TEREPAC CORPORATION Patent applications |
Patent application number | Title | Published |
20130193561 | Processes and structures for IC fabrication - The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process provides multiple interconnect wires in the form of a ribbon between the bond pads, and then subsequently separates the ribbon into multiple individual interconnect wires. | 08-01-2013 |
20130192523 | Systems and methods for printing electronic device assembly - The present invention discloses systems and methods for printing functional blocks from a plurality of printheads to a target substrate. In exemplary embodiments, the printing system comprises a main printhead for the majority of printing process, and a secondary printhead for supplemental printing. The system further comprises a controller, utilizing a positioning intelligence system to distribute the printing of the functional blocks between the main printhead and the secondary printhead, to minimize the motions of the printheads while maximize the printing speed. | 08-01-2013 |