Tech-Front (Shanghai) Computer Co. Ltd.
Songjiang EPZ Shanghai, CN
|Tech-Front (Shanghai) Computer Co. Ltd. Patent applications|
|Patent application number||Title||Published|
|20140041903||PRINTED CIRCUIT BOARD STRUCTURE - A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.||02-13-2014|
|20120316264||METHOD OF MANUFACTURING ORGANIC MONTMORILLONITE - A method of manufacturing an organic montmorillonite is disclosed. The manufacturing method includes the steps hereinafter. A montmorillonite solution and an intercalation agent solution are prepared respectively. The montmorillonite solution and the intercalation agent solution are mixed at high temperature to form an organic montmorillonite solution. The organic montmorillonite is purified to obtain an organic montmorillonite solution.||12-13-2012|
|20110235297||Integrated circuit package component with lateral conductive pins - An integrated circuit package component with lateral conductive pins includes a package body having a middle conductive pin, an initial conductive pin and a final conductive pin. The middle conductive pin, the initial conductive pin and the final conductive pin are all disposed on a lateral side of the package body and respectively have a first soldering portion, a second soldering portion, and a third soldering portion, in which the middle conductive pin is arranged between the initial conductive pin and the final conductive pin, and an area of the middle conductive pin is smaller than that of the second soldering portion area and the third soldering portion in size.||09-29-2011|
|20110235296||Integrated circuit package component with ball conducting joints - The present invention relates to an integrated circuit package component with ball conducting joints, includes a substrate and a plurality of solder joints. The solder joints are installed on one surface of the substrate. The solder joints are arranged to form a concentric array having a first zone and a second zone, the second zone encircles the first zone. The soldering area of any solder joint in the first zone of the concentric array is smaller than that of any solder joint in the second zone of the concentric array.||09-29-2011|
|20110024173||Ball grid array printed circuit board, package structure, and fabricating method thereof - A BGA (ball grid array) printed circuit board is disclosed, which includes a substrate having a dielectric layer, a BGA pad and a solder mask formed on the dielectric layer, and an adhesive glue filled in a gap between the BGA pad and the solder mask. A BGA printed circuit board package structure and a method for fabricating the BGA printed circuit board are also disclosed.||02-03-2011|
Patent applications by Tech-Front (Shanghai) Computer Co. Ltd.