| TORAY ENGINEERING CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120103252 | CONVEYANCE DEVICE FOR BASE MATERIAL HAVING BOTH SURFACES COATED WITH COATING SOLUTION - A double-sided coated substrate transport device ( | 05-03-2012 |
| 20120085407 | SOLAR BATTERY - A solar battery module has a structure in which a solar battery cell formed by a transparent electrode, a power generating element, and a back electrode is formed on a substrate, and it is sealed with a resin material such as EVA. However, there has been a problem that water enters from a gap between the substrate and a resin sealing material, thereby resulting in the corrosion of the resin or the solar battery cell. A barrier layer made of inorganic substances having portions in contact with the substrate and the second electrode is provided. Here, the barrier layer is formed by laminating at least SiO | 04-12-2012 |
| 20120085406 | SUBSTRATE WITH THIN FILM, AND SOLAR CELL USING THE SAME - A substrate with a thin film formed by layering a transparent substrate, a silicon compound film, and a transparent electroconductive film in this order, wherein the surface of the silicon compound film on the side of the transparent electroconductive film is an irregularly shaped surface provided with irregularities, the surface of the transparent electroconductive film opposite from the silicon compound film is an irregular surface shaped so as to follow the irregularly shaped surface, and the silicon compound film includes fine transparent particles having a different refractive index than the refractive index of the silicon compound film. | 04-12-2012 |
| 20100233243 | Laminated Microcapsule Sheet and Process For Production Thereof - Disclosed is a laminated microcapsule sheet which is produced using a lamination apparatus B and a water repellency imparting apparatus A, wherein the lamination apparatus B is used for laminating multiple types of materials at multiple parts on an edible film to form a laminated microcapsule sheet and the water repellency imparting apparatus A is used for imparting water repellency to the surface of the edible sheet. The sheet is improved in the disadvantages attributable to the water soluble property of an edible film. | 09-16-2010 |
| 20100136123 | Microcapsule Sheet - In order to heighten the density of microcapsules and facilitate handling by the unit composed of microcapsules in a given amount smaller than in the whole sheet, a microcapsule sheet which comprises a substrate constituted of an edible film and microcapsules each obtained by surrounding a core layer with a first shell film and a second shell film, the microcapsules being arranged according to a given pattern so as to be arranged only in those regions of the substrate which are separated from each other. | 06-03-2010 |
| 20090321895 | SILICON THIN-FILM AND METHOD OF FORMING SILICON THIN-FILM - Issue Providing a silicon film which can prevent damage of electronic devices formed on a substrate from occurrence, can prevent apparatus arrangement from becoming large-scale one, can improve coherency of a silicon thin film to a substrate, and is hardly happened crack and/or flaking, and providing a method for forming the silicon thin film. | 12-31-2009 |
| 20090188630 | Laminated Microcapsule Sheet Producing Apparatus - An apparatus capable of producing a laminated microcapsule sheet through transferring with high productivity of a drug solution of high viscosity accurately as much as a given weight while avoiding run-off from an enteric layer. There is provided an apparatus comprising edible film holding means ( | 07-30-2009 |
| 20090071703 | CONDUCTIVE PASTE, CIRCUIT BOARD, CIRCUIT ARTICLE AND METHOD FOR MANUFACTURING SUCH CIRCUIT ARTICLE - The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 μm or more and 10 μm or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board ( | 03-19-2009 |
