TEXAS INSTRUMENTS INCORPORTED Patent applications |
Patent application number | Title | Published |
20150293060 | SENSOR ARRAY CHIP WITH PIEZOELECTRIC TRANSDUCER INCLUDING INKJET FORMING METHOD - A method of forming a functionalized sensor array includes providing a substrate having at least one sensor array chip including a plurality of sensor structures. The sensor structures include a piezoelectric layer interposed between upper and lower electrodes and positioned across an area of the sensor array chip in a spatial arrangement. An inkjet cartridge chip is also provided having a plurality of microfluidic channels including a fill side having a plurality of fill side orifices and a dispense side having a plurality of dispense nozzles, wherein two or more of the plurality of microchannels are loaded with different sensing materials, and wherein locations of the plurality of dispense nozzles are matched to the spatial arrangement. The plurality of dispense nozzles are aligned to the plurality of sensor structures, and the plurality of dispense nozzles are actuated to deposit the different sensing materials on the plurality of sensor structures. | 10-15-2015 |
20140346887 | GALVANIC ISOLATOR - A system on a package (SOP) can include a galvanic isolator. The galvanic isolator can include an input stage configured to transmit an input RF signal in response to receiving an input modulated signal. The galvanic isolator can also include a resonant coupler electrically isolated from the input stage by a dielectric. The resonant coupler can be configured to filter the input RF signal and transmit an output RF signal in response to the input RF signal. The galvanic isolator can further include an output stage electrically isolated from the resonant coupler by the dielectric. The output stage can be configured to provide an output modulated signal in response to receiving the output RF signal. | 11-27-2014 |
20110058246 | Laminated Micromirror Package - A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package | 03-10-2011 |
20110057303 | Package for an Integrated Circuit - According to various illustrative embodiments of the present invention, a device for an integrated circuit includes a monolithic frame having a plurality of alignment features disposed thereon, the monolithic frame having a mounting surface disposed thereon for the integrated circuit, the monolithic frame also having a thermal interface area disposed thereon for the integrated circuit. The device also includes an electrical interface capable of providing an electrical connection for the integrated circuit, the plurality of alignment features being substantially independent of the electrical interface, and an adhesive layer disposed between the monolithic frame and the electrical interface. | 03-10-2011 |