THERMAL CORP. Patent applications |
Patent application number | Title | Published |
20140251577 | COOLING FRAME WITH INTEGRATED HEAT PIPES - A heat-transfer system is provided for conveying heat from a heat source, the heat-transfer system generally including a frame for coupling to the heat source, wherein the frame is insertable into a first slot of a cooling chassis, and a heat-transfer rail extending parallel to the frame at an offset distance, wherein the offset distance is dimensioned such that the heat-transfer rail is insertable into a second slot of the cooling chassis. At least one heat-transfer device couples the heat-transfer rail to the frame. | 09-11-2014 |
20140190667 | CAPILLARY DEVICE FOR USE IN HEAT PIPE AND METHOD OF MANUFACTURING SUCH CAPILLARY DEVICE - A capillary device ( | 07-10-2014 |
20130213603 | HEAT EXCHANGER BACKING PLATE AND METHOD OF ASSEMBLING SAME - A backing plate for joining a heat removal device to a heat source. The backing plate can include a planar plate region having a first face and a second face opposite the first face. The backing plate can also include at least one boss projecting from the first face and having an opening therein for receiving a fastener. | 08-22-2013 |
20130213075 | ELECTRONICS CABINET AND RACK COOLING SYSTEM AND METHOD - A thermal management system for a electronics cabinets having an electronics heat source therein. The thermal management system includes a first passive thermal device having an evaporator portion and a condenser portion. The thermal management system can also include a heat sink in contact with air inside the cabinet and in thermal contact with the evaporator portion of the first passive thermal device, wherein the heat sink is contained within the sealed cabinet. The condenser portion of the first passive thermal device can be in contact with a liquid to liquid heat exchanger. | 08-22-2013 |
20130092354 | HEAT PIPE HAVING A WICK WITH A HYBRID PROFILE - A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube. | 04-18-2013 |
20090025907 | FLUID CIRCUIT HEAT TRANSFER DEVICE FOR PLURAL HEAT SOURCES - A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a wicking material. | 01-29-2009 |