| 20120080693 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME - The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted. | 04-05-2012 |
