TONG HSING ELECTRONIC INDUSTRIES, LTD.
|TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent applications|
|Patent application number||Title||Published|
|20140110159||STRESS-REDUCED CIRCUIT BOARD AND METHOD FOR FORMING THE SAME - A stress-reduced circuit board includes an insulating substrate, and first and second electrically conductive layers which are stacked one upon the other, and which respectively have peripheral marginal regions that are configured in a stepped arrangement. The first electrically conductive layer is configured to have an area dimension larger than that of the second electrically conductive layer and a thickness not greater than that of the second electrically conductive layer so as to minimize stress caused by a difference in coefficients of thermal expansion between the insulating substrate and the first and second electrically conductive layers.||04-24-2014|
|20140090825||LIQUID-COOLED HEAT DISSIPATING DEVICE AND METHOD OF MAKING THE SAME - A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.||04-03-2014|
|20140000106||CIRCUIT BOARD MODULE AND METHOD OF MAKING THE SAME||01-02-2014|
|20130228273||CERAMIC CIRCUIT BOARD AND METHOD OF MAKING THE SAME - A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copperplate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed.||09-05-2013|
|20130155629||Hermetic Semiconductor Package Structure and Method for Manufacturing the same - The invention provides a semiconductor package structure, comprising: a substrate having a first surface and a second surface; a first conductive layer plated on the first surface; a semiconductor element attached to the first conductive layer on the first surface of the substrate for electrically connecting; a second conductive layer plated on the first surface and surrounded the semiconductor element and the first conductive layer, wherein the height of the second conductive layer is higher than the first conductive layer; and a lid attached to the top of the second conductive layer for sealing the semiconductor element.||06-20-2013|
|20130153016||Solar Cell Flip Chip Package Structure and Method for Manufacturing the same - The present invention provides a solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.||06-20-2013|
|20130127004||Image Sensor Module Package and Manufacturing Method Thereof - An image sensor module includes a substrate, a circuit layer, a flip chip, an insulating layer, and a conducting layer. The substrate has at least one transparent area and defines a first surface and a second surface. The circuit layer is provided on the first surface of the substrate. The flip chip is connected to the circuit layer. The insulating layer substantially encases the flip chip and a part of the circuit layer, wherein the insulating layer has at least one groove at a lateral side of said insulating layer thereof each provided with a metal layer. The conducting layer is provided on a top surface of the insulating layer, wherein the conducting layer is electrically connected to the circuit layer via the metal layer.||05-23-2013|
|20120171510||CERAMIC PLATE WITH REFLECTIVE FILM AND METHOD OF MANUFACTURING THE SAME - A ceramic plate with reflective film and method of manufacturing the same are provided. The ceramic plate with reflective film at least comprises a ceramic substrate and a reflective film. The reflective film at least includes a glass layer and a metal film with metal crystals. Each of the metal crystals possesses a particular diameter for providing high infrared reflectivity with a particular wavelength.||07-05-2012|
Patent applications by TONG HSING ELECTRONIC INDUSTRIES, LTD.