| 20120028438 | METHOD FOR SEPARATING A LAYER SYSTEM COMPRISING A WAFER - A method for mechanically separating a laminar structure from a carrier assembly is disclosed. The method can include providing a layered system comprising the carrier assembly, having a first carrier, and the laminar structure, having a wafer and optionally a second, stretchable carrier, and creating a mechanical stress in the interface region between carrier assembly and the laminar structure, so that the laminar structure is separated from the carrier assembly. The method also includes:
| 02-02-2012 |
