| Tessera Technologies Hungary Kft.. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120008859 | Reducing Erroneous Colors in Edge Areas with Chromatic Abberation - A technique is disclosed for calculating a value for a second color for a particular pixel. The technique selects a first set of neighboring pixels situated on a first side of the particular pixel, and a second set of neighboring pixels situated on an opposite side of the particular pixel. Based upon color values from the first set of neighboring pixels, the technique determines a first representative relationship, and based upon color values from the second set of neighboring pixels, the technique determines a second representative relationship. Based upon these representative relationships, the technique determines a target relationship between the value for the second color for the particular pixel and a value for a first color for the particular pixel. Based upon the target relationship and the value for the first color for the particular pixel, the technique calculates the value for the second color for the particular pixel. | 01-12-2012 |
| 20110115965 | FIXED FOCAL LENGTH OPTICAL LENS ARCHITECTURE PROVIDING A CUSTOMIZED DEPTH OF FOCUS OPTICAL SYSTEM - Providing for a fixed focus optical system exhibiting extended depth of field is provided herein. By way of example, a compact and fast optical system that yields an asymmetric modulation transfer function (MTF) is disclosed. In some aspects, the asymmetric MTF results in extended depth of field for near field objects. Such a response can be particularly beneficial for small handheld cameras or camera modules having high resolution. According to some disclosed aspects, the resolution can be about 8 mega pixels. Additionally, the optical system can comprise four lenses in one aspect and five lenses in another, while remaining below about 5.3 mm total track length (TTL) for the respective systems. In at least one application, the disclosed optical systems can be employed for a high resolution compact camera, for instance in conjunction with an electronic computing device, communication device, display device, surveillance equipment, or the like. | 05-19-2011 |
| 20100323475 | Integrated circuit device - An integrally packaged optronic integrated circuit device ( | 12-23-2010 |
| 20100230795 | STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS - A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads. | 09-16-2010 |
