| Toko, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100259353 | Surface-Mount Inductor and Method of Producing the Same - A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. In the method, a tablet and a coil are used. The tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof. The coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body. External electrodes are formed on a surface of or around an outer periphery of the molded body in such a manner that the external electrodes are electrically connected to the both ends of the coil at least a portion of which is exposed to the surface of the molded body. | 10-14-2010 |
| 20100219696 | Noncontact Electric Power Transmission System - Disclosed is a noncontact electric power transmission system having a power transmitter circuit section | 09-02-2010 |
| 20100155648 | Resin Composition, Electronic Component using the Same and Production Method Therefor - Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa·s as measured at room temperature. | 06-24-2010 |
| 20100148891 | Dielectric Waveguide-Microstrip Transition Structure - In a dielectric waveguide-microstrip transition structure for mounting a dielectric waveguide on a printed-wiring board, one object of the present invention is directed to providing a further downsized structure as compared with a conventional structure, while maintaining an influence of displacement between the dielectric waveguide and the microstrip at a low level by means of non-contact coupling. The dielectric waveguide-microstrip transition structure has a dielectric waveguide containing a dielectric block and a conductor film covering an entire surface of the dielectric block, except a signal input/output portion, wherein a slot is formed in a bottom surface of the dielectric waveguide to expose the dielectric; a microstrip having an end which is openly terminated and disposed with opposing to and spaced apart from the slot of the dielectric waveguide; and a cavity containing a conductive wall surrounding the end of the microstrip and the slot of the dielectric waveguide, except a part of the microstrip being led out to connect to an external circuit. | 06-17-2010 |
| 20100065933 | Semiconductor strain gauge and the manufacturing method - A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region. | 03-18-2010 |
| 20090251376 | Directive Bar-Type Antenna - Disclosed is a directional bar-type antenna which comprising a plurality of bar-shaped antenna elements including a core and a coil wound around the core. The first bar-shaped antenna element is disposed at a position of a mirror image of the second bar-shaped antenna element with respect to the core of the third bar-shaped antenna element. The first and second bar-shaped antenna elements is positioned such that one end of each of the first and second bar-shaped antenna elements is close to the third bar-shaped antenna element, and the other end is far from the third bar-shaped antenna element. In the present invention, a winding direction of the coil of the first bar-shaped antenna element is preferably identical to that of the coil of the second bar-shaped antenna element, and is opposite to that of the coil of the third bar-shaped antenna element. The directional bar-type antenna of present invention can meet a need for providing asymmetrical directionality in a forward-rearward direction of an antenna for use in a specific system, such as a keyless entry system, and solve a problem in terms of cost and external appearance, in a technique of partially surrounding a bar-type antenna by a shielding member, in view of difficulty in freely controlling directionality of an antenna in an induced electromagnetic field domain, and a need to allow the bar-type antenna to have a difference between respective receiving sensitivities in forward and rearward directions in the induced electromagnetic field domain (while facilitating a reduction in size and cost). | 10-08-2009 |
| 20090250836 | Production Method for Molded Coil - Disclosed is a method oft by using a plastic molding process, encapsulating an air-core coil with a moldable magnetic resin material prepared by kneading a mixture of a magnetic powder and a resin. The method comprises the steps of (a) preparing a molding die assembly which includes a plurality of dies adapted to define a cavity therewithin, and a positioning pin adapted to be movable in a vertical or horizontal direction within the cavity, (b) arranging the air-core coil at a given position within the cavity by the positioning pin, (c) charging the moldable magnetic resin material into the cavity and moving the positioning pin to a given retracted position in a course of the charging. | 10-08-2009 |
| 20090184791 | Molded Body - There is provided a molded body having high fixing strength between a magnetic mold material and an external electrode. The molded body uses the magnetic mold material comprising at least 65 vol % of magnetic powder and up to 35 vol % of resin and the external electrode that has pits and projections on a surface that makes contact with the magnetic mold material. The external electrode and the magnetic mold material are integrally-molded such that at least a portion of the external electrode is exposed at at least one surface of the molded body. Spacing between the pit and projection of the external electrode is smaller than the maximum particle size of the magnetic powder. | 07-23-2009 |
| 20090085164 | WIRING BOARD - There is provided a wiring board. The wiring board includes: a semiconductor substrate having a through hole and covered with an insulating film; a through electrode formed in the through hole; a first wiring connected to one end of the through electrode; and a second wiring connected to the other end of the through electrode. The semiconductor substrate includes: a semiconductor element and a first guard ring formed to surround the through hole. The semiconductor element includes a first conductivity-type impurity diffusion layer having a different conductivity-type from that of the semiconductor substrate and is electrically connected to the first wiring and the second wiring. | 04-02-2009 |
| 20090059634 | Switching power supply - To provide a half-bridge switching power supply using a series resonance that can realize both of a smaller size and higher reliability of a device. | 03-05-2009 |
| 20090029518 | Method of fabricating schottky barrier diode - Disclosed is a method of fabricating a Schottky barrier diode, which comprises the steps of laminating an N | 01-29-2009 |
| 20090015210 | Non-contact electric power transmission apparatus - The object is to provide a safe non-contact electric power transmission apparatus reducing unnecessarily consumed electric power, while intermittently-operated or otherwise restrained electric power transmission is not performed, and heat is not generated when a metal such as a foreign object is placed. In a non-contact electric power transmission apparatus having: a power supplying unit | 01-15-2009 |
| 20080290887 | Testing method for semiconductor device having ball-shaped external electrode - Disclosed is a method of testing electrical characteristics of a semiconductor device having a ball-shaped external electrode. The method comprises preparing a plurality of cantilever-type contactors each supported by a support plate at a given position, and formed in such a manner that a tip thereof has a flat surface with an arc-shaped edge in an outer peripheral region thereof, and a cross-sectional diameter in a vicinity of the tip is greater than a radius of the ball-shaped external electrode, and pairing the cantilever-type contactors to provide paired two contactors. The method includes the steps of: pressing either one of the support plate and the semiconductor device toward the other in such a manner that the arc-shaped edges of the paired two contactors are brought into contact with respective ones of two surface regions of the ball-shaped external electrode divided by an axis of the ball-shaped external electrode passing through a middle point between the two positions where the paired two contactors are supported, so as to form Kelvin contacts; and further overly driving either one of the support plate and the semiconductor device relative to the other in such a manner that the arc-shaped edges of the paired two contactors are slidingly moved along respective ones of the two surface regions of the ball-shaped external electrode to perform a wiping operation. | 11-27-2008 |
| 20080282533 | Miniature surface-mount electronic component and method for manufacturing the same - A miniature surface-mount electronic component which can ensure sufficient impact resistance and vibration resistance especially in an application to a severe use environment such as a vehicle-mounted coil, by putting some contrivance into a method for fixing a coil in a molding process and a method for holding a core and terminals. A miniature surface-mount electronic component including a bar-shaped core | 11-20-2008 |
| 20080252409 | Power transmission transformer for noncontact power transfer device - The present invention provides a power transmission transformer of which workability in implementing and reliability of connection are considered in a noncontact power transfer device using individual self-oscillation circuits. The power transmission transformer for a noncontact power transfer device including a transmitting coil L | 10-16-2008 |
