TANAKA DENSHI KOGYO K. K.

Patent application number	Title	Published
TANAKA DENSHI KOGYO K. K. Patent applications
20110058979	BONDING WIRE - [Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved.	03-10-2011
20100314156	AU ALLOY WIRE FOR BALL BONDING - [Issues to be Solved] To provide Au alloy wire for ball bonding, which is superior in wire strength, and also is superior in formability of molten ball and roundness of compressed ball. Moreover it is superior at stitch bondability, and is available for high density wiring of semiconductor devices.	12-16-2010