Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Toadenka Corporation
Morioka-shi, Iwate, JP
| Toadenka Corporation Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110033711 | RESIN-METAL BONDED ARTICLE AND METHOD FOR PRODUCING THE SAME - Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10%≦Cu | 02-10-2011 |