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TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION
| TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20090260783 | Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure and Applied Product Thereof - The invention provides a boil cooling method, a boil cooling apparatus, a flow channel structure, and applied products thereof, by which noise and vibration attending on cooling by microbubble emission boiling can be effectively reduced, and efficient boil cooling can be realized. | 10-22-2009 |