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Tokyo Ohika Kogyo Co., Ltd.
| Tokyo Ohika Kogyo Co., Ltd. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20090142696 | POSITIVE RESIST COMPOSITION, POSITIVE RESIST COMPOSITION FOR THERMAL FLOW, AND RESIST PATTERN FORMING METHOD - Disclosed is a positive resist composition comprising a resin component (A) and an acid generator component (B), wherein the component (A) contains a polymer compound (A1) containing a structural unit (a0) represented by formula (a0) shown below and a structural unit (a2) derived from an acrylate ester containing a lactone-containing cyclic group: | 06-04-2009 |