjustment in accordance with the thicknesses of the substrates. To this end, the semiconductor chip compression molding includes two semiconductor chip compression molding dies (top and bottom dies), and a die opening/closing means for closing the die surfaces of top dies and those of bottom dies in each of the upper and lower dies. The die opening/closing means includes a die opening/closing mechanism having two racks and one pinion, and a thickness adjustment mechanism for adjusting the gaps in accordance with the thicknesses of the substrates supplied to each of the upper and lower dies. | 08-11-2011 |
20100325779 | GLOVE AND MANUFACTURING METHOD THEREOF - A glove which can ensure flexibility thereof and can prevent peeling-off of a resin film formed on a surface of a glove base body is provided. Also provided is a manufacturing method of the glove. The glove (G) includes a glove base body ( | 12-30-2010 |
20100065983 | METHOD OF COMPRESSION-MOLDING LIGHT-EMITTING ELEMENTS - A method of compression-molding light emitting elements is provided, which can efficiently prevent the formation of a resin burr on a frame on which LED chips (light-emitting elements) are mounted. A tape for resin burr prevention is adhered to a surface of the frame, i.e. the surface on which no light-emitting element is mounted, to form a tape-applied frame. The tape-applied frame is supplied and set onto a setting section of an upper die, with the LED chips directed downwards. A required amount of transparent liquid resin material is dripped by a dispenser into a large cavity including small cavities. Then, both the upper and lower dies are clamped with a required clamping pressure, whereby the LED chips are individually immersed in the resin contained in the small cavities inside the large cavity and compression-molded to form a molded frame (light emitters). | 03-18-2010 |
20100006215 | METHOD OF FORMING LIGHT EMITTER AND MOLDING DIE - The manufacturing efficiency of a light emitter (product) having a lens member and a light emitting device is efficiently improved. With a molding die for forming a light emitter, a frame before the molding and bonding process, with a required number of light-emitting devices mounted thereon, is set on a setting section provided in an upper die. A required amount of transparent liquid resin material is supplied by a dispenser into each of cavities of cavity blocks provided in a lower die in correspondence to the light-emitting devices, respectively. A molding die is closed so as to elastically press the mouths of the cavities onto the light emission surfaces of the light emitting devices, respectively. Thus, the resin in each cavity is compression-molded into the lens member formed in accordance with the shape of the cavity, and simultaneously, the lens members are bonded to the light emission surfaces of the light emitting devices to obtain a light emitter emitter and accordingly a frame after the molding and bonding process. | 01-14-2010 |
20090242524 | SINGULATION APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT - Regarding a singulation apparatus for singulating a resin encapsulated substrate to manufacture an electronic component, the present invention brings about shortening the delivery period, reducing the footprint, and reducing the cost in compliance with a specification requested by a user. A singulation apparatus for an electronic component has: a basic unit including a receiving unit, singulation unit, and delivery unit; a cleaning unit mounted between the singulation unit and the delivery unit; and an examination unit mounted on the cleaning unit. The singulation unit is appropriately selected in accordance with the requested specification by the user, and a cutting mechanism used in the singulation unit has a rotary blade, water jet, laser light, wire saw, band saw, etc. The cleaning unit and examination unit, both mounted on the basic unit, are each appropriately selected and mounted in accordance with the requested specification by the user. The cleaning unit and examination unit are mounted on the basic unit which has the singulation unit in accordance with the requested specification by the user to form the singulation apparatus for an electronic component. | 10-01-2009 |
20090126543 | System and method for supplying processing water - The present invention provides a system | 05-21-2009 |
20090124178 | Abrasive Waterjet Type Cutting Apparatus - A cutting apparatus includes a fixing table where a position of an encapsulated body that is an example of a workpiece is fixed, and a nozzle from which an abrasive waterjet containing abrasive grains for cutting the encapsulated body is sprayed out. The fixing table includes a plurality of protrusions and a plurality of bases. Each of the plurality of protrusions is partitioned by a groove so as to correspond to a plurality of package products subsequent to cutting of the encapsulated body, and includes a through hole to draw in by suction the encapsulated body or one of the plurality of package products. Each of the plurality of bases links protrusions together aligned along at least one direction among the plurality of protrusions. A region of the plurality of protrusions or the plurality of bases against which the abrasive waterjet collides is formed of a material higher in hardness than the abrasive grains. | 05-14-2009 |
20090107361 | Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material - An upper die ( | 04-30-2009 |