| TOKYO OHKA KOGYO CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120135347 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND AND COMPOUND - There are provided a resist composition, a method of forming a resist pattern using the resist composition, a novel polymeric compound and a compound useful as a monomer for the polymeric compound,
| 05-31-2012 |
| 20120132359 | ATTACHING DEVICE AND ATTACHING APPARATUS FOR SUPPORTING PLATE, AND ATTACHING METHOD FOR SUPPORTING PLATE - An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled. | 05-31-2012 |
| 20120132109 | PAINTABLE DIFFUSING AGENT COMPOSITION - A diffusing agent composition of an aspect of the invention contains: a condensation product (A) made from a starting material that is an alkoxysilane represented by the following general formula (1): | 05-31-2012 |
| 20120118511 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure. | 05-17-2012 |
| 20120107744 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, NOVEL COMPOUND AND ACID GENERATOR - A resist composition containing a base component (A) which exhibits changed solubility in a developing solution under the action of acid, and an acid generator component (B) which generates acid upon exposure, wherein the acid generator component (B) includes an acid generator (B1) having a group represented by general formula (b1-1) shown below in the cation moiety. | 05-03-2012 |
| 20120100487 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - A resist composition including a base component that generates acid upon exposure and also exhibits increased polarity by action of acid, the base component including a polymeric compound having a structural unit that generates acid upon exposure; a structural unit derived from an acrylate ester, in which a hydrogen atom bonded to a carbon atom on the α-position may be substituted with a substituent, and also includes an acid decomposable group that exhibits increased polarity by action of acid; and a structural unit represented by a particular general formula. | 04-26-2012 |
| 20120083561 | ADHESIVE COMPOSITION - An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided. | 04-05-2012 |
| 20120079983 | COATING DEVICE - Provided is a coating device including: a rotating part which rotatably holds a substrate while the substrate is upright; a cup portion disposed to surround an outer periphery of the substrate held by the rotating part and having an opening which exposes a first surface and a second surface of the substrate; a coating part which includes a nozzle ejecting a liquid material to the first surface and to the second surface of the substrate through the opening; and a cover portion which is provided on the first surface and the second surface sides of the substrate and by which the opening is opened and closed. | 04-05-2012 |
| 20120077125 | RESIST COMPOSITION FOR IMMERSION EXPOSURE, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND FLUORINE-CONTAINING COMPOUND - A resist composition for immersion exposure, including a base component that exhibits changed solubility in an alkali developing solution under action of acid, an acid generator component that generates acid upon exposure, and a fluorine-containing compound represented by a general formula (c-1) that is decomposable in an alkali developing solution: | 03-29-2012 |
| 20120073741 | ADHESIVE COMPOSITION - An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio). | 03-29-2012 |
| 20120058430 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, NOVEL COMPOUND, AND ACID GENERATOR - A positive resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under the action of acid and an acid-generator component (B) which generates acid upon exposure, wherein the acid-generator component (B) includes an acid generator (B1) containing a compound represented by general formula (b1-1) shown below (wherein Z | 03-08-2012 |
| 20120031443 | CLEANING DEVICE, CLEANING METHOD, AND COMPOSITION - A cleaning device for cleaning a substrate adhering to a support film, including a protective film forming measure for forming a protective film on an exposed surface of the support film, wherein the exposed surface is a portion of a surface of the support film to which a first surface of the substrate adheres, but the substrate does not adheres to the exposed surface; and a cleaning measure for cleaning the substrate by use of a cleaning liquid, the substrate adhering to the support film covered with the protective film. The cleaning device can effectively clean a wafer supported by a dicing tape. | 02-09-2012 |
| 20120015299 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, NOVEL COMPOUND, AND ACID GENERATOR - A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) represented by general formula (b1-1) [in the formula, Y | 01-19-2012 |
| 20120009521 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR - A resist composition including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid; and an acid-generator component (B) which generates acid upon exposure, wherein said acid-generator component (B) comprises an acid generator (B1) including a compound represented by general formula (b1-11) shown below:
| 01-12-2012 |
| 20120009520 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A1) having a structural unit (a1) derived from an acrylate ester which may have an atom other than hydrogen or a group bonded to the carbon atom on the α position and containing an acid dissociable, dissolution inhibiting group, and a structural unit (a0) containing an —SO | 01-12-2012 |
| 20110311913 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including: a base component (A′) that exhibits increased solubility in an alkali developing solution under action of acid, without including an acid generator component other than the base component (A′), wherein the base component (A′) includes a resin component (A1) having a structural unit (a0-1) represented by general formula (a0-1) shown below and a structural unit (a1) containing an acid dissociable, dissolution inhibiting group: | 12-22-2011 |
| 20110311912 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including:
| 12-22-2011 |
| 20110290178 | COATING DEVICE - Provided is a coating device including: a substrate carrying unit which rotatably holds a substrate while the substrate is upright and is able to dispose the held substrate at a first position and a second position; an application unit which includes a liquid material nozzle ejecting a liquid material to each of first and second surfaces of the substrate disposed at the first position; and a removal unit which includes an accommodation mechanism accommodating a part of the peripheral edge portion of the substrate disposed at the second position and a cleaning liquid ejection mechanism ejecting a cleaning liquid to the peripheral edge portion and removes the liquid material of the peripheral edge portion. | 12-01-2011 |
| 20110287362 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, NOVEL COMPOUND, AND ACID GENERATOR - A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) represented by general formula (b1-1) shown below (in the formula, R | 11-24-2011 |
| 20110269076 | SURFACE MODIFYING MATERIAL, METHOD OF FORMING RESIST PATTERN, AND METHOD OF FORMING PATTERN - A surface modifying material for forming a surface modifying layer provided between a substrate and a resist film, the surface modifying material including an epoxy resin having a weight average molecular weight of 1,000 to 50,000;
| 11-03-2011 |
| 20110265815 | METHOD OF CLEANING SUPPORT PLATE - The present invention achieves a method of cleaning a support plate according to which, while no waste solution is produced after cleaning the support plate, the support plate can be treated at low cost. The method of cleaning the support plate includes the step of performing an organic substance and metal each adhered to the support plate by causing dry ice particle to hit the support plate, the support plate being a support plate from which a substrate has been stripped. | 11-03-2011 |
| 20110263110 | FILM-FORMING COMPOSITION - A film-forming composition for use in a coating diffusion method, capable of diffusing a dopant at a higher concentration, and further capable of concomitantly forming a silica-based coating film is provided. A film-forming composition for constituting a diffusion film provided for diffusing a dopant element into a silicon wafer, the film-forming composition including: (A) a polymeric silicon compound; (B) an oxide of the dopant element, or a salt including the dopant element; and (C) porogene. | 10-27-2011 |
| 20110262872 | METHOD OF FORMING RESIST PATTERN AND RESIST COMPOSITION - There are provided a method of forming a resist pattern in which a resist pattern is formed on top of a substrate by using a chemically amplified resist composition and conducting patterning two or more times, the method being capable of reducing the extent of damage, caused by the second patterning, imposed upon the first resist pattern that is formed by the first patterning; as well as a resist composition that is useful for forming the first resist pattern in this method of forming a resist pattern. The method includes forming of a first resist pattern using a resist composition containing a thermal base generator as a chemically amplified resist composition during first patterning, and then conducting a hard bake for baking the first resist pattern under a bake condition such that a base is generated from the thermal base generator, prior to the second patterning. | 10-27-2011 |
| 20110262864 | Method of forming resist pattern and negative tone-development resist composition - A method of forming a resist pattern, including: forming a resist film on a substrate using a resist composition containing a base component (A) which exhibits decreased solubility in an organic solvent under action of an acid and an acid-generator component (B) which generates an acid upon exposure, conducting exposure of the resist film, and patterning the resist film by a negative tone development using a developing solution containing an organic solvent, wherein the base component (A) includes a resin component (A1) containing a structural unit (a0) derived from an acrylate ester containing an acid decomposable group which generates an alcoholic hydroxy group by the action of acid to thereby exhibit increased hydrophilicity. | 10-27-2011 |
| 20110259527 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 10-27-2011 |
| 20110256484 | METHOD FOR PRODUCING COMB-SHAPED ELECTRODE - To provide a method for producing a comb-shaped electrode capable of precisely carrying a large amount of active materials on a surface of current collectors with a fine shape. The method for producing comb-shaped electrodes | 10-20-2011 |
| 20110254191 | FILM-FORMING COMPOSITION FOR IMPRINTING, METHOD OF MANUFACTURING A STRUCTURE, AND STRUCTURE - A film-forming composition for imprinting that enables a structure to be obtained after coating the composition on a substrate and pressing a mold thereto with low compression pressure, a method of manufacturing a structure using the film-forming composition for imprinting, and a structure obtained thereby. The film-forming composition for imprinting according to the present invention contains a resin and an organic solvent, in which the organic solvent includes a particular solvent having a boiling point of 100 to 200° C. at ambient pressure. When the structure is manufactured, the film-forming composition for imprinting according to the present invention is coated on a substrate to form a resin layer, and after a mold is pressed against the resin layer, the mold is released from the resin layer. | 10-20-2011 |
| 20110244399 | METHOD OF FORMING RESIST PATTERN AND NEGATIVE TONE-DEVELOPMENT RESIST COMPOSITION - A method of forming a resist pattern, including: forming a resist film on a substrate using a resist composition containing a base component (A) which exhibits decreased solubility in an organic solvent under action of an acid and an acid-generator component (B) which generates an acid upon exposure, conducting exposure of the resist film, and patterning the resist film by a negative tone development using a developing solution containing an organic solvent, wherein the base component (A) includes a resin component (A1) containing a structural unit (a1) derived from an acrylate ester containing an acid decomposable group which exhibits increased hydrophilicity by the action of an acid and a structural unit (a0) derived from an acrylate ester containing an —SO | 10-06-2011 |
| 20110244392 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN AND POLYMERIC COMPOUND - A positive resist composition including a base component (A′) which exhibits increased solubility in an alkali developing solution under the action of acid and generates acid upon exposure, the base component (A′) including a resin component (A1) having a structural unit (a0-1) represented by general formula (a0-1), a structural unit (a0-2) which generates acid upon exposure and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group (wherein R | 10-06-2011 |
| 20110240231 | STRIPPING METHOD AND STRIPPING SOLUTION - A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent. | 10-06-2011 |
| 20110236824 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid, an acid-generator component (B) which generates acid upon exposure and a fluorine-containing polymeric compound (C′) which generates acid upon exposure, the base component (A) having a structural unit (a0-1) represented by general formula (a0-1) and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group, and the fluorine-containing polymeric compound (C′) having a structural unit (c0) which generates acid upon exposure and a structural unit (c1) represented by formula (c1) (wherein R | 09-29-2011 |
| 20110195573 | CLEANING LIQUID FOR LITHOGRAPHY AND METHOD FOR FORMING WIRING - Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to ILD materials, and excellent removal performance in relation to a resist film and a bottom antireflective coating film, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water soluble organic solvent, water, and an inorganic base. The water soluble organic solvent contains a highly polar solvent having a dipole moment of no less than 3.0 D, a glycol ether solvent and a polyhydric alcohol, and the total content of the highly polar solvent and the glycol ether solvent is no less than 30% by mass relative to the total mass of the liquid for lithography. | 08-11-2011 |
| 20110195190 | SURFACE TREATMENT LIQUID, SURFACE TREATMENT METHOD, HYDROPHOBILIZATION METHOD, AND HYDROPHOBILIZED SUBSTRATE - Disclosed is a surface treatment liquid which enables simple and efficient hydrophobilization of a substrate and prevention of collapse of a resin pattern or etched pattern. Also disclosed are a surface treatment method using the surface treatment liquid, a hydrophobilization method using the surface treatment liquid, and a hydrophobilized substrate. When a substrate is hydrophobilized, the substrate is coated with a surface treatment liquid containing a silylating agent and a hydrocarbon non-polar solvent. When a pattern is prevented from collapse, the surface of a resin pattern formed on a substrate or etched pattern formed on a substrate by etching is treated using a surface treatment liquid containing a silylating agent and a solvent. | 08-11-2011 |
| 20110189833 | SILICA-BASED FILM FORMING MATERIAL FOR FORMATION OF AIR GAPS, AND METHOD FOR FORMING AIR GAPS - Provided is a silica-based film forming material for formation of air gaps, the material being capable of forming air gaps without employing a CVD method. A silica-based film forming material for formation of air gaps including (a) a certain siloxane polymer, (b) an alkanolamine, and (c) an organic solvent is used when a silica-based film is formed with a spin coating method. According to this silica-based film forming material for formation of air gaps, air gaps with a great degree of opening can be formed even when coated with a spin coating method, without filling the recessed parts. | 08-04-2011 |
| 20110165512 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, an acid-generator component (B) that generates acid upon exposure, and a nitrogen-containing organic compound (D), wherein the acid generator component (B) includes an acid generator (B1) consisting of a compound represented by general formula (b0), and the nitrogen-containing organic compound (D) includes a compound represented by general formula (d1) or general formula (d2) [wherein each of R | 07-07-2011 |
| 20110159447 | DEVELOPING SOLUTION FOR PHOTOLITHOGRAPHY, METHOD FOR FORMING RESIST PATTERN, AND METHOD AND APPARATUS FOR PRODUCING DEVELOPING SOLUTION FOR PHOTOLITHOGRAPHY - Firstly, to provide a developing solution for photolithography in which tetrabutylammonium hydroxide (TBAH) is used as an alkaline agent of the developing solution and deposition of TBAH is suppressed. Secondary, to provide a method for producing a developing solution for photolithography capable of suppressing TBAH deposition when producing the developing solution by diluting a concentrated developing solution containing TBAH and a production apparatus used for the production method. The present invention is firstly a developing solution for photolithography comprising tetrabutylammonium hydroxide (A), and at least one selected from the group consisting of a water-soluble organic solvent (B1), a surfactant (B2), and a clathrate compound (B3). The present invention is secondary characterized by maintaining the temperature of liquid at 27° C. or higher during dilution. | 06-30-2011 |
| 20110146899 | SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE - A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate. | 06-23-2011 |
| 20110129998 | CLEANING LIQUID FOR LITHOGRAPHY AND METHOD FOR FORMING WIRING - Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to tungsten, and excellent removal performance in relation to a resist film or the like, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water-soluble organic solvent, water, an inorganic salt and an anti-corrosion agent represented by a general formula (1) below. | 06-02-2011 |
| 20110118494 | SURFACE TREATMENT AGENT AND SURFACE TREATMENT METHOD - Provided are a surface treatment agent for which hydrophobization to a high degree is possible even in a case of the material of a substrate surface being TiN or SiN, and surface treatment method using such a surface treatment agent. The surface treatment agent according to the present invention contains a cyclic silazane compound. As this cyclic silazane compound, a cyclic disilazane compound such as 2,2,5,5-tetramethyl-2,5-disila- | 05-19-2011 |
| 20110117499 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND FLUORINE-CONTAINING POLYMERIC COMPOUND - A fluorine-containing polymeric compound which contains a structural unit (f1) that is decomposable in an alkali developing solution as a block copolymer portion, a base component (A) that exhibits increased solubility in an alkali developing solution under the action of acid, and an acid generator component (B) that generates acid upon exposure. | 05-19-2011 |
| 20110117491 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including a base material component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, an acid generator component (B) that generates acid upon exposure, and an nitrogen-containing organic compound (D), wherein the nitrogen-containing organic compound (D) includes a compound represented by general formula (d1) shown below: | 05-19-2011 |
| 20110111343 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits increased solubility in an alkali developing solution under the action of acid and an acid-generator component (B), the resin component (A) including a polymeric compound (A1) having a structural unit (a1) containing an acid dissociable, dissolution inhibiting group, a structural unit (a5) containing a base dissociable group an a structural unit (a6) represented by general formula (a6-1) (R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; each of R | 05-12-2011 |
| 20110108095 | MASK MATERIAL COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR BATTERY - A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): | 05-12-2011 |
| 20110097667 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group. | 04-28-2011 |
| 20110091810 | COMPOUND, DISSOLUTION INHIBITOR, POSITIVE TYPE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition. | 04-21-2011 |
| 20110079262 | DIFFUSING AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR BATTERY - An embodiment of the present invention relates to a diffusing agent composition used in printing an impurity-diffusing component onto a semiconductor substrate, wherein the diffusing agent composition contains: a hydrolysis product of alkoxysilane (A); a component (B) containing at least one selected from the group consisting of a hydrolysis product of alkoxy titanium, a hydrolysis product of alkoxy zirconium, titania fine particle, and zirconia fine particle; an impurity-diffusing component (C); and an organic solvent (D). | 04-07-2011 |
| 20110073011 | SURFACE TREATMENT AGENT AND SURFACE TREATMENT METHOD - Provided are a surface treatment agent that can effectively suppress pattern collapse of an inorganic pattern or resin pattern provided on a substrate, a surface treatment method using such a surface treatment agent, as well as a surface treatment agent that can carry out silylation treatment to a high degree on the surface of a substrate, and a surface treatment method using such a surface treatment agent. A surface treatment agent is used that is employed in hydrophobization treatment of a substrate surface and includes a silylation agent containing at least one compound having a disilazane structure and a solvent containing a five- or six-membered ring lactone compound. | 03-31-2011 |
| 20110065878 | Norbornene-Type Polymers, Compositions Thereof And Lithographic Processes Using Such Compositions - Embodiments of the present invention relate generally to non-self imagable and imagable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and the immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming imaging layer and top-coat layers for overlying such imaging layers in immersion lithographic process and the process thereof. | 03-17-2011 |
| 20110065858 | Adhesive composition and adhesive film - An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.). | 03-17-2011 |
| 20110065053 | MATERIAL FOR FORMING PROTECTIVE FILM AND METHOD FOR FORMING PHOTORESIST PATTERN - The present invention provides a material for forming a protective film that has favorable alkali solubility and gives a protective film excelling in water repellency, as well as a method for forming a photoresist pattern using this material for forming a protective film. The material for forming a protective film of the present invention contains an alkali-soluble polymer having a unit derived from a monomer represented by the following general formula (A-1) as a constitutional unit. | 03-17-2011 |
| 20110064913 | POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION - Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily. | 03-17-2011 |
| 20110059574 | COATING APPARATUS AND COATING METHOD - A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating section in which the coating part applies the liquid material on the substrate and a transport section into which the liquid material is transported; an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber; and a control part which stops an operation of the coating part in response to the entrance of foreign object into the chamber. | 03-10-2011 |
| 20110059250 | COATING METHOD AND COATING APPARATUS - A coating method including coating a liquid material including an oxidizable metal on a substrate a plurality of times to laminate a plurality of liquid material layers on the substrate; and adjusting at least one of oxygen concentration and humidity inside a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the liquid material is transported. | 03-10-2011 |
| 20110059248 | COATING METHOD AND COATING APPARATUS - A coating method including coating a liquid material including an oxidizable metal on a substrate, and heating the substrate having the liquid material coated thereon in the presence of an inert gas. | 03-10-2011 |
| 20110059246 | COATING APPARATUS AND COATING METHOD - A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the liquid material is transported; and an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber. | 03-10-2011 |
| 20110059245 | COATING APPARATUS AND COATING METHOD - A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate, a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the substrate is transported, and a removal unit which removes the liquid material from the inside of the chamber when at least one of oxygen concentration and humidity inside the chamber exceeds a threshold value. | 03-10-2011 |
| 20110054184 | SURFACE TREATMENT AGENT AND SURFACE TREATMENT METHOD - The object is to provide a surface treatment agent that can effectively prevent pattern collapse of an inorganic pattern or resin pattern provided on a substrate, and a surface treatment method using such a surface treatment agent. In addition, as another object, the present invention has an object of providing a surface treatment agent that can carry out silylation treatment to a high degree on the surface of a substrate, and a surface treatment method using such a surface treatment agent. The surface treatment agent used in the surface treatment of a substrate contains a silylation agent and a silylated heterocyclic compound. | 03-03-2011 |
| 20110039207 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition that includes a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, an acid generator component (B) that generates acid upon exposure, and an epoxy resin (G). Also, a method of forming a resist pattern that includes using the above resist composition to form a resist film on the substrate, conducting exposure of the resist film, and alkali-developing the resist film to form a resist pattern. | 02-17-2011 |
| 20110017291 | DIFFUSING AGENT COMPOSITION FOR INK-JET, AND METHOD FOR PRODUCTION OF ELECTRODE OR SOLAR BATTERY USING THE COMPOSITION - Provided are: a diffusing agent composition for ink-jet; a method for production of electrode and solar battery using the diffusing agent composition; and a solar battery produced by the method for production. The diffusing agent composition for ink-jet includes (a) a silicon compound, (b) an impurity-diffusing component and (c) a solvent, in which: the solvent (c) contains (c1) a solvent having a boiling point of no higher than 100° C. and (c2) a solvent having a boiling point of 180 to 230° C.; and the solvent (c1) is contained at a ratio of 70 to 90% by mass and the solvent (c2) is contained at a ratio of 1 to 20% by mass both relative to the total mass of the composition. | 01-27-2011 |
| 20110008728 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including: a base component which exhibits changed solubility in an alkali developing solution under the action of acid; and an acid-generator component containing an acid generator (B1) consisting of a compound represented by general formula (b1); dissolved in an organic solvent containing an alcohol-based organic solvent having a boiling point of at least 150° C., wherein R | 01-13-2011 |
| 20110008534 | COATING DEVICE AND NOZZLE MANAGING METHOD - A coating device including a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state, and a nozzle managing mechanism which manages the state of the nozzles, in which the nozzle managing mechanism includes a soaking portion which dips the front end of the nozzle in a soak solution, and a discharging portion which discharges at least the soak solution, and a nozzle managing method. | 01-13-2011 |
| 20110000428 | Substrate processing system - A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state at a predetermined coating position, a carrying mechanism which carries the substrate between a substrate loading position, the coating position, and a substrate unloading position, and a dummy substrate holding mechanism which holds a dummy substrate at a holding position which is a position different from the substrate loading position, the coating position, and the substrate unloading position, and at which the carrying mechanism is allowed to connect with the dummy substrate. | 01-06-2011 |
| 20100326354 | SUBSTRATE PROCESSING SYSTEM, CARRYING DEVICE, AND COATING DEVICE - A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state. | 12-30-2010 |
| 20100310985 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a base component, an acid-generator component and a fluorine-containing polymer component (F) in a specific amount, the fluorine-containing polymer component (F) including a fluorine-containing polymer (F1) consisting of a structural unit (F-1) represented by general formula (F-1) (R | 12-09-2010 |
| 20100304551 | PROTECTIVE FILM AGENT FOR LASER DICING AND WAFER PROCESSING METHOD USING THE PROTECTIVE FILM AGENT - A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions. | 12-02-2010 |
| 20100304289 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) and an acid-generator component (B), the resin component (A) including a structural unit (a1) derived from hydroxystyrene, and a structural unit (a2) having an acetal-type acid dissociable dissolution inhibiting group, and the acid-generator component (B) including an acid generator (B1- | 12-02-2010 |
| 20100297560 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - A positive resist composition including a base component (A′) which exhibits increased solubility in an alkali developing solution under action of acid and generates acid upon exposure, the base component (A′) including a polymeric compound (A1′) having a structural unit (a5-1) represented by general formula (a5-1), a structural unit (a0-1) represented by general formula (a0-1) and a structural unit (a0-2) that generates acid upon exposure, the structural unit (a0-2) containing a group represented by general formula (a0-2′) (wherein represents an anion moiety represented by one of general formulas (1) to (5)). | 11-25-2010 |
| 20100297353 | COATING DEVICE AND COATING METHOD - A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves and removes a thin film formed on the outer periphery of the substrate; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution. | 11-25-2010 |
| 20100297352 | COATING DEVICE AND COATING METHOD - A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution. | 11-25-2010 |
| 20100273106 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid and an acid generator component (B) which generates acid upon exposure, wherein the base component (A) includes a polymeric compound (A1) having a structural unit (a0) containing an acid-dissociable, dissolution-inhibiting group, and the acid-dissociable, dissolution-inhibiting group has a 1,3-dioxole skeleton. | 10-28-2010 |
| 20100273105 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND METHOD OF PRODUCING THE SAME, ACID GENERATOR - A resist composition including a base material component (A) which exhibits changed solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates acid upon exposure,
| 10-28-2010 |
| 20100266955 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the component (A) including a polymeric compound (A1) having a structural unit (a0) represented by general formula (a0-1) (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; R | 10-21-2010 |
| 20100255429 | FINE PATTERN FORMING METHOD AND COAT FILM FORMING MATERIAL - Provided are a fine pattern forming method for forming a fine resin pattern having an excellent shape on a supporting body, and a coat film forming material used in the fine pattern forming method. A photosensitive resin composition is applied on the supporting body, selectively exposed and developed to form a first resin pattern. On the surface of the first resin pattern, a coat film composed of a water-soluble resin film is formed to form a coat pattern, then, on the supporting body whereupon the coat pattern is formed, a resin composition containing a photo-acid generating agent is applied, and the entire surface is exposed. Then, the work is cleaned by a solvent, and a second resin pattern wherein a resin film is formed on the surface of the coat pattern is formed. The coat film is formed by using the coat film forming material composed of an aqueous solution containing a water soluble resin and a water soluble cross-linking agent. | 10-07-2010 |
| 20100248164 | CLEANING LIQUID FOR LITHOGRAPHY AND METHOD FOR FORMING A RESIST PATTERN USING THE SAME - Provided are a cleaning liquid for lithography capable of suppressing occurrence of CD shift without inhibiting the effect of preventing pattern collapse by a surfactant, and a pattern formation method using the cleaning liquid for lithography. A cleaning liquid for lithography containing (A) an anionic surfactant, (B) an amine compound, and (C) water. In the cleaning liquid for lithography of the present invention, the anionic surfactant and the amine compound form a salt in the cleaning liquid for lithography, and thus penetration of the anionic surfactant into a resist film can be suppressed. Therefore, even when a method for forming a resist pattern is performed, the resist film is not dissolved by using the cleaning liquid for lithography of the present invention, whereby occurrence of CD shift can be efficiently suppressed. | 09-30-2010 |
| 20100248148 | POLYMER COMPOUND, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - There is provided a positive resist composition including a resin component (A) which displays increased solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) includes a polymer compound (A1) containing a structural unit (a0) represented by a general formula (a0-1) shown below, and a structural unit (a1) derived from an acrylate ester which has an acid dissociable, dissolution inhibiting group: | 09-30-2010 |
| 20100248144 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN - The positive resist composition including a base material component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid generator component (B) which generates acid upon exposure,
| 09-30-2010 |
| 20100248133 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including: a polymer (A1) including a structural unit (a0) represented by general formula (a0) shown below and no structural unit (a1) derived from an acrylate ester containing an acetal-type acid dissociable, dissolution inhibiting group, exclusive of the structural unit (a0), and a polymer (A2) including the structural unit (a1) and no structural unit (a0). | 09-30-2010 |
| 20100247799 | APPLICATION LIQUID AND METHOD FOR FORMATION OF A SILICA-BASED COATING FILM USING THE APPLICATION LIQUID - An application liquid capable of forming a dense silica-based coating film even when embedded into a fine groove, and a method for formation of a silica-based coating film using the application liquid are provided. An application liquid is used including (A) a siloxane polymer, and (B) a base generator represented by the following general formula (I): | 09-30-2010 |
| 20100236998 | CHARGING APPARATUS - Intended is to reduce pressure fluctuations across a filter ( | 09-23-2010 |
| 20100233626 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a polymeric compound (A1) having a structural unit (a0) represented by general formula (a0-1) (R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, R | 09-16-2010 |
| 20100233625 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid, and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) having an aromatic group, a structural unit (a5) represented by general formula (a5-1) shown below, and a structural unit (a1) containing an acid-dissociable, dissolution-inhibiting group. In the formula (a5-1), R | 09-16-2010 |
| 20100233624 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the component (A) including a polymeric compound (A1) having an acid dissociable, dissolution inhibiting group in the structure thereof and including a structural unit (a0) having an —SO | 09-16-2010 |
| 20100233623 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including:
| 09-16-2010 |
| 20100209848 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - A polymeric compound (A1) includes a structural unit (a0-1) represented by general formula (a0-1), a structural unit (a0-2) represented by general formula (a0-2), and a structural unit (a1-0-1) represented by general formula (a1-0-1), wherein relative to the combined total of all the structural units, the proportion of the structural unit (a0-1) is from 10 to 40 mol %, the proportion of the structural unit (a0-2) is from 5 to 20 mol %, and the proportion of the structural unit (a1-0-1) is from 10 to 55 mol %. [In the formulas, each of R | 08-19-2010 |
| 20100209847 | COPOLYMER, RESIN COMPOSITION, SPACER FOR DISPLAY PANEL, PLANARIZATION FILM, THERMOSETTING PROTECTIVE FILM, MICROLENS, AND PROCESS FOR PRODUCING COPOLYMER - Without the use of a third monomer, no copolymer practicable as a base polymer for a radiation-sensitive resin composition has been obtained by copolymerizing two ingredients, i.e., a carboxylated monomer and an epoxidized monomer. A carboxylated monomer is reacted with a specific nonpolymerizable compound, and this reaction mixture is then copolymerized with an epoxidized monomer. A radiation-sensitive resin composition and a thermosetting resin composition each containing the resultant copolymer have satisfactory storage stability and are useful as a spacer for liquid-crystal display panels, etc., a planarization film for TFT elements, and a protective film for color filters. | 08-19-2010 |
| 20100196823 | POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN - A positive resist composition for immersion exposure including a resin component (A) which has acid dissociable, dissolution inhibiting groups and exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a cyclic principal chain polymer (A | 08-05-2010 |
| 20100196821 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND POLYMERIC COMPOUND - A positive resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under the action of acid and an acid-generator component (B) which generates acid upon exposure dissolved in an organic solvent (S), the base component (A) containing a polymeric compound (A1) including a structural unit (a0) derived from an acrylate ester having a cyclic group containing a sulfonyl group on the side chain thereof, a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group and a structural unit (a5) represented by general formula (a5-1) (Y | 08-05-2010 |
| 20100190108 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including:
| 07-29-2010 |
| 20100183974 | COMPOUND, METHOD FOR PRODUCING SAME, POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN - A compound of the present invention is a compound represented by a general formula (A-1) [wherein, R′ represents a hydrogen atom or an acid-dissociable, dissolution-inhibiting group, provided that at least one R′ group is an acid-dissociable, dissolution-inhibiting group, R | 07-22-2010 |
| 20100178609 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND - A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of an acid, and an acid generator component (B), wherein the base component (A) includes a polymeric compound (A0) containing a structural unit (a0) represented by the general formula (a0-1) shown below: | 07-15-2010 |
| 20100175744 | DIFFUSING AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR BATTERY - A diffusing agent composition is used for ink-jet printing and contains a P-type impurity-diffusing component (A), a water-soluble polymer compound (B) having an alcoholic hydroxyl group, and a solvent (C) containing an organic solvent having a surface tension of at most about 30 mN/m. | 07-15-2010 |
| 20100167217 | METHOD OF FORMING RESIST PATTERN - A method of forming a resist pattern that includes: applying a positive chemically amplified resist composition to a support to form a first resist film, exposing a region on a portion of the first resist film, performing a post exposure bake treatment and then performing developing to form a first resist pattern, and applying a negative chemically amplified resist composition to the support having the first resist pattern formed thereon, thereby forming a second resist film, exposing a region of the second resist film that includes the positions in which the first resist pattern has been formed, performing a post exposure bake treatment at a bake temperature that increases the solubility of the first resist film in an alkali developing solution and decreases the solubility of the second resist film in an alkali developing solution, and then performing developing to form a resist pattern. | 07-01-2010 |
| 20100151383 | POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN - A polymer compound that, within a chemically amplified positive resist system, exhibits a significant change in alkali solubility from a state prior to exposure to that following exposure, as well as a photoresist composition that includes such a polymer compound and a method for forming a resist pattern, which are capable of forming fine patterns with a high level of resolution. The polymer compound includes, as an alkali-soluble group (i), a substituent group in which a group selected from amongst alcoholic hydroxyl groups, carboxyl groups, and phenolic hydroxyl groups is protected with an acid dissociable, dissolution inhibiting group (ii) represented by a general formula (1) shown below: | 06-17-2010 |
| 20100143845 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a base material component (A) that exhibits increased solubility in an alkali developing solution under action of an acid; and an acid generator component (B) that generates an acid upon exposure, wherein the base material component (A) includes a polymeric compound (A1) having a structural unit (a10) derived from hydroxystyrene and a structural unit (a11) represented by general formula (a11-1) shown below: | 06-10-2010 |
| 20100136480 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of an acid; an acid generator component (B) which generates an acid upon exposure; and an organic solvent (S), wherein the base component (A) includes a polymeric compound (A1) which contains a structural unit (a0) represented by the general formula (a0-1) shown below:
| 06-03-2010 |
| 20100124720 | MATERIAL FOR PROTECTIVE FILM FORMATION, AND METHOD FOR PHOTORESIST PATTERN FORMATION USING THE SAME - This invention provides a material for protective film formation, comprising at least an alkali soluble polymer comprising at least one of constitutional units represented by general formulae (I) and (II) and an alcoholic solvent. The material for protective film formation can simultaneously prevent a deterioration in a resist film during liquid immersion exposure and a deterioration in a liquid for liquid immersion exposure used and, at the same time, can form a resist pattern with a good shape without the need to increase the number of treatment steps. | 05-20-2010 |
| 20100121077 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, NOVEL COMPOUND, AND ACID GENERATOR - A compound represented by general formula (I); and a compound represented by general formula (b1-1). | 05-13-2010 |
| 20100119939 | NEGATIVE ELECTRODE BASE MEMBER - The present invention aims to realize a battery having high output voltage, high energy density and excellent charge and discharge cycle characteristics through a constitution different from those of conventional batteries. Specifically, one of the following negative electrode base members is used as a negative electrode base member for lithium ion secondary batteries: a negative electrode base member wherein a metal film is formed on a support having an organic film; such a negative electrode base member wherein the surface layer of the organic film is covered with a metal oxide film; a negative electrode base member wherein a metal film is formed on a support having a composite film formed from a composite film-forming material containing an organic component and an inorganic component; and a negative electrode base member wherein a silica coating is formed, on a support having a photoresist pattern, from a silica film-forming coating liquid and a metal film is formed on the support after removing the photoresist pattern. | 05-13-2010 |
| 20100104972 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition of the present invention is obtained by dissolving a resin component (A) that displays changed alkali solubility under action of acid and an acid generator component (B) that generates acid upon exposure in an organic solvent (S), wherein the organic solvent (S) includes an aromatic organic solvent (S1). According to the present invention, a resist composition and a method of forming a resist pattern, in which the level of LWR is reduced, can be provided. | 04-29-2010 |
| 20100096080 | BONDING APPARATUS, METHOD FOR PREVENTING DISSOLVING OF ADHESDIVE AGENT, AND BONDING METHOD - A bonding unit ( | 04-22-2010 |
| 20100086873 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including: a base component (A) which includes a polymeric compound (A1) containing a structural unit (a0) represented by the general formula (a0-1) and a structural unit (a1) derived from an acrylate ester having an acid dissociable, dissolution inhibiting group; and an acid generator component (B) which includes an acid generator (B1) containing an anion moiety represented by the general formula (I): | 04-08-2010 |
| 20100081088 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR INCLUDING THE SAME - A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under the action of acid and an acid-generator component (B) which generates acid upon exposure, wherein the acid-generator component (B) includes an acid generator (B1) composed of a compound having a base dissociable group within a cation moiety. | 04-01-2010 |
| 20100081086 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1′) containing an acid dissociable, dissolution inhibiting group within the structure thereof and including a structural unit (a0) represented by general formula (a0-1) (R | 04-01-2010 |
| 20100075249 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits changed alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a copolymer (A1) containing a structural unit (a1) represented by general formula (II) or a polymer (A2) consisting of a structural unit (a1) represented by general formula (II) (wherein R represents a hydrogen atom, a halogen atom, a lower alkyl group or a halogenated lower alkyl group; each of R | 03-25-2010 |
| 20100075141 | ADHESIVE COMPOSITION AND FILM ADHESIVE - Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature. | 03-25-2010 |
| 20100069590 | COMPOUND AND POLYMERIC COMPOUND - A compound represented by general formula (I); and a polymeric compound including a structural unit (a1) represented by general formula (II). | 03-18-2010 |
| 20100062379 | METHOD OF FORMING RESIST PATTERN - Disclosed is a method of forming a resist pattern, including: applying a positive resist composition on a support | 03-11-2010 |
| 20100050940 | SUBSTRATE PROCESSING SYSTEM, CARRYING DEVICE AND COATING DEVICE - A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state. | 03-04-2010 |
| 20100047724 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including: a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid; and an acid-generator component (B) which generates acid upon exposure; dissolved in an organic solvent (S), the organic solvent (S) including an alcohol-based organic solvent having a boiling point of at least 150° C.; and a method of forming a resist pattern including: applying the positive resist composition on a substrate on which a first resist pattern is formed to form a second resist film; and subjecting the second resist film to selective exposure and alkali developing to form a resist pattern. | 02-25-2010 |
| 20100047715 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, CHEMICALLY AMPLIFIED DRY FILM FOR THICK FILM, AND METHOD FOR PRODUCTION OF THICK FILM RESIST PATTERN - Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure. | 02-25-2010 |
| 20100040973 | COMPOSITION FOR FORMATION OF RESIST PROTECTION FILM, AND METHOD FOR FORMATION OF RESIST PATTERN USING THE SAME - Disclosed are: a composition for forming a resist protection film, which shows less damage to a resist film, can form a good, rectangular resist pattern, and can be used regardless of the structure of a resin used in a resist composition; and a method for forming a resist pattern by using the composition. Specifically, disclosed are: a composition for forming a resist protection film, which comprises (a) an alkali-soluble polymer and (b) an ether-based solvent; and a method for forming a resist pattern by using the composition. | 02-18-2010 |
| 20100040970 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure,
| 02-18-2010 |
| 20100035192 | METHOD OF FORMING RESIST PATTERN - A method of forming a resist pattern including: forming a resist film on a substrate using a chemically amplified negative resist composition; forming a latent image of a first line and space pattern by subjecting the resist film to first exposure through a photomask; forming a latent image of a second line and space pattern so as to intersect with the latent image of the first line and space pattern by subjecting the resist film to second exposure through a photomask; and subjecting the resist film to developing to form a hole pattern in the resist film. | 02-11-2010 |
| 20100035177 | METHOD FOR FORMING PATTERN, AND MATERIAL FOR FORMING COATING FILM - A novel method for forming a pattern capable of decreasing the number of steps in a double patterning process, and a material for forming a coating film suitably used in the method for forming a pattern are provided. First resist film ( | 02-11-2010 |
| 20100028799 | RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD FOR RESIST PATTERN FORMATION - A resist composition for immersion exposure including a resin component (A) that exhibits changed alkali solubility under the action of acid, wherein the resin component (A) includes a polymer compound (A1) containing a structural unit (a0) having an acid-generating group that generates acid upon irradiation. | 02-04-2010 |
| 20100015555 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND NOVEL COMPOUND AND ACID GENERATOR - A resist composition including a base component that exhibits changed solubility in an alkali developing solution under the action of acid, and an acid generator consisting of a compound represented by general formula (b1). In formula (b1), Y | 01-21-2010 |
| 20100015553 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) having a structural unit (a0) represented by general formula (a0-1) (R represents a hydrogen atom, a C | 01-21-2010 |
| 20100015552 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR - A resist composition including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid; and an acid-generator component (B) which generates acid upon exposure, wherein said acid-generator component (B) comprises an acid generator (B1) including a compound represented by general formula (b1-11) shown below: | 01-21-2010 |
| 20100015548 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) and an acid generator component (B), the resin component (A) including a copolymer (A1) having a structural unit (a1) derived from an acrylate ester having a monocyclic or polycyclic group-containing acid dissociable, dissolution inhibiting group, a structural unit (a2) derived from an acrylate ester having a lactone-containing cyclic group, a structural unit (a3) derived from an acrylate ester having a hydroxyl group and/or cyano group-containing polycyclic group, and a structural unit (a4) represented by general formula (a4-1) shown below: | 01-21-2010 |
| 20100009291 | RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN - A resist composition for immersion exposure, including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of an acid, and contains no structural unit (c1) represented by the general formula (c1-1) shown below; an acid generator component (B) which generates an acid upon exposure; and a fluorine-containing resin component (C) which contains the structural unit (c1) | 01-14-2010 |
| 20100009284 | COMPOUND, POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A compound including a polyhydric phenol compound represented by general formula (I) shown below (wherein R | 01-14-2010 |
| 20100009084 | Coating apparatus, coating method and coating-film forming appratus - A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position. The nozzle is positioned above a non-recessed portion of the tray and supplies a coating liquid only onto a non-recessed portion of the upper surface of the tray to form a coating liquid pool, and the applicator is relatively movable in a horizontal direction in a state of maintaining a certain distance with respect to the upper surface of the substrate accommodated into the recessed portion and spreads the coating liquid of the coating liquid pool from the non-recessed portion of the upper surface of the tray over the entire upper surface of the substrate. | 01-14-2010 |
| 20090325467 | Method of Thinning Wafer and Support plate - A wafer can be thinned without occurrences of dimples. A support plate | 12-31-2009 |
| 20090318725 | HIGH REFRACTIVE INDEX MATERIAL - Disclosed is a high refractive index material having a high refractive index, which enables the formation of a waveguide by a simpler method. Also disclosed are a high refractive index member made from the high refractive index material, and an image sensor. The high refractive index material contains a resin (A) having a structural unit represented by the following general formula (a-1). | 12-24-2009 |
| 20090317745 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - Provided are a novel positive resist composition that includes a low molecular weight material as a base material component, and a method of forming a resist pattern using the positive resist composition. | 12-24-2009 |
| 20090317741 | COMPOUND, ACID GENERATOR, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - There is provided a resist composition which includes a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates an acid upon exposure, wherein the acid generator component (B) comprises an acid generator composed of a compound represented by the general formula (b1-2) shown below: | 12-24-2009 |
| 20090312573 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND - A compound represented by general formula (I) shown below; and a polymeric compound having a structural unit (a0) represented by general formula (a0-1) shown below: | 12-17-2009 |
| 20090312467 | SILSESQUIOXANE RESIN SYSTEMS WITH BASE ADDITIVES BEARING ELECTRON-ATTRACTING FUNCTIONALITIES - A silsesquioxane-based composition that contains (a) silsesquioxane resins that contain HSiO | 12-17-2009 |
| 20090305617 | Support plate, carrier device, releasing device, and releasing method - A support plate for supporting a wafer includes a plurality of through holes piercing the support plate in the thickness direction, and a belt-shaped or island-like flat portion on which the plurality of through holes are not formed. | 12-10-2009 |
| 20090305163 | NEGATIVE RESIST COMPOSITION - A negative resist composition is used for either a first or second resist layer within a method of forming a resist pattern that includes the following steps (i) and (ii): (i) a step of forming the first resist layer on a substrate using a first resist composition, and then conducting selective exposure that forms a dense pattern in the first resist layer, and (ii) a step of forming the second resist layer on top of the first resist layer using a second resist composition, and then conducting selective exposure that forms a pattern in the second resist layer, wherein the negative resist composition is dissolved in an alcohol-based organic solvent, which functions as an organic solvent (D) that does not dissolve the first or second resist layer that contacts the resist layer formed from the negative resist composition. | 12-10-2009 |
| 20090292053 | FILM-FORMING COMPOSITION - A film-forming composition for use in a coating diffusion method, capable of diffusing a dopant at a higher concentration, and further capable of concomitantly forming a silica-based coating film is provided. A film-forming composition for constituting a diffusion film provided for diffusing a dopant element into a silicon wafer, the film-forming composition including: (A) a polymeric silicon compound; (B) an oxide of the dopant element, or a salt including the dopant element; and (C) porogene. | 11-26-2009 |
| 20090291393 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN USING THE SAME - A positive photoresist composition capable of forming a film thickness of 5 μm or greater, preventing cracking due to thermal shock even if exposed to a low temperature atmosphere, having high sensitivity, and easily releasable with general solvents; and a method of forming a photoresist pattern using the positive photoresist composition. The positive photoresist composition contains (A) an alkali soluble novolak resin, (B) at least one plasticizer selected from an alkali soluble acrylic resin and an alkali soluble vinyl resin, and (C) a quinonediazide group-containing compound. The method of forming a photoresist pattern uses the positive photoresist composition. | 11-26-2009 |
| 20090286936 | COMPOSITION FOR FORMATION OF MOLD - Disclosed is a composition for formation of a mold, which is used in a method for producing a nanostructure by removing a portion of a thin film formed on the surface of a mold, and removing the mold, the composition including an organic compound, which has a hydrophilic group and has a molecular weight of 500 or more. | 11-19-2009 |
| 20090286179 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a structural unit (a1) derived from an acrylate ester having a tertiary alkyl ester-type acid dissociable, dissolution inhibiting group containing an aliphatic monocyclic group and/or an aliphatic branched, tertiary alkyl ester-type acid dissociable, dissolution inhibiting group, and the acid-generator component (B) including an acid generator (B1) having a cation moiety represented by general formula (b′-1) shown below: | 11-19-2009 |
| 20090286020 | PHOTOSENSITIVE DRY FILM FOR PRODUCTION OF THREE-DIMENSIONAL MICRO-MOLDED PRODUCT, AND PHOTOSENSITIVE RESIN COMPOSITION - This invention provides a photosensitive resin composition for the production of a three-dimensional micro-molded product having high sensitivity, which satisfies 0.35≦α≦0.78 wherein α represents a value determined from a relational formula y=αLn(x)±β where β represents an arbitrary real number, x represents the exposure of an actinic radiation, mJ/cm2, and y represents the amount of cured resin by the exposure in terms of the ratio between a coating film thickness before development and a residual film thickness after development, i.e., Δh/h where h represents the coating film thickness before development, μm, and Δh represents the residual film thickness after development, μm, and a photosensitive dry film using the same. The molding accuracy of a three-dimensional micro-molded product having a predetermined three-dimensional face can be improved. | 11-19-2009 |
| 20090280438 | METHOD OF FORMING PATTERN - A method of forming a pattern including: forming an underlayer film on a support using an underlayer film-forming material, forming a hard mask on the underlayer film using a silicon-based hard mask-forming material, forming a first resist film by applying a chemically amplified positive resist composition to the hard mask, forming a first resist pattern by selectively exposing the first resist film through a first mask pattern and then performing developing, forming a first pattern by etching the hard mask using the first resist pattern as a mask, forming a second resist film by applying a chemically amplified positive silicon-based resist composition to the first pattern and the underlayer film, forming a second resist pattern by selectively exposing the second resist film through a second mask pattern and then performing developing, and forming a second pattern by etching the underlayer film using the first pattern and the second resist pattern as a mask. | 11-12-2009 |
| 20090280431 | MATERIAL FOR PROTECTIVE FILM FORMATION, AND METHOD FOR PHOTORESIST PATTERN FORMATION USING THE SAME - To provide a material for protective film formation that can simultaneously prevent a change in quality of a resist film during liquid immersion exposure and a change in quality of a liquid for liquid immersion exposure used, and, at the same time, can form a resist pattern having a good shape without increasing the number of treatment steps. A material for protective film formation, comprising at least an alkali-soluble polymer comprising constitutional units represented by general formula (1): | 11-12-2009 |
| 20090269706 | METHOD FOR FORMING RESIST PATTERN - A method for forming a resist pattern that includes the steps of: forming a resist film on a substrate using a resist composition including a resin component (A) that exhibits changed alkali solubility under the action of acid and an acid generator component (B) that generates acid upon exposure; selectively exposing the resist film; and developing the resist film using an alkali developing solution for a developing time of less than 30 seconds, thereby forming a resist pattern. | 10-29-2009 |
| 20090269701 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a structural unit (a0) represented by general formula (a0) (wherein R represents a hydrogen atom, a lower alkyl group of 1 to 5 carbon atoms or a halogenated lower alkyl group of 1 to 5 carbon atoms; Q represents a divalent linking group containing a nitrogen atom or an oxygen atom; R | 10-29-2009 |
| 20090269700 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition, including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the component (A) includes a structural unit (a1) derived from a hydroxystyrene, and a structural unit (a2) containing an acid dissociable, dissolution inhibiting group; and the component (B) includes an acid generator (B1) composed of a compound represented by the general formula (b1) shown below: | 10-29-2009 |
| 20090269694 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) having a structural unit (a0-1) represented by general formula (a0-1) (wherein R | 10-29-2009 |
| 20090269693 | NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - There are provided a resist composition capable of forming a resist pattern with high sensitivity and high resolution, and a method of forming such a resist pattern. The negative resist composition includes an alkali soluble base component (A), an acid generator component (B) that generates acid by exposure, and a cross-linking agent component (C), wherein the base component (A) includes a polyhydric phenol compound (A1) containing two or more phenolic hydroxyl groups represented by the following general formula (I), with a molecular weight of 300 to 2500. | 10-29-2009 |
| 20090263911 | End point detection method , end point detection device, and gas phase reaction processing apparatus equipped with end point detection device - The object of the present invention is to provide an end point detection method in a gas phase reaction processing apparatus. | 10-22-2009 |
| 20090263741 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition that includes a resin component (A) and an acid generator component (B), wherein the component (A) includes a polymer compound (A1) having a structural unit (a0) represented by a general formula (a0) shown below, and a structural unit (a1), which is derived from an (α-lower alkyl) acrylate ester containing an acid-dissociable, dissolution-inhibiting group and is not classified as the structural unit (a0): | 10-22-2009 |
| 20090263631 | FILM FORMING COMPOSITION FOR NANOIMPRINTING AND METHOD FOR PATTERN FORMATION - This invention provides a film forming composition for nanoimprinting, which has excellent resistance to etching with oxygen gas, can prevent the separation of a transfer pattern, can eliminate a problem of a holing time on a substrate, and is also excellent in transferability, and photosensitive resist, a nanostructure, a method for pattern formation using the same, and a program for realizing the method for pattern formation. The film forming composition for nanoimprinting comprises a polymeric silicon compound having the function of causing a photocuring reaction. Preferably, the polymeric silicon compound has a functional group cleavable as a result of response to electromagnetic waves and causes a curing reaction upon exposure to electromagnetic waves. More preferred are siloxane polymer compounds, silicon carbide polymer compounds, polysilane polymer compounds, and silazane polymer compounds, or any mixture thereof. | 10-22-2009 |
| 20090258152 | Coating apparatus and coating method - A coating apparatus and a coating method that are suitable for manufacturing a MEMS or a substrate having a through electrode are provided. A nozzle | 10-15-2009 |
| 20090253886 | SILICONE COPOLYMER HAVING CONDENSED POLYCYCLIC HYDROCARBON GROUP - Provided is a novel silicone copolymer which exhibits high absorption even in a far-ultraviolet region of 200 nm or more, and also is soluble in an alkaline reagent since it has a phenolic hydroxyl group. The silicone copolymer comprises a silsesquioxane having a phenol unit and comprises a silsesquioxane having a condensed polycyclic hydrocarbon. | 10-08-2009 |
| 20090253075 | POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure,
| 10-08-2009 |
| 20090250855 | Stage for substrate - A stage is provided on which is mounted a substrate that has a concavo-convex portion such as a circuit formed on the underside thereof. A channel | 10-08-2009 |
| 20090249604 | METHOD AND APPARATUS FOR RELEASING SUPPORT PLATE AND WAFER CHIPS FROM EACH OTHER - The present invention provides an apparatus for releasing a support plate and wafer chips from each other. A wafer | 10-08-2009 |
| 20090246683 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition and method of forming a resist pattern are provided which enable formation of a resist pattern having excellent shape with reduced LWR. | 10-01-2009 |
| 20090230132 | FLUID CONTAINER AND FLUID-CONTAINING CONTAINER USING THE SAME - A fluid container in which a packaging bag with a spout is not likely to break due to a pin hole or breakage of an edge of the bag during storage or transportation, that has superior cleanliness for fluid contents, in which the packaging bag can be attached to and detached from an external container, and that is superior in working efficiency and hygiene. The container ( | 09-17-2009 |
| 20090220889 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN - A photosensitive resin composition which has a quenching function and satisfactory long-term stability and which, in particular, can be prevented from suffering sensitivity abnormality caused by change with time during storage (change from given sensitivity); and a method of forming a pattern from the composition. The resist composition contains a base resin comprising, as the main component, a silicon-containing polymer which is a siloxane or silsesquioxane polymer or the like, the composition containing, as a quencher, a specific sulfonium compound in place of a nitrogenous compound. | 09-03-2009 |
| 20090218460 | Sucking and holding device - A sucking and holding device includes: a vacuum chuck for vacuum-sucking a substrate; and a suction assisting device for sandwiching the object between it and the vacuum chuck. The suction assisting device includes a substrate-facing surface. The substrate-facing surface seals a through hole provided in the substrate. With this configuration, the sucking and holding device can vacuum-suck and hold the substrate having a through hole. This leads to an accomplishment of a device which can hold various objects without positional displacement. | 09-03-2009 |
| 20090218050 | Treatment liquid permeation unit and treating apparatus - A treatment liquid permeation unit ( | 09-03-2009 |
| 20090214982 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND - There is provided a positive resist composition, including a base component (A) which exhibits increased solubility in an alkali developing solution under action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the base component (A) includes a polymeric compound (A1) containing a structural unit (a0) represented by the general formula (a0-1) shown below: | 08-27-2009 |
| 20090208871 | NOVEL COMPOUND AND METHOD OF PRODUCING SAME, ACID GENERATOR, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - A resist composition including a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the acid generator component (B) includes an acid generator (B1) consisting of a compound represented by general formula (b1-2) shown below: | 08-20-2009 |
| 20090202939 | COMPOUND, POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN - Disclosed are a compound that can be used for a resist composition, a positive resist composition that includes the compound, and a method for forming a resist pattern. | 08-13-2009 |
| 20090199957 | METHOD OF BONDING, THINNING, AND RELEASING WAFER - An adhesive agent layer for bonding a support plate ( | 08-13-2009 |
| 20090197204 | RESIST COMPOSITION FOR IMMERSION EXPOSURE, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND FLUORINE-CONTAINING COMPOUND - A resist composition for immersion exposure, including a base component (A) that exhibits changed solubility in an alkali developing solution under action of acid, an acid generator component (B) that generates acid upon exposure, and a fluorine-containing compound (C) represented by a general formula (c-1) shown below that is decomposable in an alkali developing solution: | 08-06-2009 |
| 20090197199 | MATERIAL FOR FORMING RESIST PROTECTIVE FILM AND METHOD FOR FORMING RESIST PATTERN USING SAME - In the liquid immersion lithography process, by simultaneously preventing deterioration of a resist film and deterioration of an immersion liquid employed during liquid immersion lithography which uses various immersion liquids, including water, resistance to post exposure delay of the resist film can be improved without increasing the number of processes, thereby making it possible to form a high resolution resist pattern using liquid immersion lithography. Using an alkaline soluble polymer, a crosslinking agent, and a solvent capable of dissolving them as at least constituent component, a composition is prepared and a protective film is formed on the surface of the resist film to be used, using the composition. | 08-06-2009 |
| 20090197197 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition comprising a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid, an acid-generator component (B) which generates acid upon exposure, and a nitrogen-containing organic compound (D), the nitrogen-containing organic compound (D) including a nitrogen-containing polymeric compound (D1) having a structural unit (d0) containing a nitrogen atom in the side chain thereof. | 08-06-2009 |
| 20090197070 | Support plate - The present invention provides a support plate ( | 08-06-2009 |
| 20090191478 | METHOD OF FORMING RESIST PATTERN AND NEGATIVE RESIST COMPOSITION - A novel method of forming a resist pattern in which thickness loss from the resist pattern is reduced, and a negative resist composition that can be used in this method of forming a resist pattern. The method of forming a resist pattern includes: forming a first resist film by applying a first resist composition to a support, forming a first resist pattern by selectively exposing the first resist film through a first mask pattern and then developing the first resist film, forming a second resist film by applying a negative resist composition containing an ether-based organic solvent (S″) having no hydroxyl groups onto the support having the first resist pattern formed thereon, and forming a resist pattern by selectively exposing the second resist film through a second mask pattern and then developing the second resist film. | 07-30-2009 |
| 20090189317 | METHOD OF FORMING RESIST PATTERN BY NANOIMPRINT LITHOGRAPHY - A method of forming a resist pattern of high aspect ratio excelling in etching resistance by the use of nanoimprint lithography. The method of forming a resist pattern by nanoimprint lithography comprises the steps of disposing organic layer ( | 07-30-2009 |
| 20090186300 | RESIST COMPOSITION FOR LIQUID IMMERSION LITHOGRAPHY, METHOD OF FORMING RESIST PATTERN, AND FLUORINE-CONTAINING COPOLYMER - A resist composition for immersion exposure including a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, an acid generator component (B) that generates acid upon exposure, and a fluorine-containing copolymer (C) containing a structural unit (c1) represented by general formula (c1-1) shown below. In the formula, R | 07-23-2009 |
| 20090186203 | FILM-FORMING COMPOSITION FOR IMPRINTING, METHOD OF MANUFACTURING STRUCTURE, AND STRUCTURE - Provided are a film-forming composition for imprinting that enables a structure to be obtained after coating the composition on a substrate and pressing a mold thereto with low compression pressure, a method of manufacturing a structure using the film-forming composition for imprinting, and a structure obtained thereby. The film-forming composition for imprinting according to the present invention contains a resin and an organic solvent, in which the organic solvent includes a particular solvent having a boiling point of 100 to 200° C. at ambient pressure. When the structure is manufactured, the film-forming composition for imprinting according to the present invention is coated on a substrate to form a resin layer, and after a mold is pressed against the resin layer, the mold is released from the resin layer. | 07-23-2009 |
| 20090184133 | Fluid Container - A dual storage system-type fluid container in which a liquid pouring tube is securely fitted and a liquid discharging passage formed in a dispenser is easily and securely connected to the liquid pouring tube. A joint for the fluid container comprises a flexible bag ( | 07-23-2009 |
| 20090173433 | METHOD OF FORMING PRECISION MICROSPACE, PROCESS FOR MANUFACTURING MEMBER WITH PRECISION MICROSPACE, AND PHOTOSENSITIVE LAMINATED FILM - A method of forming a precision microspace with given configuration and volume; a process for manufacturing a member having a precision microspace with given configuration and volume; etc. There is provided a method of forming a precision microspace by the step of laying a film on a substratum having a precision microscopic depressed portion, comprising the steps of mounting such a substratum on a first stage and setting a second stage covering the outer circumference of the first stage so that the uppermost face of the second stage is higher than that of the first stage; and laying a film on the substratum to thereby obtain a precision microspace with given configuration and volume. | 07-09-2009 |
| 20090162788 | NOVEL COMPOUND AND METHOD OF PRODUCING THE SAME, ACID GENERATOR, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) consisting of a compound represented by general formula (b1-1) shown below: | 06-25-2009 |
| 20090162787 | NOVEL COMPOUND, ACID GENERATOR, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - There are provided a compound represented by a general formula (b1-1) shown below suitable as an acid generator for a resist composition, a compound represented by a general formula (I) shown below suitable as a precursor for the compound represented by the general formula (b1-1), an acid generator, a resist composition, and a method of forming a resist pattern. | 06-25-2009 |
| 20090162786 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition of the present invention includes a resin component (A) which displays increased alkali solubility under the action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) includes a structural unit (a0) containing a carboxyl group, and at least one structural unit (a1) selected from the group consisting of a structural unit represented by a general formula (a1-2) and a structural unit represented by a general formula (a1-4) shown below: | 06-25-2009 |
| 20090162785 | POLYMER COMPOUND, NEGATIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - There are provided a polymer compound which can form a resist pattern with excellent resolution, and a negative resist composition containing the polymer compound and a resist pattern-forming method thereof. | 06-25-2009 |
| 20090162784 | POLYMER COMPOUND, POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD - The present invention relates to a polymer compound comprising at least one constituent unit (a0) selected from the group consisting of constituent units represented by the following general formulas (A0-1), (A0-2), (A0-3) and (A0-4) [wherein R represents a hydrogen atom or a lower alkyl group], and a constituent unit (a1) derived from an (a-lower alkyl)acrylate ester having an acid dissociable dissolution inhibiting group. | 06-25-2009 |
| 20090162781 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD AND COMPOUND - This resist composition is a resist composition containing a compound in which a portion or all of hydrogen atoms of phenolic hydroxyl groups in a polyhydric phenol compound (a) having two or more phenolic hydroxyl groups and having a molecular weight of 300 to 2,500 are substituted with at least one selected from the group consisting of acid dissociable dissolution inhibiting groups represented by the following general formulas (p1) and (p2) wherein R | 06-25-2009 |
| 20090155713 | RESIST COMPOSITION AND PROCESS FOR PRODUCING SAME - A resist composition that includes an organic solvent (S) and a base material component dissolved in the organic solvent (S), wherein the organic solvent (S) contains ethyl lactate and an antioxidant, and the concentration of the antioxidant within the organic solvent (S) is 10 ppm or greater. | 06-18-2009 |
| 20090155546 | FILM-FORMING COMPOSITION, METHOD FOR PATTERN FORMATION, AND THREE-DIMENSIONAL MOLD - Disclosed are a film-forming composition which can form a pattern having an enhanced contrast by the action of uneven surface morphology produced after image development, and a method for forming a pattern and a three-dimensional mold using the composition. A composition comprising at least one of a hydrolysate and a condensation product of an alkoxy metal compound represented by the chemical formula (A), the composition additionally comprising a compound which can respond to at least one of light and heat to control the solubility of a finished film in a developing solution. | 06-18-2009 |
| 20090142700 | RESIN FOR PHOTORESIST COMPOSITION, PHOTORESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN - A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in the α-position to the hydroxyl group has at least one electron attractive group. | 06-04-2009 |
| 20090142699 | FLUORINE-CONTAINING COMPOUND, RESIST COMPOSITION FOR IMMERSION EXPOSURE, AND METHOD OF FORMING RESIST PATTERN - A fluorine-containing compound represented by a general formula (c-1) shown below: | 06-04-2009 |
| 20090142698 | NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A negative resist composition that includes an alkali-soluble resin component, an acid generator component that generates acid upon exposure, and a cross-linker component, wherein the alkali-soluble resin component is a copolymer that includes a structural unit containing an aliphatic cyclic group having a fluorinated hydroxyalkyl group, and a structural unit derived from an acrylate ester that contains a hydroxyl group-containing aliphatic cyclic group, and the cross-linker component includes an alkylene urea-based cross-linker. | 06-04-2009 |
| 20090142693 | NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A negative resist composition and a method of forming a resist pattern that are capable of suppressing resist pattern swelling are provided. The negative resist composition includes an alkali-soluble resin component (A), an acid generator component (B) that generates acid upon exposure, and a cross-linking agent component (C), wherein the alkali-soluble resin component (A) is a copolymer (A1) that includes a structural unit (a1) containing, within the main chain, an aliphatic cyclic group having a fluorinated hydroxyalkyl group, a structural unit (a2) derived from an acrylate ester which contains a hydroxyl group-containing chain-like or cyclic alkyl group and has a fluoroalkyl group or fluorine atom bonded to the α-position, and a structural unit (a3) derived from an acrylate ester which contains an aliphatic cyclic group having a fluorinated hydroxyalkyl group and has a fluoroalkyl group or fluorine atom bonded to the α-position. | 06-04-2009 |
| 20090139662 | SEPARATING DEVICE - A separating device according to the present invention separates a support plate ( | 06-04-2009 |
| 20090137760 | ADHESIVE COMPOSITION AND ADHESIVE FILM - An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200° C. or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition. | 05-28-2009 |
| 20090134119 | FILM-FORMING MATERIAL AND METHOD OF FORMING PATTERN - A film-forming material that is capable of forming, at a low temperature, a film having a high degree of etching resistance and a high etching selectivity ratio relative to an organic film, as well as a method of forming a pattern that uses the film-forming material. The film-forming material includes a metal compound (W) capable of generating a hydroxyl group upon hydrolysis, and a solvent (S) in which the metal compound is dissolved, wherein the solvent (S) includes a solvent (S1) with a boiling point of at least 155° C. that contains no functional groups that react with the metal compound (W). The method of forming a pattern includes the steps of: coating a pattern, which has been formed on top of an organic film of a laminate that includes a substrate and the organic film, using the above film-forming material, and then conducting etching of the organic film using the pattern as a mask. | 05-28-2009 |
| 20090130605 | RESIST COMPOSITION - A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group. | 05-21-2009 |
| 20090130597 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, NOVEL COMPOUND, AND ACID GENERATOR - A compound represented by general formula (I); and a compound represented by general formula (b1-1). | 05-21-2009 |
| 20090130595 | Thermoacid Generator for Antireflection Film Formation, Composition for Antireflection Film Formation, and Antireflection Film Made Therefrom - A thermoacid generator for antireflective film formation, characterized by being represented by the following formula (1): | 05-21-2009 |
| 20090123838 | CATHODE SUBSTRATE - A cathode substrate which enables achievement of a battery having a high output voltage and a high energy density, and being superior in charge and discharge cycle characteristics; a secondary cell in which the cathode substrate is used; a resin composition for use in forming the cathode substrate; and a method for producing the cathode substrate are provided. According to cathode substrate | 05-14-2009 |
| 20090111054 | NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A negative resist composition including:
| 04-30-2009 |
| 20090104563 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, NOVEL COMPOUND, AND ACID GENERATOR - There is provided a compound represented by a general formula (B1-1) shown below, an acid generator composed of the above compound, a resist composition containing an acid generator composed of the above compound, and a method of forming a resist pattern: | 04-23-2009 |
| 20090098489 | METHOD FOR FORMING RESIST PATTERN - A method for forming a resist pattern that includes the following steps (i) and (ii): (i) a step of forming a first resist layer on a substrate using a positive resist composition, and then conducting selective exposure, thereby forming a latent image of a dense pattern on the first resist layer, and (ii) a step of forming a second resist layer on top of the first resist layer using a negative resist composition, conducting selective exposure, and then developing the first resist layer and the second resist layer simultaneously, thereby exposing a portion of the latent image of the dense pattern, wherein as the negative resist composition, a negative resist composition dissolved in an organic solvent that does not dissolve the first resist layer is used. | 04-16-2009 |
| 20090098484 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid, an acid-generator component (B) which generates acid upon exposure, and a nitrogen-containing organic compound (D1) having a molecular weight of 200 or more, which is represented by general formula (d1) shown below (wherein each of R | 04-16-2009 |
| 20090092924 | METHOD OF PRODUCING POSITIVE RESIST COMPOSITION, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - A method of forming a positive resist composition of the present invention includes a step (I) of passing a positive resist composition, which is obtained by dissolving a resin component (A) that displays increased alkali solubility under the action of acid and an acid generator component (B) that generates acid upon exposure in an organic solvent (S), through a filter (f | 04-09-2009 |
| 20090087625 | METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURE - A method of producing a structure, including:
| 04-02-2009 |
| 20090081590 | NEGATIVE RESIST COMPOSITION AND PROCESS FOR FORMING RESIST PATTERNS - A negative resist composition is provided wherein the composition has the sensitivity to g-rays, i-rays, KrF excimer lasers and electron rays, and can be used for mix and match wherein exposure is conducted using at least two exposure light sources selected form g-rays, i-rays, KrF excimer lasers and electron rays. Furthermore, a negative resist composition and a resist pattern forming method are also proposed wherein a resist pattern having excellent high resolution and excellent plating resistance can be formed, and they can be used for manufacturing MEMS. That is, the present invention proposes: a negative resist composition which is used for a process in which at least two exposure light sources selected from g-rays, i-rays, KrF excimer lasers and electron rays are used and comprises an alkali-soluble resin component (A), acid generator component (B), which generates acid due to exposure to g-rays, i-rays, KrF excimer lasers and electron rays, and a crosslinking agent (C); and a negative resist composition which is used for manufacturing MEMS and comprises an alkali-soluble novolak resin (A), an acid generator component (B) which generates an acid due to the exposure of radiation and a crosslinking agent component (C). | 03-26-2009 |
| 20090081580 | COMPOUND, DISSOLUTION INHIBITOR, POSITIVE TYPE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition. | 03-26-2009 |
| 20090075204 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure,
| 03-19-2009 |
| 20090075177 | POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD - A positive resist composition having excellent size controllability, and a resist pattern forming method are provided. This positive resist composition contains a resin component (A) comprising an alkali soluble constituent unit (a1) which comprises a constituent unit (a11) derived from (α-methyl)hydroxystyrene, and a constituent unit (a2) which has an acid dissociable dissolution inhibiting group including an acid dissociable dissolution inhibiting group (II) represented by the following general formula (II) and/or a specific chain acid dissociable dissolution inhibiting group (III); an acid generator component (B) which generates an acid upon exposure; and preferably contains an aromatic amine (C). | 03-19-2009 |
| 20090068600 | METHOD FOR ENHANCING OPTICAL STABILITY OF THREE-DIMENSIONAL MICROMOLDED PRODUCT - In order to enhance the optical stability of a three-dimensional micromolded product having optical transparency produced by irradiating a molded layer formed of a photosensitive resin composition provided on a transparent substrate with an actinic radiation from the transparent substrate side so that the quantity of light is varied along the plane of the transparent substrate and dissolving and removing the exposed molded layer in its uncured part with a developing solution, a potassium carbonate solution is used as the developing solution. This constitution can prevent a deterioration in transparency of the transparent three-dimensional micromolded product, incorporated in an optical component, with the elapse of time. That is, the optical stability of the optically transparent three-dimensional micromolded product can be enhanced. | 03-12-2009 |
| 20090068594 | POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN - A positive resist composition for producing MEMS using an electron beam, the composition comprising a resin component (A) that displays increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon irradiation, wherein the resin component (A) is a resin prepared by protecting a portion of all the hydroxyl groups within an alkali-soluble novolak resin with acid-dissociable, dissolution-inhibiting groups. | 03-12-2009 |
