TESSERA NORTH AMERICA, INC.
|TESSERA NORTH AMERICA, INC. Patent applications|
|Patent application number||Title||Published|
|20120199926||BSI IMAGE SENSOR PACKAGE WITH VARIABLE-HEIGHT SILICON FOR EVEN RECEPTION OF DIFFERENT WAVELENGTHS - A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.||08-09-2012|
|20120199925||BSI IMAGE SENSOR PACKAGE WITH EMBEDDED ABSORBER FOR EVEN RECEPTION OF DIFFERENT WAVELENGTHS - A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has an opening overlying at least one of first and second light sensing elements, the semiconductor region having a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face. A light-absorbing material overlies the semiconductor region within the opening above at least one of the light sensing elements such that the first and second light sensing elements receive light of substantially the same intensity.||08-09-2012|
|20120112301||REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS - A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.||05-10-2012|
|20110255856||WAFER LEVEL OPTICS - Providing for a wafer level optical system employing composite lenses is disclosed herein. Conventional focus lens assemblies require three or more lenses. By way of example, two composite lenses can be used to reduce the cost of a wafer-level camera. In some aspects, the composite lenses can be aspheric and can employ a broader variety of wafer materials than earlier designs that only operated in narrow ranges of refractive indices and Abbe numbers.||10-20-2011|
|20110170188||MONOLITHIC POLARIZING DIFFRACTIVE STRUCTURES AND ASSOCIATED METHODS - A monolithic polarizing diffractive structure includes a system having at least two parallel continuous planar surfaces, a diffractive pattern on one of the at least two parallel continuous surfaces, the diffractive pattern including at least two diffractive elements integral with the one of the at least two continuous surfaces, the at least two diffractive elements defining a monolithic diffractive pattern, and a polarizing pattern on one of the at least two parallel continuous surfaces. The polarizing pattern includes at least two polarizing elements, each polarizing element corresponding to a respective diffractive element, the at least two polarizing elements outputting polarizations rotated with respect to one another, the at least two polarizing elements defining a monolithic polarizing pattern.||07-14-2011|
|20100295973||DETERMINATE AND INDETERMINATE OPTICAL SYSTEMS - An optical system (||11-25-2010|
|20100272393||Wafer based optical chassis and associated methods - An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.||10-28-2010|
|20100272390||Integrated optical transceiver - An optical transceiver includes at least one light source and at least one detector mounted on the same surface of the same substrate. The detector is to receive light from other than a light source on the surface. At least one of the light source and the detector is mounted on the surface. An optics block having optical elements for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.||10-28-2010|
|20080310023||Method of making an optical system - A diffractive optical element (DOE) corrector for use with three different wavelengths includes a first diffractive element on a first surface of a first material, the first diffractive element diffracting a first wavelength of the three wavelengths, while directing a majority of light of second and third wavelengths of the three wavelengths into a zero-th order, and a second diffractive element on a second surface of a second material, the second material being different from the first material, the second surface being different from and in an optical path of the first surface, the second diffractive element diffracting the second wavelength, while directing a majority of light of the first and third wavelengths into a zero-th order.||12-18-2008|
|20080285965||METHOD OF FORMING THIN CAMERA - A thin camera having sub-pixel resolution includes an array of micro-cameras. Each micro-camera includes a lens, a plurality of sensors of size p, and a plurality of macro-pixels of size d having a feature of size q. The feature size q smaller than p and provides a resolution for the micro-camera greater than p. The smallest feature in the micro-cameras determines the resolution of the thin camera. Each macro-pixel may have any array of m features of size q, where q=d/m. Additional micro-cameras may be included to increase power.||11-20-2008|
Patent applications by TESSERA NORTH AMERICA, INC.