| The Cupron Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20110262509 | Anit-Virus Hydrophilic Polymeric Material - The invention provides a method for imparting antiviral properties to a hydrophilic polymeric material comprising preparing a hydrophilic polymeric slurry, dispersing an ionic copper powder mixture containing cuprous oxide and cupric oxide in said slurry and then extruding or molding said slurry to form a hydrophilic polymeric material, wherein water-insoluble particles that release both Cu | 10-27-2011 |
| 20090010969 | Methods And Materials For Skin Care - The invention provides a cosmetic method for, preventing, minimizing and removing wrinkles and providing for smoother and more robust skin surfaces comprising applying a material incorporating water-insoluble copper compounds which release Cu | 01-08-2009 |
| 20080311165 | Copper Containing Materials for Treating Wounds, Burns and Other Skin Conditions - The invention provides a method for treating and healing sores, cold sores, cutaneous openings, ulcerations, lesions, abrasions, burns and skin conditions comprising applying to a body surface exhibiting the same, a material incorporating water-in-soluble copper compounds which release cu | 12-18-2008 |
| 20080255285 | Anti-Virus Hydrophilic Polymeric Material - The invention provides a method for imparting antiviral properties to a hydrophilic polymeric material comprising preparing a hydrophilic polymeric slurry, dispersing an ionic copper powder mixture containing cuprous oxide and cupric oxide in said slurry and then extruding or molding said slurry to form a hydrophilic polymeric material, wherein water-insoluble particles that release both Cu | 10-16-2008 |
| 20080241530 | Antimicrobial, Antifungal and Antiviral Rayon Fibers - The invention provides an antimicrobial, antifungal and antiviral polymeric material, comprising rayon fibers and a single antimicrobial, antifungal and antiviral component consisting essentially of microscopic water insoluble particles of copper oxide incorporated in said fibers wherein a portion of said particles in said fibers are exposed and protruding from the surface of the fibers and wherein said particles release Cu | 10-02-2008 |
