| Test Research, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110206182 | METHOD FOR THICKNESS CALIBRATION AND MEASURING THICKNESS OF MATERIAL - A method for measuring the thickness of a first absorbing material in the presence of a second absorbing material is provided. The method comprises the steps as follow. The thickness (t | 08-25-2011 |
| 20090243642 | Electronic Device Testing System and Method - The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element. | 10-01-2009 |
| 20090089635 | Electronic Device Testing System and Method - The invention provides a testing system and method suitable for determining whether a pin-out of an electrical component is properly connected to a PCB. The testing system includes a testing signal source, a signal detector, a signal processor, an analysis unit and an integrated circuit having boundary-scan test function to provide testing signals to the device under test (DUT) whose signal traces are passing through inner layer of PCB in order to detect whether the sensed signal is an error signal. | 04-02-2009 |
| 20080298538 | System and Method for Laminography Inspection - A laminography inspection system comprises an irradiation source, a plurality of linear image detectors defining an image plane, a fixed table for placement of a test object in a stationary position between the irradiation source and the image detectors, and a computing device for processing a plurality of images of the test object acquired from the image detectors. The irradiation source and the image detectors perform a plurality of parallel linear scanning passes across the area of the test object to acquire images of the test object under different viewing angles. Based on the acquired image data, the computing device determines a warp compensation and generates a cross-sectional image of a selected section within the test object. | 12-04-2008 |
| 20080218175 | Open-Circuit Testing System and Method - The invention discloses a testing system and method suitable for determining the connection state of an electronic component in an electronic device assembly. In an embodiment, the testing system comprises a signal sensing unit configured to provide a sensed signal induced by capacitive coupling in response to the output of a testing signal passing through a tested pin, a signal processor unit configured to filter and over-sample the sensed signal to obtain a digital signal, and an analyzer unit configured to compute the digital signal for determining a connection state of the test pin. | 09-11-2008 |
