TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
|TOUCH MICRO-SYSTEM TECHNOLOGY CORP. Patent applications|
|Patent application number||Title||Published|
|20130278986||ANNULAR STRUCTURE AND MICRO SCANNING MIRROR - A micro scanning mirror is disclosed in the present invention. The micro scanning mirror includes a substrate, an annular structure and a mirror structure. The substrate includes a hollow area and a first shaft. The annular structure is disposed inside the hollow area on the substrate and encircles the mirror structure. The mirror structure includes a second shaft connected to the annular structure. The annular structure includes at least one first edge, at least one second edge and a first comb electrode. The first edge is connected to the first shaft, and an end of the second edge is connected to the first edge. The second edge includes a first side adjacent to the mirror structure, and a second side adjacent to the substrate. The first comb electrode is disposed on the second edge.||10-24-2013|
|20130266774||PACKAGE STRUCTURE AND PACKAGING METHOD - A package structure and a packaging method for manufacturing the package structure are provided. The package structure comprises a cover wafer, a device wafer and a bonding material. The cover wafer has an optical element, and a surface of the cover wafer is defined with a height difference that is greater than 20 micrometers. The bonding material has a width and continuously surrounds the optical device, and is disposed between the cover wafer and the device wafer, in which the width is between 10 micrometers and 150 micrometers. The bonding material hermetically bonds the cover wafer and the device wafer to make a leakage rate of the package structure less than 5e||10-10-2013|
|20130258293||Phase Modulation Module and Projector Comprising the Same - An optical phase modulation module and a projector comprising the same are provided. The optical phase modulation module comprises a transparent thin film with an electro-optic effect, a plurality of first upper electrodes, a plurality of second upper electrodes and a plurality of lower electrodes. The transparent thin film with the electro-optic effect has a top surface and a bottom surface. The first upper electrodes are formed on the top surface. The second upper electrodes are formed on the top surface and arranged alternately with the first upper electrodes. The lower electrodes are formed on the bottom surface. A first voltage difference exists between the first upper electrodes and the bottom electrodes, while a second voltage difference exists between the second upper electrodes and the bottom electrodes. Two different electric fields are produced within the transparent thin film with the electro-optic effect by the first voltage difference and the second voltage difference respectively.||10-03-2013|
|20130043136||PLANAR COIL AND METHOD OF MAKING THE SAME - A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench.||02-21-2013|
|20120086537||PLANAR COIL AND METHOD OF MAKING THE SAME - A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench.||04-12-2012|
|20120086086||MEMS DEVICE AND COMPOSITE SUBSTRATE FOR AN MEMS DEVICE - An MEMS device and a composite substrate for an MEMS device are provided. The MEMS device comprises a first silicon structure layer and a second silicon structure layer fixedly connecting to the first silicon structure layer. The first silicon structure layer has a twistable rod and a first plane. The first silicon structure layer has a first crystal direction with a miller index of <100> and a second crystal direction with a miller index of <110>. The first crystal direction and the second crystal direction are both parallel to the first plane. The rod has an axis direction, which is parallel to the first plane and intersected by the second crystal direction. In this manner, the torsional stiffness of the rod can be improved.||04-12-2012|
|20110310452||BIAXIAL SCANNING MIRROR FOR IMAGE FORMING APPARATUS - A biaxial scanning mirror for an image forming apparatus is disclosed in the present invention. The mirror includes a first wafer, a second wafer, and a spacer. The first wafer includes a mirror unit, a rectangular rotating unit, a permanent magnet, and a magnetically permeable layer. The second wafer has at least two cores each surrounded by a planar coil applied with an AC current for switching magnetic polarization of the cores such that the cores are attracted to or repelled from the rotating unit alternatively, thereby driving the rotating unit to rotate.||12-22-2011|
|20110310451||BIAXIAL SCANNING MIRROR FOR IMAGE FORMING APPARATUS AND METHOD FOR OPERATING THE SAME - A biaxial scanning minor is disclosed in the present invention. The minor includes: a first wafer having several cavities forming a first row and a second row, several permanent magnets each installed in one of the cavities, a spacer and a second wafer. The second wafer includes: a minor unit, rotating around a first axis, for reflecting light beams; and a rotating unit, formed around the minor unit, for rotating the minor unit around a second axis which is perpendicular to the first axis. At least one coil substrate having a planar coil is assembled in the rotating unit.||12-22-2011|
|20110309057||LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING - A laser heating apparatus for metal eutectic bonding is disclosed in the present invention. The laser heating apparatus has a table for supporting a substrate having a first metal; a holding unit, located above the table and moving with respect to the table, for holding an object having a second metal above the table; and a laser generator, installed below the table and moving with respect to the table, for providing a laser beam which passes through the table and the substrate to melt the first metal, to facilitate the first metal to adhered to the second metal, thereby bonding the substrate with the object. The apparatus provides good heat conduction and stability. Furthermore, the holding unit used is not only for positioning, but also exerting a pressure on the bonding metals. It makes eutectic bonding process easier and more efficient.||12-22-2011|
Patent applications by TOUCH MICRO-SYSTEM TECHNOLOGY CORP.