Test Research, Inc.
|Test Research, Inc. Patent applications|
|Patent application number||Title||Published|
|20140022357||THREE-DIMENSIONAL IMAGE MEASURING APPARATUS - A three-dimensional image measuring apparatus includes a measurement platform, a movable optical head, a three-dimensional calculator module, a moving module and a calibration controlling module. The movable optical head includes a beam splitter unit, a projecting module, an image-capturing module and an indicator module. The measurement platform supports an object under measurement. The projecting module generates a structure light of parallel sinusoid strips pattern to the object under measurement. The image-capturing module includes image-capturing units facing the object under measurement from different directions or angles. Each image-capturing unit is configured to capture a reflection image which is formed from the structure light of parallel sinusoid strips pattern reflected by the object under measurement. The indicator module projects an alignment beam onto the object under measurement for forming an alignment mark. The calibration controlling module selectively drives the moving module to move the movable optical head according to the alignment mark.||01-23-2014|
|20130278723||THREE-DIMENSIONAL MEASUREMENT SYSTEM AND THREE-DIMENSIONAL MEASUREMENT METHOD - A three-dimensional measurement system includes a measurement carrier, first and second projection modules, an image-capturing module, and a control unit. The measurement carrier carries a test object on a measurement plane. The first projection module projects a first patterned structure light onto the test object along a first optical axis that forms a first incident angle relative to the measurement plane, and the second projection module projects a second patterned structure light onto the test object along a second optical axis that forms a second incident angle different from the first incident angle. The image-capturing module captures first and second patterned images formed after reflection of the first and second patterned structure lights from the test object. The control unit controls the first and second projection modules, and measures a three-dimensional shape of the test object according to the first and second patterned images.||10-24-2013|
|20130223493||SIGNAL TRANSITION DETECTION CIRCUIT AND METHOD OF THE SAME - A signal transition detection circuit is provided. The signal transition detection circuit comprises a counter module, a DAC, a comparator and a digital sampling module. The counter module generates a digital step signal. The DAC converts the digital step signal into an analog input signal and transmits it to an under-test circuit such that the under-test circuit generates an output signal transiting from a first stable level to a second stable level, wherein a transition section is located between the first and the second stable level. The comparator receives and compares the output signal with a default value to generate a normalized output signal. The digital sampling module samples the normalized output signal to retrieve impulses such that when the number of the impulses is accumulated to be larger than a reference value, a corresponding step of the digital step signal is determined to be a transition point.||08-29-2013|
|20120173214||ELECTRICAL CONNECTION DEFECT SIMULATION TEST METHOD AND SYSTEM OF THE SAME - An electrical connection defect simulation test method is provided. The electrical connection state simulation test method includes the steps as follows. A device under test is provided, wherein the device under test includes a plurality of pin groups each having a plurality of signal pins. A zero-frequency signal is transmitted from a signal-feeding device to each of the signal pins to simulate an open condition. An open test is performed on each of the signal pins. The signal pins of the device under test are connected to a relay matrix. The relay matrix is controlled to make any two of the signal pins in one of the pin groups electrically connected to simulate a short condition. A short test is performed on any two of the electrically connected signal pins. An electrical connection state simulation test system is disclosed herein as well.||07-05-2012|
|20120161779||DISCHARGE DEVICE AND TEST SYSTEM HAVING THE SAME - A discharge device and a test system having the same are provided. The test system comprises at least one power supply module, a test instrument and a discharge device. The power supply module supplies power to a device under test. The test instrument is connected to the device under test. The test instrument performs a plurality of on-power test procedures on the device under test. The discharge device comprises at least one first constant current discharge unit disposed in the test instrument, at least one second constant current discharge unit disposed in the power supply module and a control module. The control module controls the first and the second constant current discharge units to drain a constant current from the device under test and the power supply module to perform a discharge process when each one of the on-power test procedures is finished.||06-28-2012|
|20110206182||METHOD FOR THICKNESS CALIBRATION AND MEASURING THICKNESS OF MATERIAL - A method for measuring the thickness of a first absorbing material in the presence of a second absorbing material is provided. The method comprises the steps as follow. The thickness (t||08-25-2011|
|20090243642||Electronic Device Testing System and Method - The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element.||10-01-2009|
|20090089635||Electronic Device Testing System and Method - The invention provides a testing system and method suitable for determining whether a pin-out of an electrical component is properly connected to a PCB. The testing system includes a testing signal source, a signal detector, a signal processor, an analysis unit and an integrated circuit having boundary-scan test function to provide testing signals to the device under test (DUT) whose signal traces are passing through inner layer of PCB in order to detect whether the sensed signal is an error signal.||04-02-2009|
|20080298538||System and Method for Laminography Inspection - A laminography inspection system comprises an irradiation source, a plurality of linear image detectors defining an image plane, a fixed table for placement of a test object in a stationary position between the irradiation source and the image detectors, and a computing device for processing a plurality of images of the test object acquired from the image detectors. The irradiation source and the image detectors perform a plurality of parallel linear scanning passes across the area of the test object to acquire images of the test object under different viewing angles. Based on the acquired image data, the computing device determines a warp compensation and generates a cross-sectional image of a selected section within the test object.||12-04-2008|
|20080218175||Open-Circuit Testing System and Method - The invention discloses a testing system and method suitable for determining the connection state of an electronic component in an electronic device assembly. In an embodiment, the testing system comprises a signal sensing unit configured to provide a sensed signal induced by capacitive coupling in response to the output of a testing signal passing through a tested pin, a signal processor unit configured to filter and over-sample the sensed signal to obtain a digital signal, and an analyzer unit configured to compute the digital signal for determining a connection state of the test pin.||09-11-2008|
Patent applications by Test Research, Inc.