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Taiyo Ink Manufacturing Co., Ltd.
| Taiyo Ink Manufacturing Co., Ltd. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080227883 | Photocurable and thermosetting resin composition and printed circuit boards made by using the same - A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts. | 09-18-2008 |