| 20100092327 | Process For Making Copper Tungsten And Copper Molybdenum Composite Electronic Packaging Materials - From tungsten or molybdenum powders, a tungsten or molybdenum compact is pressurized and molded into the same dimensions as or slightly larger than the end product and sintered into tungsten or molybdenum skeleton. After copper infiltration, chemical copper etching is applied to remove excess surface copper. A machining allowance with an absolute value >0-≦0.1 mm may be applied for the machining of uneven surfaces resulting from the chemical process of copper removal. | 04-15-2010 |
