Tokyo Seimitsu Co., Ltd.
|Tokyo Seimitsu Co., Ltd. Patent applications|
|Patent application number||Title||Published|
|20140300903||ANGLE MEASURING METHOD AND ANGLE MEASURING SYSTEM - An angle measuring system including: a rotary encoder including an encoder main body and a rotating shaft which is freely rotatable with respect to the encoder main body, the rotary encoder which detects a relative rotation angle of the rotating shaft with respect to the encoder main body; a regulation member which regulates an absolute rotation angle of the encoder main body about the rotating shaft within a fixed range; an absolute angle detecting device which detects the absolute rotation angle of the encoder main body about the rotating shaft concurrently with detection of the relative rotation angle by the rotary encoder; and a correction device which corrects the rotation angle detected by the rotary encoder based on the rotation angle detected by the absolute angle detecting device.||10-09-2014|
|20120185210||CIRCULARITY MEASURING APPARATUS AND MEASUREMENT VALUE CORRECTING METHOD FOR CIRCULARITY MEASURING METHOD - According to the present invention, a center deviation amount, which is an amount of deviation (distance) between the center line of a reference measurement target and the detection point is calculated using the reference measurement target having a known diameter, and a measurement value of a diameter of an arbitrary measurement target is corrected using the center deviation amount. Therefore, an accurate diameter value can be calculated even in the case of a measurement target having a diameter value different from the diameter value of the reference measurement target.||07-19-2012|
|20110024020||TAPE ADHERING METHOD AND TAPE ADHERING DEVICE - A tape adhering device (||02-03-2011|
|20100005815||Liquid discharge method and liquid discharger in temperature controlller - There is disclosed a liquid discharge method in a temperature controller having a refrigerant circulation line circulating a refrigerant to a target of temperature control and a heater heating the target, wherein the refrigerant is circulated so as to control the temperature of the target with the refrigerant and the heater in the case where the temperature of the target is controlled to be a first temperature lower than or equal to a room temperature, wherein the circulation of the refrigerant is stopped so as to control the temperature of the target with the heater in the case where the temperature of the target is controlled to be a second temperature higher than the room temperature, wherein in the case of changing the setpoint of the target from the first temperature to the second temperature, when the temperature of the refrigerant rises to reach a first predetermined temperature lower than or equal to the boiling point of the refrigerant, the circulation of the refrigerant is stopped, one of air and an inert gas is fed to the refrigerant circulation line so as to discharge the refrigerant in the target, and simultaneously, the temperature of the target continues to be raised with the heater; and when the temperature of the target rises to reach a second predetermined temperature higher than the boiling point of the refrigerant, the one of the air and the inert gas is again fed to the refrigerant circulation line so as to discharge the refrigerant remaining in the target.||01-14-2010|
|20090249867||Displacement Detector - A displacement detector capable of making a measurement in two directions of measurement 180 degrees different from each other without the need of a switching operation has been disclosed. This displacement detector comprises a contact arm||10-08-2009|
|20090244528||BLADE BREAKAGE AND ABRASION DETECTING DEVICE - The present invention provides a blade breakage and abrasion detecting device comprising: a detecting unit including a light-emitting unit which is provided close to a side of a blade to emit a round shape light toward the blade, and a light receiving unit which is provided opposed to the light-emitting unit as sandwiching the blade to receive the round shape light from the light-emitting unit with a round shape light receiving area; a moving device which moves the detecting unit toward a rotation center of the blade; and a control unit which detects a breakage of the blade based on a change of an amount of light received by the light receiving unit of the detecting unit, and calculates an abrasion amount of the blade by accumulating a moving amount obtained by controlling the moving device to moves the detecting unit toward the rotation center of the blade.||10-01-2009|
|20090042489||WAFER POLISHING APPARATUS AND WAFER POLISHING METHOD - A wafer polishing in which a polishing liquid is supplied to a polishing pad for polishing a wafer carried on a carrier head; and the polishing liquid is supplied from one or more polishing liquid supplying devices onto the polishing pad, by a polishing liquid supplying member of the polishing liquid supplying device being positioned close to or in contact with the polishing pad, and is relatively moved against the polishing pad, so that the polishing liquid supplied to the upper portion of the polishing liquid supplying member flows down along the polishing liquid supplying member to be painted on a surface of the polishing pad.||02-12-2009|
|20090035879||LASER DICING DEVICE AND LASER DICING METHOD - An object is to provide a laser dicing apparatus and a laser dicing method capable of speedily performing high-quality dicing without causing any working defect even in a case where wafers varying in thickness are supplied. The laser dicing apparatus is provided with a measuring device which measures thickness of a wafer W, a recording device which stores a database in which modified region forming conditions associated with different thicknesses of the wafer W are described, and a control device which controls the laser dicing apparatus by automatically selecting, from the database, on the basis of the thickness of the wafer measured by the measuring device, the modified region forming conditions corresponding to the measured thickness of the wafer W. The optimum modified region forming conditions are thereby automatically set, so that even in a case where wafers W differing in thickness are supplied, high-quality dicing can be speedily performed without causing a working defect.||02-05-2009|
Patent applications by Tokyo Seimitsu Co., Ltd.