TAWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
TAWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent applications | ||
Patent application number | Title | Published |
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20120132921 | REDUCING WAFER DISTORTION THROUGH A HIGH CTE LAYER - Provided is a method of fabricating a semiconductor device. The method includes providing a silicon substrate having opposite first and second sides. At least one of the first and second sides includes a silicon ( | 05-31-2012 |