Tellabs Bedford, Inc.
|Tellabs Bedford, Inc. Patent applications|
|Patent application number||Title||Published|
|20140072264||DELIVERY OF GPON TECHNOLOGY - A wall-mountable outlet comprising an enclosure and a faceplate mechanically coupled to the enclosure. An optical network terminal (ONT) is provided in the enclosure. In one example embodiment, the ONT comprises an optical-electrical (O-E) data module, and the O-E data module comprises an O-E converter. The O-E data module can further comprise a switch arranged to selectively couple at least one signal with the O-E converter. The O-E data module further can comprise a Passive Optical Network (PON) controller interposed between the O-E converter and the switch.||03-13-2014|
|20090010648||Methods and apparatus for upgrading passive optical networks - An optical network system can be used to update legacy passive optical networks by adding an optical transmitter, blocking filter, and/or pluggable or unpluggable optics. In one embodiment, an optical network system, including several optical transmitters and receivers, multiplexers, demultiplexers, erbium-doped fiber amplifier, and blocking filter, may be employed. The additional transmitter increases available bandwidth, while the blocking filter allows existing customers' service(s) to not be impacted. Another embodiment uses pluggable or unpluggable optics, instead of the aforementioned blocking filter, to receive and modulate optical signals to transmit services to end users. In one embodiment, an optical network system can be employed that allows for simultaneous upgrading of the system and providing of legacy services, while allowing for the of removal existing optical network components over time.||01-08-2009|
|20080310119||Clip on heat sink - A heat sink according to an embodiment of the present invention can be attached to any device without printed circuit board (PCB) modification. The heat sink may clamp on device edges, which does not stress solder balls between the device and heat sink. The heat sink may be configured to be installed to or removed from the device without special tools. The heat sink may be extruded, machined, or die cast aluminum or other material to reduce part and tooling cost, and may be black anodized to be electrically non-conductive. A single-piece embodiment eliminates a need for a separate clip, thereby increasing heat transfer by as much as twenty-five percent or more over heat sinks employing clips. Further, wavy fins or other heat dissipation configurations may increase heat transfer by at least eleven percent, for a total heat transfer improvement of at least thirty-six percent over a two-part heat sink.||12-18-2008|
Patent applications by Tellabs Bedford, Inc.