TANAKA DENSHI KOGYO K.K.
|TANAKA DENSHI KOGYO K.K. Patent applications|
|Patent application number||Title||Published|
|20140302317||BONDING WIRE FOR HIGH-SPEED SIGNAL LINE - An object is to provide a bonding wire for a high-speed signal line, formed by an Ag—Pd—Pt three-element alloy or an Ag—Pd—Pt ternary alloy, that is able to transmit a stable super-high frequency signal in a several GHz band, and that does not have a strong silver sulfide (Ag||10-09-2014|
|20130164559||ALUMINUM RIBBON FOR ULTRASONIC BONDING - [Problem to be Solved]The invention providesa bonding ribbon which can guarantee a uniform fusing over the entire joint area throughout hundreds of thousands of continuous ultrasonic bonding cycles and which can realize an improved bonding strength and which also can avoid being broken while it is looped.||06-27-2013|
|20120312428||HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIRE - To acquire the best combination of elongation and break strength on the Au alloy bonding wire. Adding 0.5-30 wt % of at least one element among Cu, Ag, Pd and Pt to high purity Au, a flat area about elongation ratio change appears between the range of 450-650° C. of heat-treatment temperature at wire drawing. Though the wire strength becomes decrease at this range of temperature, the strength is maintained at higher level against the heat treatment temperature of a standard elongation ratio of 4% of high purity Au alloy wire. Therefore, by the heat treatment of this flat range, Au alloy bonding wire, which has certain level of strength regardless of the temperature change, is acquired. Moreover, by selecting appropriate temperature range, different strength characteristics wires corresponding to the elongation ratio are acquired.||12-13-2012|
|20120263624||Ag-Au-Pd TERNARY ALLOY BONDING WIRE - An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag||10-18-2012|
|20110236697||ALUMINUM FOR ULTRASONIC BONDING - [Issues to be Solved] To provide an aluminum ribbon for ultrasonic bonding, is able to realize the high bonding strength and is able to maintain defined level of bonding strength, during several ten thousand bonding cycles.||09-29-2011|
|20100226816||GOLD ALLOY WIRE FOR BALL BONDING - There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).||09-09-2010|
|20100171222||HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME - [Issues to be Solved] Providing enhanced bonding reliability of Au alloy bonding wire with low electrical resistivity to Al electrode of semiconductor device, and its application of semiconductor device is bonded with Al electrode pad by the same wire.||07-08-2010|
|20090120665||GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS AND HIGH RESIN FLOWABILITY RESISTANCE - There is provided a gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.||05-14-2009|
|20090101695||GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, AND HIGH RESIN FLOWABILITY RESISTANCE - There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.||04-23-2009|
Patent applications by TANAKA DENSHI KOGYO K.K.