| TOKYO ELECTRON LIMTED Patent applications |
| Patent application number | Title | Published |
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| 20110311340 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM STORING SUBSTRATE PROCESSING PROGRAM - A substrate processing apparatus includes a substrate transit table configured to mount thereon a plurality of substrates; a substrate processing chamber configured to process the substrate one by one; a substrate transfer device capable of loading the substrate into the substrate processing chamber from the substrate transit table and unloading the substrate from the substrate processing chamber to the substrate transit table; and N number of (N is an integer equal to or larger than 3) substrate holding devices provided at the substrate transfer device and configured to hold the substrates one by one. Here, a multiplicity of (2 to N−1 number of) substrates are concurrently held by 2 to N−1 number of substrate holding devices among the N number of substrate holding devices and one substrate is loaded into the substrate processing chamber. | 12-22-2011 |
| 20110291568 | PLASMA PROCESSING APPARATUS AND PROCESSING GAS SUPPLY STRUCTURE THEREOF - There is provided a plasma processing apparatus for generating inductively coupled plasma in a processing chamber and performing a process on a substrate accommodated in the processing chamber. The plasma processing apparatus includes an upper cover installed to cover a top opening of the processing chamber and having a dielectric window; a high frequency coil installed above the dielectric window at an outer side of the processing chamber; a gas supply mechanism supported by the upper cover and installed under the dielectric window. Here, the gas supply mechanism includes a layered body including plates having through holes. Further, the gas supply mechanism is configured to supply a processing gas into the processing chamber in a horizontal direction via groove-shaped gas channels installed between the plates or between the plate and the dielectric window, and end portions of the groove-shaped gas channels are opened to edges of the through holes. | 12-01-2011 |
| 20110217796 | ETCHING METHOD AND APPARATUS - An etching method capable of controlling the film thickness of a hard mask layer uniformly is provided. A plasma etching is performed on a native oxide film by using an etching gas containing, for example, CF | 09-08-2011 |
| 20100200162 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD - Disclosed is a substrate processing method that dissolves and deforms a photoresist film having a first pattern formed on a substrate to reshape the resist film into a second pattern. During the reflow process, an atmosphere of a thinner vapor-containing gas is established in a processing chamber. A substrate is placed on a temperature adjusting plate. The target temperature of the temperature adjusting plate is set and controlled by a control unit, and the temperature of the temperature adjusting plate is controlled by a temperature regulator based on the target temperature set by the control unit. The control unit set and controls the target temperature so that it meets the following requirement: the atmospheric temperature≦the target temperature≦(the atmospheric temperature+2° C.). Due to the above, the reflowing of the resist can be performed stably, while achieving a satisfactory reflow rate although it is somewhat low. | 08-12-2010 |
| 20080231300 | METHOD FOR DETECTING TIP POSITION OF PROBE, ALIGNMENT METHOD, APPARATUS FOR DETECTING TIP POSITION OF PROBE AND PROBE APPARATUS - An probe tip position detecting method detects tip positions of a plurality of probes by using a tip position detecting device including a sensor unit for detecting tips of the probes and a movable contact body belonging to the sensor unit, the method used in inspecting electrical characteristics of an object to be inspected by bringing the object supported on a movable mounting table into electrical contact with the probes. The method includes a first step for moving the tip position detecting device by using the mounting table to thereby bring the contact the object into contact with the tips of the probes; a second step for further moving the mounting table to thereby move the contact body toward the sensor unit without causing elastic deformation to the probes; and a third step of determining a movement starting position of the contact body as the tip positions of the probes. | 09-25-2008 |
