| TAIYO INK MFG. CO., LTD., Patent applications |
| Patent application number | Title | Published |
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| 20130085208 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. | 04-04-2013 |
| 20130081864 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention provides a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. | 04-04-2013 |
| 20130081858 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention relates to a photosensitive resin composition in which a cured film obtained therefrom has good resistance to electroless gold plating and occurrence of whitening phenomenon in a solder leveling process (pre-soldering process) and an electroless gold plating process is inhibited; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. | 04-04-2013 |
| 20120056950 | METHOD FOR PRODUCING LIQUID EJECTING RECORDING HEAD - A liquid ejecting recording head using a flow duct material which includes an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator. | 03-08-2012 |
| 20100249279 | THERMALLY CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF - A thermally curable resin composition includes a linear thermally curable resin and amorphous silica fine particles having pore portions. | 09-30-2010 |
| 20090314532 | THERMOSETTING RESIN COMPOSITION, DRY FILM INCLUDING THERMOSETTING RESIN COMPOSITION, AND MULTILAYER PRINTED WIRING BOARD INCLUDING THERMOSETTING RESIN COMPOSITION - A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2. | 12-24-2009 |
| 20090308642 | THERMOSETTING RESIN COMPOSITION - A thermosetting resin composition contains, as essential components, (A) an epoxy resin having at least two epoxy groups in its molecule, (B) a thermoplastic polyhydroxy polyether resin having a fluorene skeleton, (C) an epoxy curing agent, and (D) a filler. A dry film is obtained by forming a thin film of the thermosetting resin composition on a supporting base film, and a prepreg is obtained by coating and/or impregnating a sheet-like fibrous base material with the thermosetting resin composition. Since they exhibit excellent adhesiveness to a substrate or a conductor and a cured film of the thermosetting resin composition has a relatively low thermal expansion coefficient and a high glass transition point and exhibits high resistance to heat and the capability of being roughened by a roughening treatment, they are useful as a resin insulating layer of a multilayer printed circuit board. | 12-17-2009 |
| 20090306243 | COMPOSITION FOR FORMING CURED FILM PATTERN AND METHOD FOR PRODUCING CURED FILM PATTERN BY USING THE SAME - A composition for forming a cured film pattern comprises a combination of: an alkaline developable photocurable and thermosetting composition containing no thermal curing catalyst; and a developing solution comprising an aqueous solution of a basic curing catalyst of a nitrogen-containing heterocyclic compound for promoting a thermosetting reaction so that it has a long pot-life (useful life) after mixing of a main agent and a hardener or has excellent storage stability as a one-package composition. Preferably, the basic curing catalyst is a heterocyclic compound having an amidine structure. A film of the photocurable and thermosetting composition is selectively exposed to an actinic energy ray and then developed with the developing solution to remove an unexposed area of the film. At this time, the basic curing catalyst penetrates into the photocured film to effect doping. As a result, the film becomes excellent in thermosetting properties besides the patterning properties by development. | 12-10-2009 |
| 20090141505 | WHITE HEAT-HARDENING RESIN COMPOSITION, HARDENED MATERIAL, PRINTED-WIRING BOARD AND REFLECTION BOARD FOR LIGHT EMITTING DEVICE - A white heat-hardening resin composition includes rutile-type titanium oxide and a heat-hardening resin. | 06-04-2009 |
| 20090141504 | WHITE HARDENING RESIN COMPOSITION, HARDENED MATERIAL, PRINTED-WIRING BOARD AND REFLECTION BOARD FOR LIGHT EMITTING DEVICE - A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method. | 06-04-2009 |
| 20090035591 | FLEXIBLE LAMINATE HAVING THERMOPLASTIC POLYIMIDE LAYER AND METHOD FOR MANUFACTURING THE SAME - In a flexible laminate containing a metal foil layer/a thermoplastic polyimide layer or/and a conductor circuit layer/a thermoplastic polyimide layer, the metal foil layer or the conductor circuit layer is bonded to at least one side of the thermoplastic polyimide layer. The thermoplastic polyimide layer is formed from a thermoplastic polyimide resin film or sheet produced by melt extrusion of a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is formed from a biaxially oriented thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily manufactured by a lamination method which comprises bonding a thermoplastic polyimide resin film ( | 02-05-2009 |
| 20080271912 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Provided is a printed circuit board which can be improved in plating adhesiveness to give high reliability and productivity by reducing development residues in opening portions such as a minute pad formed in a predetermined region of an alkali development type solder resist layer, and a manufacturing method thereof. An alkali development type solder resist layer containing a carboxyl group-containing urethane (meth)acrylate compound as a carboxyl group-containing resin is formed on a substrate surface with a conductor pattern formed thereon, and the alkali development type solder resist layer is exposed in a predetermined opening pattern, developed in a dilute aqueous alkaline solution, washed with water containing 30 to 1,000 ppm of divalent metal ions, and then thermally cured to form an opening portion at a predetermined position of the alkali development type solder resist layer. | 11-06-2008 |
