Toray Saehan, Inc.
|Toray Saehan, Inc. Patent applications|
|Patent application number||Title||Published|
|20110166258||RESIN COMPOSITION FOR NO-FLOW UNDERFILL, NO-FLOW UNDERFILL FLIM USING THE SAME AND MANUFACTURING METHOD THEREOF - Disclosed herein are a resin composition for no-flow underfill, which can be formed into a film, a no-flow underfill film formed from the composition and a manufacturing method of the no-flow underfill film. The resin composition for no-flow underfill has a viscosity higher than 500 cps which is suitable for coating on a film. Thus, the no-flow underfill composition can be manufactured into a laminatable film type without any additional additive. Accordingly, the resin composition makes it possible to accurately control the thickness and area of underfill, unlike the prior paste type composition.||07-07-2011|
|20110056623||LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME - This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200° C.||03-10-2011|
|20110037925||OPTICAL SHEET FOR CONTROLLING THE DIRECTION OF A LIGHT RAY - The present disclosure relates to an optical sheet for controlling the direction of light rays which is used for manufacturing backlight units of TFT-LCDs for computer monitors and televisions, and more specifically to an optical sheet which can uniformly diffuse light, improve brightness, and adjust viewing angle. There is provided an optical sheet for controlling the direction of light rays comprising a substrate film; a microlens group arranged on a first face of the substrate film; and a plurality of protuberances formed on a second face of the substrate film, wherein each protuberance comprises a reflective layer at the bottom thereof, and the plurality of protuberances comprise an aperture formed therebetween, and wherein a unit microlens of the microlens group has a first side and a second side with different radii of curvature from each other with respect to a light emission control part thereof.||02-17-2011|
|20110008595||METHOD FOR PRODUCING A LENS PATTERN ON ROLL AND ROLL FOR PRODUCING OPTICAL FILM WITH THE LENS PATTERN THEREFROM - The present disclosure generally relates to a method for producing lens patterns on a roll which is used to produce optical films wherein the method comprises forming a resin film on a roll comprising a plated layer which has been surface-plated with copper (Cu) or nickel (Ni); producing a preliminary lens pattern by striking the surface of the resin film on the roll with a chisel; etching with an etching solution the roll having the preliminary lens pattern formed thereon; and removing the resin film, and a roll for producing optical films comprising lens patterns formed thereon by the same method.||01-13-2011|
|20100295001||HIGH-EFFICIENCY LIGHT DIFFUSING POLYMERIC FILM AND MANUFACTURING METHOD THEREOF - A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.||11-25-2010|
|20100247906||HEAT-RESISTANT ADHESIVE SHEET - The present invention relates to a heat-resistant adhesive sheet (tape). More particularly, the invention relates to a heat-resistant adhesive sheet of high reliability and workability, in which crosslink reaction can be induced through irradiation of energy rays on an adhesive layer to achieve heat resistance at high temperature and also high dimension stability in parts, to achieve release without leaving any adhesive residues on an attached surface in releasing the layer and also to achieve no oxidation on the attached surface, e.g., a metallic surface at a high temperature. To this end, the heat-resistant adhesive sheet (tape) according to the invention is characterized by comprising a heat-resistant substrate, and an adhesive layer formed on at least one side of the heat-resistant substrate and made with a coating of liquid comprising energy ray curable olygomer resin, thermosetting adhesive resin, energy ray initiator and thermosetting agent, the adhesive layer being cured and heat resistant by irradiating energy rays to induce crosslink reaction.||09-30-2010|
|20100155982||METHOD OF PREPARING A POLYETHYLENE MICROPOROUS FILM FOR A RECHARGEABLE BATTERY SEPARATOR - Disclosed are a polyethylene microporous film and a method of preparing the same. The polyethylene microporous film, which has a laminated structure comprising B layer/A layer/B layer, prepared by melt-mixing a polyethylene and an aliphatic hydrocarbon solvent together at controlled mixing ratios to separately form an A layer and a B layer having different porosities, and then coextruding the A and B layers, thus exhibiting excellent mechanical properties, such as strength and elongation, and high-temperature stability. Therefore, the polyethylene microporous film is suitable for use in a rechargeable battery separator.||06-24-2010|
|20100002436||Optical Sheet For TFT-LCD Back Light Unit And Liquid Crystal Display Having The Optical Sheet - The present invention relates to an optical sheet for a backlight unit of a TFT-LCD and a TFT-LCD including the same. The optical sheet of the present invention includes a transparent base sheet, and a light diffusion layer in which a diffusion pattern comprised of a plurality of protrusions is formed on the transparent base sheet. The diffusion pattern satisfies an aspect ratio of 0.8 or more, the aspect ratio being a ratio of a radius (l) of a unit body portion of the protrusion, which is formed on the transparent base sheet, to a thickness (d) of the protrusion.||01-07-2010|
|20090294046||ANISOTROPIC CONDUCTIVE FILM AND ADHESION METHOD THEREOF - The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.||12-03-2009|
|20090011166||ADHESIVE TAPE COMPOSITION FOR ELECTRONIC COMPONENTS - The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability.||01-08-2009|
|20080311333||Silicone Release Compositions with Controlled Peeling Force and Silicone Release Coating Films Coated with the Same - The invention pertains to a silicone release composition of which the peeling force can be controlled and also a silicone release film coated with the composition. With the inventive composition and the release film coated with the composition, it is possible to obtain a reproducible peeling force with a given value, and also possible to produce a uniformly coated release film without discharged harmful solvent. The silicone release film produced as such can have controlled peeling force with a stable peeling force characteristic compatible with viscous agent. To this end, the invention is characterized in that the silicone release composition of which the peeling force can be controlled according to the invention is a silicone water-dispersed release coating composition, contains organopolysiloxane, organopolysiloxane resin, organo hydrogen polysiloxane and platinum chelate catalyst, and meets the following math figure for peeling force:||12-18-2008|
|20080226884||ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIPS - The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film. With such a configuration, the adhesive film for stacking semiconductor chips according to the invention enables the semiconductor silicone chips to be stacked in 3 or more layers without using a separate spacer between chips in order to keep a wire distance between upper and lower chips in stacking the chips. With the configuration, it is advantageous that reliability of semiconductors is not lowered because adhesiveness is kept despite of a repeated process of stacking chips subject to high temperature.||09-18-2008|
Patent applications by Toray Saehan, Inc.