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Third Wave Technologies
| Third Wave Technologies Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20090029869 | SURFACE MODIFICATION, LINKER ATTACHMENT, AND POLYMERIZATION METHODS - The present invention relates to surface modifications and linker attachments. For example, the present invention provides surface modification and linker chemistry that facilitates manufacture and use of microarrays, including nucleic acid and protein microarrays. The present invention also relates to array spotting through non-aqueous liquids. | 01-29-2009 |